TW227084B - - Google Patents
Info
- Publication number
- TW227084B TW227084B TW082101322A TW82101322A TW227084B TW 227084 B TW227084 B TW 227084B TW 082101322 A TW082101322 A TW 082101322A TW 82101322 A TW82101322 A TW 82101322A TW 227084 B TW227084 B TW 227084B
- Authority
- TW
- Taiwan
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3686792 | 1992-02-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW227084B true TW227084B (zh) | 1994-07-21 |
Family
ID=12481737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW082101322A TW227084B (zh) | 1992-02-25 | 1993-02-24 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5445698A (zh) |
JP (1) | JP2721632B2 (zh) |
CN (1) | CN1026647C (zh) |
GB (1) | GB2264457B (zh) |
TW (1) | TW227084B (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5802714A (en) * | 1994-07-19 | 1998-09-08 | Hitachi, Ltd. | Method of finishing a printed wiring board with a soft etching solution and a preserving treatment or a solder-leveling treatment |
US5885436A (en) * | 1997-08-06 | 1999-03-23 | Gould Electronics Inc. | Adhesion enhancement for metal foil |
US6086743A (en) * | 1997-08-06 | 2000-07-11 | Gould Electronics, Inc. | Adhesion enhancement for metal foil |
US6555170B2 (en) | 1998-01-30 | 2003-04-29 | Duratech Industries, Inc. | Pre-plate treating system |
US6174561B1 (en) | 1998-01-30 | 2001-01-16 | James M. Taylor | Composition and method for priming substrate materials |
JP4727194B2 (ja) * | 2004-09-14 | 2011-07-20 | 富士通株式会社 | 回路基板 |
JP5034059B2 (ja) | 2009-03-19 | 2012-09-26 | メック株式会社 | 積層体の形成方法 |
EP2697826A4 (en) * | 2011-04-12 | 2014-10-22 | Asia Union Electronic Chemical Corp | APPLICATION OF SILICON OXIDE FILMS AT LOW TEMPERATURES |
CN103103513B (zh) * | 2013-01-11 | 2015-07-15 | 东南大学 | 一种铜网或泡沫铜防油抗氧化的浸泡处理方法 |
CN105799242A (zh) * | 2014-12-31 | 2016-07-27 | 比亚迪股份有限公司 | 金属树脂复合体及其制备方法 |
KR101795480B1 (ko) * | 2015-04-06 | 2017-11-10 | 코닝정밀소재 주식회사 | 집적회로 패키지용 기판 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3644166A (en) * | 1968-03-28 | 1972-02-22 | Westinghouse Electric Corp | Oxide-free multilayer copper clad laminate |
US3984598A (en) * | 1974-02-08 | 1976-10-05 | Universal Oil Products Company | Metal-clad laminates |
JPS61176192A (ja) * | 1985-01-31 | 1986-08-07 | 株式会社日立製作所 | 銅と樹脂との接着方法 |
EP0310010B1 (en) * | 1987-10-01 | 1994-01-12 | Mcgean-Rohco, Inc. | Multilayer printed circuit board formation |
US4910077A (en) * | 1988-08-04 | 1990-03-20 | B.F. Goodrich Company | Polynorbornene laminates and method of making the same |
US4923678A (en) * | 1989-02-14 | 1990-05-08 | The B. F. Goodrich Company | Low dielectric constant prepreg based on blends of polynorbornene and polyolefins derived form C2 -C4 monomers |
US4902556A (en) * | 1989-01-27 | 1990-02-20 | The B. F. Goodrich Company | Multi-layer polynorbornene and epoxy laminates and process for making the same |
JPH02308593A (ja) * | 1989-05-23 | 1990-12-21 | Mitsubishi Electric Corp | エポキシ樹脂銅張積層板 |
JPH02308595A (ja) * | 1989-05-23 | 1990-12-21 | Mitsubishi Electric Corp | エポキシ樹脂多層銅張積層板 |
JPH02308596A (ja) * | 1989-05-23 | 1990-12-21 | Mitsubishi Electric Corp | エポキシ樹脂多層銅張積層板 |
JPH02308592A (ja) * | 1989-05-23 | 1990-12-21 | Mitsubishi Electric Corp | エポキシ樹脂銅張積層板 |
JPH07120564B2 (ja) * | 1989-10-02 | 1995-12-20 | 日本電解株式会社 | 抵抗層付導電材料及び抵抗層付プリント回路基板 |
US5190808A (en) * | 1989-11-22 | 1993-03-02 | B. F. Goodrich Company | Prepreg comprising saturated or unsaturated silane substituted cyclic group |
US5261154A (en) * | 1991-07-22 | 1993-11-16 | Macdermid, Incorporated | Process for fabricating multilayer printed circuits |
JP3413633B2 (ja) * | 1996-11-22 | 2003-06-03 | エスジーシー下水道センター株式会社 | 管内面補修装置 |
-
1993
- 1993-02-15 JP JP5025044A patent/JP2721632B2/ja not_active Expired - Lifetime
- 1993-02-24 US US08/022,027 patent/US5445698A/en not_active Expired - Lifetime
- 1993-02-24 TW TW082101322A patent/TW227084B/zh active
- 1993-02-24 GB GB9303726A patent/GB2264457B/en not_active Expired - Fee Related
- 1993-02-25 CN CN93102187.1A patent/CN1026647C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2264457A (en) | 1993-09-01 |
CN1026647C (zh) | 1994-11-16 |
CN1078088A (zh) | 1993-11-03 |
JP2721632B2 (ja) | 1998-03-04 |
GB2264457B (en) | 1996-09-04 |
JPH05304361A (ja) | 1993-11-16 |
GB9303726D0 (en) | 1993-04-14 |
US5445698A (en) | 1995-08-29 |