TW214631B - - Google Patents

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Publication number
TW214631B
TW214631B TW081102783A TW81102783A TW214631B TW 214631 B TW214631 B TW 214631B TW 081102783 A TW081102783 A TW 081102783A TW 81102783 A TW81102783 A TW 81102783A TW 214631 B TW214631 B TW 214631B
Authority
TW
Taiwan
Prior art keywords
leads
aforementioned
lead
patent application
signal
Prior art date
Application number
TW081102783A
Other languages
English (en)
Chinese (zh)
Original Assignee
American Telephone & Telegraph
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone & Telegraph filed Critical American Telephone & Telegraph
Application granted granted Critical
Publication of TW214631B publication Critical patent/TW214631B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/206—Wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Logic Circuits (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
TW081102783A 1992-02-25 1992-04-10 TW214631B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US84113992A 1992-02-25 1992-02-25

Publications (1)

Publication Number Publication Date
TW214631B true TW214631B (https=) 1993-10-11

Family

ID=25284121

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081102783A TW214631B (https=) 1992-02-25 1992-04-10

Country Status (6)

Country Link
US (1) US5329170A (https=)
EP (1) EP0558226B1 (https=)
JP (1) JP2591576B2 (https=)
KR (1) KR100260664B1 (https=)
DE (1) DE69330411T2 (https=)
TW (1) TW214631B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5761049A (en) * 1994-09-19 1998-06-02 Hitachi, Ltd. Inductance cancelled condenser implemented apparatus
US6452442B1 (en) 1995-12-04 2002-09-17 Intel Corporation Apparatus for obtaining noise immunity in electrical circuits
DE19927285C2 (de) 1999-06-15 2003-05-22 Eupec Gmbh & Co Kg Niederinduktives Halbleiterbauelement
TW200501580A (en) * 2003-06-23 2005-01-01 Mitac Technology Corp Offset circuit for constraining electromagnetic interference and operation method thereof
CA2915900C (en) * 2013-07-03 2020-01-21 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Die package with low electromagnetic interference interconnection

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3383618A (en) * 1966-03-10 1968-05-14 Bell Telephone Labor Inc Suppression of intermodulation distortion
US3584235A (en) * 1968-10-18 1971-06-08 Bell Telephone Labor Inc Video defect eliminator
US4398106A (en) * 1980-12-19 1983-08-09 International Business Machines Corporation On-chip Delta-I noise clamping circuit
DE3787137T2 (de) * 1986-02-07 1993-12-09 Fujitsu Ltd Halbleiteranordnung.
US4816984A (en) * 1987-02-06 1989-03-28 Siemens Aktiengesellschaft Bridge arm with transistors and recovery diodes
US5006820A (en) * 1989-07-03 1991-04-09 Motorola, Inc. Low reflection input configuration for integrated circuit packages

Also Published As

Publication number Publication date
KR100260664B1 (ko) 2000-07-01
KR930018710A (ko) 1993-09-22
EP0558226A3 (https=) 1994-03-23
JPH0613421A (ja) 1994-01-21
DE69330411D1 (de) 2001-08-16
DE69330411T2 (de) 2002-05-29
EP0558226B1 (en) 2001-07-11
EP0558226A2 (en) 1993-09-01
JP2591576B2 (ja) 1997-03-19
US5329170A (en) 1994-07-12

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