TW212769B - - Google Patents
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- Publication number
- TW212769B TW212769B TW081104230A TW81104230A TW212769B TW 212769 B TW212769 B TW 212769B TW 081104230 A TW081104230 A TW 081104230A TW 81104230 A TW81104230 A TW 81104230A TW 212769 B TW212769 B TW 212769B
- Authority
- TW
- Taiwan
- Prior art keywords
- fan
- flux
- item
- application
- lead
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
212769 五、發明説明(I ) 丨包關中請之前後來菔 本申請為删年1〇月31日提出申請之第〇7肌2〇〇就常 丨之追加申請,又因為199〇年5月n je 月15日提出申請之第07/523, 就案之追加申請。兩种申請案皆以…T_r之名提 出申請,並讓與和本申請相同之受 H. α 又文讓人。这些申請揭示並 提請一使用一水溶性助嫁則之輝接方法,助堵則包含一至 少具有兩…之水溶性有機歧。此種有機跋之一校佳實 例為禆橡睃。 本申請亦與第〇_,041和第〇7肩,199力申請案有關” 兩案皆於麵4 Μ 31日提出,並讓與和本中請相同之受: 讓人。前面-案揭示並提請一用做輝料糊之物贫組合物以 及-使用隸組合物之方法"支面一案揭示並提請一用做央 心样料助炫則之物質姐合以及一使用該組合物之方法。 技術领域 本發明有關於一新顆之水溶性、無害環境之夾心垾料 用助炫則,主要使用於電子工業蛘接過程中。 背景技柢 經 濟 部 屮 央 準 J、b 工 消 合 社 印 31 工業界製造電子電路如軍用硬散所用大多數之助熔性 和除助熔剡化學品不是助成大氣層之臭氣耗码,就是被當 地環保機構如洛杉磯盆地中之空氣品質管理區视爲環境泠 染物或健康危害物。舉例而言,曾有報告指出,氟氣烴( 用於蒸汽除脂中以清理用松脂助熔則之垾接部分)若釋放 至大氟中,它們將會停留在大氟中成為臭氟牦竭物長達將 近100年。其他化學品如松脂助熔剞、酒精和相似物會給 81. 6, 10,000¾ (H) 木紙5艮尺度逍用·丨,W W家標1公从) -3 - 2ΐ5ώ769 Λ (\ 經濟掬屮央^^^0工消^::合作社印5i 五 、發明説明 (i ) η f) 工 黹 界 帶 來 健 康 危 窖 和 處 理 η 题 〇 保 夾 心 在 埤 料 用 水 溶 性 助 熔 則 其 形 式 A 將 e—* 坪 料 助 熔 則 與 _ 一 持 -'1 中 空 垾 料 管 内 之 濃 化 則 結 合 而 成 〇 烊 業 界 需 者 為 — 簡 早 無 毒 \ 不 腐 蝕 \ 無 害 環 境 之 夾 心 優 料 用 烊 料 助 熔 則 9 此 助 熔 則 可 造 成 具 高 度 金 屬 光 澤 及 良 品 t 之 埤 接 點 〇 發 明 說 明 根 據 本 發 明 所 提 供 者 —* 由 擰 棟 睃 組 成 之 夹 心 垾 料 用 水 溶 性 助 熔 則 0 棹 棟 晈 與 中 空 垾 料 柱 共 同 祷 出 νλ 形 成 組 合 夾 心 焊 料 0 -* 本 發 明 之 助 熔 剂 消 除 了 有 窖 環 境 之 物 質 排 放 此 排 放 通 常 與 νλ 松 腊 為 主 之 助 熔 則 9 助 熔 則 稀 释 則 ( 如 異 丙 醇 ) 及 相 連 之 除 助 熔 剌 溶 則 (如 氟 氯 烴 ) 等 相 閼 連 0 本 發 明 之 助 熔 則 無 害 於 環 境 \ 無 毒 \ 並 易 於 使 用 0 經 蜉 接 之 總 成 可 於 去 離 子 水 中 清 洗 , 因 此 消 除 了 使 用 蒸 汽 除 赌 設 備 所 需 之 高 資 本 〇 實 施 本 發 明 之 最 佳 棋 式 本 發 明 之 助 熔 則 由 椁 棟 歧 組 成 0 撺 棟 睃 具 有 約 攝 氏149 度 之 熔 點 〇 本 發 明 者 發 現 擰 檬 酸 在 液 魅 時 可 與 任 何 _ _ 種 習 用 之 νλ 踢 爲 主 之 烊 料 共 同 擠 出 Ο 禆 橡 睃 额 粒 或 晶 体 在 一 不鍺鋼 容 器 中 加 熱 成 為 液 態 ( 約 149 度 ) 0 經 加 熱 之 液 態 檸 棟 1入一 ‘加 受 .彩 ί < .擠 磬 桶 0 當 實 心 烊 料 綠 受 擠 m 進 入 中 空 夾 心 線 時 t 液 態 檸 橡 皎 便 饋 入 擠 m 室 9 後 再 進 入 核 心 〇 桶 内 之 空 氣 壓 力 最 線- k-. 本紙张尺度边汛中Sffl家榀準(CNS)ifH規格(2】0χ29/公及) 81. 6.】0,000張(Η) 4 212769
五、發明説明_ (3) »、調整W確保核心內無空味 助橡則之缚線再總在線抽上……尼充滿 伍猓釉上,加標纪,並包裝以待用。 属之洛!:何特定理論之起可,似乎是轉橡歧與主成分金 之 鉗合。結果,主成分金屬根少或沒有受本發明 <助熔剌使蝕。 轉棟歧之等級在本發明之贵施中不是㈣要的。然而 度敏感之電路而言,可能需要使用非常高等級之梓棟 暖。 他成分,如雜質(無論是無意或有意 添加物狗輝接結果没有反效果便可。 Μ錫為主之垾料皆可使用,包括6〇/4〇 ,63/37錫/鉛,及96/4錫/銀。通常使用 Ο 料最利於使用在表面裝置及穿孔装置 經r"'部屮央捣準杓只工消奸合作社印奴 助熔則可色含其 加入的),只要此種 任何一種背用之 鎢/鉛,62/2/36辑/銀/鉛 60/40和63/37蜴/鉛垾料 助熔刻/央心垾 配件之垾接遇程中。 助熔則沒有包括 蒸發性溶則。本發明 心垾料,此埤料使得 發明之助熔則則使用 本發明之助熔剞 1 .它消除有睿環 心助熔則、助熔則稀 則(1,1,1,-三氣ϋ垸 僅在溫或熱水中即可 (請先間讀背而之注急事項#艰寫木R) 揮發行有機化合物或其他如異丙醇之 之水溶性坪料助熔則遴免使用松脂夾 氟氯蛵裡之除助熔則之使用必須。本 去離子水便可容易地將其去除。 提供下列優點: 境之物質排放,此排放通常與相脂夾 释則(如異丙坏)、及相連之除助炫 )等相關。確實不錯,助熔則之清洗 完成〇因此,此新助熔則無害於環境 本紙張尺度边用中fflffl家榣JMCNS)T4AjiW(2Hlx2(J7公仗) 81. 6. 10,000¾ (H) Λ G Η 6 212769 五、發明説明(冬) 0 2.它提供—無毒、極度安全且高度有效之助熔則/夾心 垾料給焊接人員使用。 3 ·與松腊夹心埤料相比,使用它能提供優良墁性及蝉 接缺陷減少估計約80¾給較具光澤之烊接點。 工業用途 本發明之助熔則/央心垾料預期在商常焊接楝作上有 用途’尤其在垾接電路板上之電性配件上有用。 實施例 --- « 五位裝配人员f進行一項手垾接操作,以比較使用軍-用规格相脂助熔剤之垾料線和使用擰樣睃之央心埤料線。 總共完成280個埤接黠。这些蛘接點牽連雙排包裝之接腳 播入印刷線板上穿速金屬薄層之孔。在雙排包裝配件安裝 後,每一裝配员使用兩種助熔則央心坏料進行輝接/助炫 則之比较。評估完後,五位装配B聯合做出結綸,結論爲 由檸棟政組成之绊料線所產生之垾接點在品質及光澤上皆 較松腊夹心埤料所產生者為優。兩種垾料綠皆具相同之焊 料成分,踢63 /鉛37。 溶業所發 水。而本 、 件,之 境配造定 環性改界 害t及所 無接變因 、垾改範 蝕於知請 縻用易申 不道而下 、剂顆^ 毒嫁質由 y 無助本於 一此種落 示,各為 揭則做视 已熔可造 上助顒改 以用明及 , 料 士變。 是焊人改内 由心練種嘈 夹熟此範 性界有明 經濟邶屮火谣革沁只工π奸合作社印rt'14 81. 6. 10,000張(H) 本紙张K度边用十明明家榫半(CNS)T4规怙(210x297公徒)
Claims (1)
- JU 中請專利範圓 1 .-^L 空處以}炫 2 ·如申 _料本質上 3 ·如申 坪料本質上4飞接 夾心坪料佈 要之垾接溫 合夾心 則裝填 請專利 由一 w 請專利 由一锡 一金屬 施至該 度&、其 ψ) 5 .如申請專利 上由一以鎮爲主之 6 .如申請專利 上由一頌-錄輝料 埤料, ,所迷 範面第 踢為主 範園第 -鉛埤 之方法 金屬一 特徹A 範園第 垾料組 範因第 組成。 由一中 助熔則 1項之 之垾料 2項之 料組成 ,此法 表面上 所述垾 4項之 成。 5項之 a 空蟬枓昶 由梓株旅 助熔剩讲 组成0 助熔釗站· 0 包含將〆 ,妓加热 接助熔剡 方法,其 枝 0- 讲成’所.述中 成0 舍物,其中所述 物,”其中所述 食者助熔則之一所述金屬至一需 由撺棟睃組成<? 中所述埤料本質 方法,其中所迷埤料本 f (讣先W請背而之注龙事項存唭筇本頁) Μ濟部十央標準局只工消许·合作社印^ 本紙張尺度適用中B«家標唞(CNS)T4現格(210X297公;¢)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/708,961 US5192360A (en) | 1990-05-15 | 1991-05-31 | Water-soluble flux for cored solder |
Publications (1)
Publication Number | Publication Date |
---|---|
TW212769B true TW212769B (zh) | 1993-09-11 |
Family
ID=24847898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW081104230A TW212769B (zh) | 1991-05-31 | 1992-05-29 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5192360A (zh) |
EP (1) | EP0516482A1 (zh) |
JP (1) | JPH05146890A (zh) |
KR (1) | KR920021254A (zh) |
MX (1) | MX9202574A (zh) |
TW (1) | TW212769B (zh) |
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US4759490A (en) * | 1986-10-23 | 1988-07-26 | Fujitsu Limited | Method for soldering electronic components onto a printed wiring board using a solder paste |
US4738732A (en) * | 1987-02-04 | 1988-04-19 | Hughes Aircraft Co. | Self cleaning liquid solder flux |
EP0398871B1 (de) * | 1988-01-12 | 1992-09-23 | KERNER, Rudolf A. | Verfahren zur herstellung von elektronischen komponenten unter verwendung eines weichlötflussmittels auf carbonsäurebasis |
US4821948A (en) * | 1988-04-06 | 1989-04-18 | American Telephone And Telegraph Company | Method and apparatus for applying flux to a substrate |
US4872928A (en) * | 1988-06-07 | 1989-10-10 | Johnson Matthey Inc. | Solder paste |
US4988395A (en) * | 1989-01-31 | 1991-01-29 | Senju Metal Industry Co., Ltd. | Water-soluble soldering flux and paste solder using the flux |
US4895606A (en) * | 1989-02-23 | 1990-01-23 | Ashraf Jafri | Formulations for soldering flux |
TW206936B (zh) * | 1990-10-31 | 1993-06-01 | Hughes Aircraft Co |
-
1991
- 1991-05-31 US US07/708,961 patent/US5192360A/en not_active Expired - Lifetime
-
1992
- 1992-05-29 TW TW081104230A patent/TW212769B/zh active
- 1992-05-29 MX MX9202574A patent/MX9202574A/es unknown
- 1992-05-29 EP EP92304969A patent/EP0516482A1/en not_active Withdrawn
- 1992-05-30 KR KR1019920009423A patent/KR920021254A/ko not_active Application Discontinuation
- 1992-06-01 JP JP4140754A patent/JPH05146890A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPH05146890A (ja) | 1993-06-15 |
MX9202574A (es) | 1992-11-01 |
EP0516482A1 (en) | 1992-12-02 |
US5192360A (en) | 1993-03-09 |
KR920021254A (ko) | 1992-12-18 |
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