TW205109B - - Google Patents

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Publication number
TW205109B
TW205109B TW080105361A TW80105361A TW205109B TW 205109 B TW205109 B TW 205109B TW 080105361 A TW080105361 A TW 080105361A TW 80105361 A TW80105361 A TW 80105361A TW 205109 B TW205109 B TW 205109B
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TW
Taiwan
Prior art keywords
equalization
signal
write
writing
transistor
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TW080105361A
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English (en)
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Samsung Electronics Co Ltd
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Publication of TW205109B publication Critical patent/TW205109B/zh

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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409Read-write [R-W] circuits 
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/12Bit line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, equalising circuits, for bit lines
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/4076Timing circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409Read-write [R-W] circuits 
    • G11C11/4094Bit-line management or control circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/41Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
    • G11C11/413Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction
    • G11C11/417Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction for memory cells of the field-effect type
    • G11C11/419Read-write [R-W] circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Dram (AREA)

Description

A6 B6 五、發明説明(I .) 本發明是有閼.一種半導記憶體裝置,尤指一種改進寫 入功能之動態隨機存取記憶裝置(DKAM)。 在動態R ΛΜ中,儲存於一由位址所選擇的記憶元的資 料,偽如同一位元線上的電®被載入,然而,一儲存在虛 設單元(DUMMY CELL)的電荷(或預先充電電壓)則被載入一 補償位元線,作為相對於位元線之一黎考電壓。而此位 元線與補償位元線之間的電麼差異,足以被感應放大器所 放大, 然後經由輸出/輸入線, 及一資料輸出緩衝器 (buffer)所讀出。除了上述譲的功能外,此DRAM尚且具有 寫入的功能,以便儲存資料於一由位址所選擇的記憶元中 。當寫入時,位元線的電位,是由資料輸入緩衝器所供給 的資料之電位所決定。這樣的讀/寫功能之動態RAM, 偽 為一般習知的技術,而圖1A,則顯示此種傅統DRAM的行電 路(COLUMN CIRCUIT)。 經濟部屮夾櫺·"局约工消"合作杜卬製 (請先Μ讀背面之注意事項再填寫本頁) .打:.( •綠_ 請參照圆丨1A及圖1B ,圖1A為行電路,而圖1B則係圖1 A 之操作時序圖(〔〕PERA-T IONAL TIM ING D 丨 AGRAMS)。當一個 行位址選通信號(COLUMN ADDRESS STROBE SINGNAL) RTiS: 被預先充電於”高”狀態時,一被連結於位準(1/2) Vcc上位 元線預充電電壓Vuu的位元線等化電路(EQUALIZATION CIRCUIT) 10, 等化一對位元線BL及EC,使進入 (1/2) Vcc的位準中,以反應一等化反應訊號EQ。另一方面 ,當RSS處於”低”狀態時,等化訊號EQ是被抑制的,而連 結於字元線WL的記憶元20,則被選擇。然後,儲存於記憶 元20的電荷,被放霜於位元線BL, Μ儲存於虛設單元(圆 上未示)的電Μ ,放電於補儍位元線BU(或維持在預充電位 本纸張尺度適用中Β Η家摆準(CNS) Τ4規格(2丨0x297公釐) k,〇5i〇3 A6 B6 炖濟郎屮*櫺:>|1-灼55工消赍合作杜卬製 五、發明說明(A ) 準)。因此,當一個包括兩個PMOS電晶體,及兩個NMOSM 晶體的感應放大器,偽依據感應時序脈衝(CLOCK PULSES) LA及CM作,而位元線BL及補償位元線KU的電壓差興,更 被放大。 此一放大資料K1, 是經由一反應行選擇訊號 (COLUMN SELECTION SIGNAL) CSL 同ΐ|區動之間(COLUMN GATE) 50,被傳送到一對輸入/輸出線10及Τϋ,該行選擇 訊號偽依行位址選通訊號ras而致能。這些輸入/輸出線 ,通常被等化到更高的位準,而此_-位準,比方説,可以 由源電壓Vcc藉M0S電晶體的臨界電壓(THRESHOLD VOLTAGE) 降低該位準偽比位元線之等化位鹚更高。在讀出資料R1後 ,位元線再一次被等化訊號EQ所等化。然後,當一個新的 唯讀資料K2,在類似的狀況下被讀出,而一寫入致能訊號 被促動時,該位元線對(pai r) BL及ITU的電位,偽根據外 部供給的寫入資料W所決定。一般,位元線對的電位差, 實質上是與源電壓位準⑼UKCE VOLTAGE LEVEL)同一的0 如果這些位元線經凼行閘50, 被逋結至輸出/輸入線, 而此行閘是被行選擇訊號CSL在”高”狀態下所打開, 則, 位元線BL及補償位元線BU的電位會被傳送。因此,直到 在輸入/輸出線上的輸入資料足夠被轉換到位元線上為止 ,一相當的傅送時間是必須的,也因而導致不必要的寫人 時間延緩。 當這些位元線的電位,如同習知技術一般,在讀X寫 過程中,具有源電壓位準一般的擺動寬度(SWING WIDTH) 時,雜訊魷會因應摇擺寬度而産生。又,在高横體記憶鞋 置中,長位元線的自阻(SELF-RESISTANCE)更高時,雜訊 本纸張尺度適用中Η Η家標準(CNS) T4規格(210X297公釐) {請先閱讀背面之注意事項再填寫本页) ,打·
T .線· A6 B6 L05i〇^ 五、發明說明(3 ) 的影響,也就會更增大。 {請先間锖背面之注意事項再琪坏本頁) 本發明之一目的,是提供-種電路,以減少半導體記 憶裝置的寫入時間。 本發明之另一目地,是提供一種電路,使在讀取功_ 後,寫入的功能更加的迅速而有效率。 .打:( 依據本發明之一特點,偽揭示一反應外部控制訊贼執 行_寫功能之半導體記憶裝置,其中包括:一對連結於記 憶元及一^對輸出/輸入線之中的位元線,以供讓寫過程中 傅送資料;一連結於接收一位準第化電颳的位元線之間的 寫入等化電路,而這些位元線偽被一寫入等化訊號所控制 該宜入等化訊號則偽決定於一宜入致能訊躺;一由一行選 擇訊號所控制的等化選擇電路,以供轉換等化訊躺,至寫 入等化電路;個別連結於輸入/輸出線及位元線之間的行 閜,偽由行選擇訊號所控制;及一接收行位址訊號及寫入 致®號(WRITE ENABLING S IGN AL) G 勺電 述構 成,以産生寫入等化訊號,因而,在寫入致能訊號開使被 促動之瞬間,等化訊號在一位準上被促動。 •線. 為更清楚了解本發明,並展現本發明是如何的翅作, 下述的圖式:,將作為範例被參考,其中: 圖1Λ係傅舖AM的行電路圖。 圖1B係圖1Λ的操作時序圖。 圆二是本發明-實施例之丨)R AM的行電路。 圖三偽本發明産生控制訊Μ之電路。 圖四係根據本發明之操作時序圖。 請參圖二,本發明行電路包括一等化電路1〇,記憶 本紙張&度適用中8®家標準(CNS)甲4規格(210x297公釐) ^0510^ A6 B6 敕漪郎屮央標f-局趵工消介合作杜卬災 五、發明說明(4 ) 元20,感應放大器30及行閘50,此電路型態傺對應圖1A所 示之傅統行電路圖。一具有NM0S爾晶體41, 42, 43之寫入 等化爾路40,被連結於位元線BL及補償位元線m[:之間。而 NMOS電晶體41, 42的通道被串連於對位元線對BL及UU •之間,見相關的鬧極被連結於節點100。霜晶體41與42通 道之連結處,偽供以l/2Vcc位準之電壓私,NMOS電晶體 43之通道係連接於位元線BL與UU之間,電晶體43之閘極則 連結至節點100。此連結電晶體41, 42, 43闕極的節點 100, 被迪結後,經由一等化選擇NM0S電晶體60,至寫入 等化訊號EQW。一行選擇訊號CSL被供給至選擇NM0S的電晶 體60及行閘50之閘極。而此選擇NM0S電晶體C50致使寫入 等化訊躺EQW,在執行寫入功能之前,先施予節點100。因 此,等化位元線,以至等化電壓Vbu。而寫入等化訊號 EQW,是依應於寫入致能訊號OT:, 以及行位址選通訊娜 d 請黎圖3A及3B,其圖示了産生寫入等化訊贼EQW及時 摩脈衝4 1的關電路。 而時序脈衝4 1是藉凼一 N 0 R閘 及反閘32及33所産生。其中N0R閘,偽供接收行位址選通 訊號CAS·及寫入致能訊贼WE,而反閜32及33則自N0R_,形 成訊號輸出,一如圆3A所示。而由圖3B可見,甶反閲34, 35, 3(3及一NAMD關37所調整脈衝寬度(PULSE WIDTH)之時 序^脈衝4 1, 如同寫入等化訊號t:QW被傅送經過反閘38。 其中,圖3 A及圖3 B的閲電路,可由不同的方式構成。圖4 ,則圖示本發明之操作時序圖。 下文中,將參照圖二至圖四,描述依據本發明之寫入 {請先閱靖背面之注意事項再填寫本頁) .装. •ir. •線· 本纸Λ尺度適用fHH家標準(CNS)甲4規格(210x297公釐)
A6 B6 •經濟部中央標率局員工消費合作社印焚 五、發明説明(5 ) · (82年3月修正) 程序。 如果行位址選通訊號C7^及寫入致能訊號ΪΤΕΓ,如圖四 顯示在”低”狀態下促動,時序脈衝0 1被産生於”高”狀 態下,如圖3A所示。則脈衝寬度更窄的寫入等化訊號EQW, 將被施於選擇電晶體60的通道。從行選擇訊號CSL被促動 後,選擇電晶體60及行閘50將同時被開啓。當寫入等化訊 號EQW在”高”狀態下時,字元線將被已開啓的寫入等化霄 路40的NM0S電晶體41,42, 43,等化至等化電歷VBL , 其為(l/2)Vcc。之後,如寫入等化訊號EQW變成”低”0狀 態下,節點1〇〇將放電,以至於關閉寫入等化電路4〇的m 晶體41, 42, 43,且根據被載於輸入,輸出線上的輸入資 料電位以分配(Spilt)位元線的電位,從而轉換寫入資料 至選擇的記憶元。 雖然,在本發明此實施例中》NM0S電晶賭被作為選擇 電晶體使用,然而,其它種類的半導體裝置,亦可在本發 明技術範圍内被使用。根據本發明此一齊施例,在4伏特 /^❶”的情況下,寫入操作的時間,從使用傳統裝置的 11〜12 1〇_9秒,減少到6〜7 1〇_9秒。 如上所述,依據本發明的裝置,在執行讀取功能後, 可快速的等化位元線,及寫入輸入資料,因而可減少寫入 時間,並可避免彳&元線的雜訊産生。 當本發明依上所示之較佳具體實施例,被待定的說明 及圖示時,對於熟悉此項技越人士而言,在不货離本發明 範圍及精神之下,是可進行細節的修改。 本纸张又度適用中國國家標準(CNS)甲4規格(210 x 297公釐) (請先閱讀背面之注意事項再塥寫本頁) t -* r

Claims (1)

  1. 和Γ' ^03109 A7 B7 C7 __D7_— 六,中旃專則範ffl 一. 一種反應外部控制訊Μ , 可讀寫之半導體記憾裝置, 其包括: 一對連結於記憶元及-對輸入/輸出線之間的位 元線,用以在黷寫時,傅送資料; 可控制的寫入等化機構,其反廳一依於簿入致能 訊號之寫入等化訊號,且此一寫入等化機構,連結於 可接收在一位準下之等化電壓的位元線之間; 等化選擇機構,其轉換寫入等化訊號至寫入等化 機構,且此等化選擇機構,偽被控制對行選擇訊號作 反·; 行闹機構,其迪結於輸入/輸出線及位元線之間 ,且此行問機構,像被控制對行選擇訊號作反應; 産生機構,接收行位址訊號及寫入致能訊號,以 産也寫入等化訊躺;因此,該寫入等化訊號會在寫入 致能訊號開始促動的瞬間,先被促動於一段預設的_ 間内。 經濟部十央標>ll->u,w工消许合作社·2-¾. (功先W請背而之注意事頊再填辉本页 •綠. 二. 如請求專利範圍第一項之半導體記憶裝置,其中,等 化選擇機構,包含一絶緣關場效電晶體;該電晶體通 道之第-端,連結於寫入等化訊Μ,第二端速結於寫 入等化機構,而電晶體之閲極,則被連結於行選櫸訊 號。 三. 如誚求專利範圍第一項或第zi項之半導體記憶裝置, 其中,寫入等化機構包含第-、第二及第Ξ金氣半導 體雷晶體,第--及第二MOS電晶體的通道,被串接於 位元線之間,且此二MOS電晶體的通道連結點,形成 本紙張尺度適用中因因家榇準(CNS)T4規格(210X297公釐) 經浒部十火櫺-f-Aw工消赀八"作社.M'si A7 ^ ^ 1 [. r\ B7 上 M C7 ____D7_ 六、巾2/f專利他II) -節點,而等化電壓即施於此;第一至第三MOS電晶 體的鬧極,則共同連結於該絶線閘場效電晶體通道的 第二端。 四. 如請求專利範圍第一項之平導體記憶裝置,其中,趣 生機構,包含至少一個邏輯閘,此邏輯閜具有第一輸 入端,得免用繼電^器而得輸入訊號,及第二輸入端, 其使用繼電器而得在预設時間接收訊號。 五. 一半導體記憶裝置,得經由一對位元線,而傳送外部 輸入資料,至一趣擇的記億元,其包括: --個第一及第二NM0S電晶體,其具有串接於位元 線之間的通道,以及相互連結的閘極,一位準之等化 電壓施於通遒連結點; -共同連結於第一及第二N M0IS電晶體_極之間的 節點; 一第ZrlNMOS電晶體,其具有-迎結於寫入等化訊 臟的第一通道端,及一連結於上述節點的第二通道端 ,還有-·連結於行列選擇訊號的關極。 六. 如請求專利範圍第五項之半導體記憶裝置,其尚旦包 含-NM0S電晶體,此電晶體具有一連於位元線及閘極 之間的通遒,該關極像迪接至上述節點。 ir.如請求專利範豳第五項之平導體記憶裝置,其中,行 選擇訊號控制行閘極機構,而此機構被連結於位元線 及:輸入/輸出線之間。 八.如請求專利範圔第五項之半導酿記憶裝置,其中,寫 入等化訊破,會在寫入致能訊號開始促動的瞬間,被 促動於-段預設的時間内。 冬紙張尺度適ffl中因a家梂準(CNS)T4規格(210X297公;S) (請先閑請背而之注意事項再填对本页 k. ir·
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JP3358030B2 (ja) * 1993-01-22 2002-12-16 日本テキサス・インスツルメンツ株式会社 半導体メモリ装置及びその初期化方法
JP3088232B2 (ja) * 1994-01-11 2000-09-18 沖電気工業株式会社 半導体記憶回路
US5673219A (en) * 1996-03-21 1997-09-30 Texas Instruments Incorporated Apparatus and method for reducing leakage current in a dynamic random access memory
KR100297708B1 (ko) * 1997-11-17 2001-08-07 윤종용 클락동기프리차아지데이터입출력선을가지는반도체메모리장치및이를이용한데이터입출력선프리차아지방법
KR20030037263A (ko) * 2000-07-07 2003-05-12 모사이드 테크놀로지스 인코포레이티드 한 쌍의 신호라인 사이에서 신호 등화를 가속화하는 방법및 장치

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KR940007000B1 (ko) 1994-08-03
JPH04345988A (ja) 1992-12-01
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DE4124421C2 (de) 1994-12-22
US5247482A (en) 1993-09-21

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