TW202514853A - 製程處理裝置的診斷裝置、診斷系統及診斷方法 - Google Patents
製程處理裝置的診斷裝置、診斷系統及診斷方法 Download PDFInfo
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- TW202514853A TW202514853A TW113128281A TW113128281A TW202514853A TW 202514853 A TW202514853 A TW 202514853A TW 113128281 A TW113128281 A TW 113128281A TW 113128281 A TW113128281 A TW 113128281A TW 202514853 A TW202514853 A TW 202514853A
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- Prior art keywords
- component
- process processing
- processing device
- diagnostic
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
- G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
- G05B23/024—Quantitative history assessment, e.g. mathematical relationships between available data; Functions therefor; Principal component analysis [PCA]; Partial least square [PLS]; Statistical classifiers, e.g. Bayesian networks, linear regression or correlation analysis; Neural networks
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
- G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
- G05B23/0227—Qualitative history assessment, whereby the type of data acted upon, e.g. waveforms, images or patterns, is not relevant, e.g. rule based assessment; if-then decisions
- G05B23/0235—Qualitative history assessment, whereby the type of data acted upon, e.g. waveforms, images or patterns, is not relevant, e.g. rule based assessment; if-then decisions based on a comparison with predetermined threshold or range, e.g. "classical methods", carried out during normal operation; threshold adaptation or choice; when or how to compare with the threshold
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
- G05B23/0262—Confirmation of fault detection, e.g. extra checks to confirm that a failure has indeed occurred
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Artificial Intelligence (AREA)
- Evolutionary Computation (AREA)
- Mathematical Physics (AREA)
- Testing And Monitoring For Control Systems (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/033673 WO2025057394A1 (ja) | 2023-09-15 | 2023-09-15 | プロセス処理装置の診断装置、診断システム、および診断方法 |
| WOPCT/JP2023/033673 | 2023-09-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202514853A true TW202514853A (zh) | 2025-04-01 |
Family
ID=95021035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113128281A TW202514853A (zh) | 2023-09-15 | 2024-07-30 | 製程處理裝置的診斷裝置、診斷系統及診斷方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2025057394A1 (https=) |
| KR (1) | KR20250040892A (https=) |
| CN (1) | CN120019342A (https=) |
| TW (1) | TW202514853A (https=) |
| WO (1) | WO2025057394A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011258261A (ja) * | 2010-06-07 | 2011-12-22 | Mitsubishi Electric Corp | 劣化度判定装置及びコンピュータプログラム及び劣化度判定方法 |
| JP5259797B2 (ja) | 2011-09-05 | 2013-08-07 | 株式会社東芝 | 学習型プロセス異常診断装置、およびオペレータ判断推測結果収集装置 |
| JP6723669B2 (ja) * | 2016-09-27 | 2020-07-15 | 東京エレクトロン株式会社 | 異常検知プログラム、異常検知方法および異常検知装置 |
| JP2018147385A (ja) * | 2017-03-08 | 2018-09-20 | 三菱日立パワーシステムズ株式会社 | 保守作業計画システム、保守作業計画方法及びプログラム |
| JP7321452B2 (ja) * | 2019-10-11 | 2023-08-07 | Biprogy株式会社 | プログラム、情報処理装置、情報処理方法及び学習済みモデルの生成方法 |
| EP4160342A4 (en) * | 2020-05-29 | 2024-07-17 | Daicel Corporation | Abnormal modulation cause identification device, abnormal modulation cause identification method, and abnormal modulation cause identification program |
| JP7289992B1 (ja) * | 2021-07-13 | 2023-06-12 | 株式会社日立ハイテク | 診断装置及び診断方法並びにプラズマ処理装置及び半導体装置製造システム |
| WO2023148967A1 (ja) * | 2022-02-07 | 2023-08-10 | 株式会社日立ハイテク | 診断装置、診断方法、半導体製造装置システム及び半導体装置製造システム |
-
2023
- 2023-09-15 KR KR1020247041272A patent/KR20250040892A/ko active Pending
- 2023-09-15 JP JP2024572369A patent/JPWO2025057394A1/ja active Pending
- 2023-09-15 WO PCT/JP2023/033673 patent/WO2025057394A1/ja active Pending
- 2023-09-15 CN CN202380046757.1A patent/CN120019342A/zh active Pending
-
2024
- 2024-07-30 TW TW113128281A patent/TW202514853A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN120019342A (zh) | 2025-05-16 |
| WO2025057394A1 (ja) | 2025-03-20 |
| JPWO2025057394A1 (https=) | 2025-03-20 |
| KR20250040892A (ko) | 2025-03-25 |
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