TW202513208A - 基板處理方法及基板處理裝置 - Google Patents

基板處理方法及基板處理裝置 Download PDF

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Publication number
TW202513208A
TW202513208A TW113118121A TW113118121A TW202513208A TW 202513208 A TW202513208 A TW 202513208A TW 113118121 A TW113118121 A TW 113118121A TW 113118121 A TW113118121 A TW 113118121A TW 202513208 A TW202513208 A TW 202513208A
Authority
TW
Taiwan
Prior art keywords
laser light
substrate
laser
wafer
irradiation
Prior art date
Application number
TW113118121A
Other languages
English (en)
Chinese (zh)
Inventor
山下陽平
山脇陽平
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202513208A publication Critical patent/TW202513208A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW113118121A 2023-05-25 2024-05-16 基板處理方法及基板處理裝置 TW202513208A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-086028 2023-05-25
JP2023086028 2023-05-25

Publications (1)

Publication Number Publication Date
TW202513208A true TW202513208A (zh) 2025-04-01

Family

ID=93589181

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113118121A TW202513208A (zh) 2023-05-25 2024-05-16 基板處理方法及基板處理裝置

Country Status (5)

Country Link
JP (1) JPWO2024241936A1 (https=)
KR (1) KR20260016511A (https=)
CN (1) CN121219097A (https=)
TW (1) TW202513208A (https=)
WO (1) WO2024241936A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000005893A (ja) * 1998-06-26 2000-01-11 Mitsubishi Heavy Ind Ltd レーザ加工装置
JP2006281268A (ja) * 2005-03-31 2006-10-19 Hitachi Via Mechanics Ltd レーザ加工機
JP2007190560A (ja) * 2006-01-17 2007-08-02 Miyachi Technos Corp レーザ加工装置
JP2012170985A (ja) * 2011-02-22 2012-09-10 Disco Corp レーザ加工装置
JP2016131997A (ja) * 2015-01-19 2016-07-25 パナソニックＩｐマネジメント株式会社 レーザ切断光学ユニット及びレーザ切断装置
JP7304433B2 (ja) 2019-12-26 2023-07-06 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
JPWO2024241936A1 (https=) 2024-11-28
WO2024241936A1 (ja) 2024-11-28
CN121219097A (zh) 2025-12-26
KR20260016511A (ko) 2026-02-03

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