JPWO2024241936A1 - - Google Patents

Info

Publication number
JPWO2024241936A1
JPWO2024241936A1 JP2025522321A JP2025522321A JPWO2024241936A1 JP WO2024241936 A1 JPWO2024241936 A1 JP WO2024241936A1 JP 2025522321 A JP2025522321 A JP 2025522321A JP 2025522321 A JP2025522321 A JP 2025522321A JP WO2024241936 A1 JPWO2024241936 A1 JP WO2024241936A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025522321A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024241936A1 publication Critical patent/JPWO2024241936A1/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multi-focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2025522321A 2023-05-25 2024-05-13 Pending JPWO2024241936A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023086028 2023-05-25
PCT/JP2024/017598 WO2024241936A1 (ja) 2023-05-25 2024-05-13 基板処理方法及び基板処理装置

Publications (1)

Publication Number Publication Date
JPWO2024241936A1 true JPWO2024241936A1 (https=) 2024-11-28

Family

ID=93589181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025522321A Pending JPWO2024241936A1 (https=) 2023-05-25 2024-05-13

Country Status (5)

Country Link
JP (1) JPWO2024241936A1 (https=)
KR (1) KR20260016511A (https=)
CN (1) CN121219097A (https=)
TW (1) TW202513208A (https=)
WO (1) WO2024241936A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000005893A (ja) * 1998-06-26 2000-01-11 Mitsubishi Heavy Ind Ltd レーザ加工装置
JP2006281268A (ja) * 2005-03-31 2006-10-19 Hitachi Via Mechanics Ltd レーザ加工機
JP2007190560A (ja) * 2006-01-17 2007-08-02 Miyachi Technos Corp レーザ加工装置
JP2012170985A (ja) * 2011-02-22 2012-09-10 Disco Corp レーザ加工装置
JP2016131997A (ja) * 2015-01-19 2016-07-25 パナソニックIpマネジメント株式会社 レーザ切断光学ユニット及びレーザ切断装置
JP7304433B2 (ja) 2019-12-26 2023-07-06 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
WO2024241936A1 (ja) 2024-11-28
CN121219097A (zh) 2025-12-26
TW202513208A (zh) 2025-04-01
KR20260016511A (ko) 2026-02-03

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20251111