CN121219097A - 基板处理方法和基板处理装置 - Google Patents

基板处理方法和基板处理装置

Info

Publication number
CN121219097A
CN121219097A CN202480032016.2A CN202480032016A CN121219097A CN 121219097 A CN121219097 A CN 121219097A CN 202480032016 A CN202480032016 A CN 202480032016A CN 121219097 A CN121219097 A CN 121219097A
Authority
CN
China
Prior art keywords
substrate
laser beam
laser
substrate processing
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480032016.2A
Other languages
English (en)
Chinese (zh)
Inventor
山下阳平
山胁阳平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN121219097A publication Critical patent/CN121219097A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
CN202480032016.2A 2023-05-25 2024-05-13 基板处理方法和基板处理装置 Pending CN121219097A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-086028 2023-05-25
JP2023086028 2023-05-25
PCT/JP2024/017598 WO2024241936A1 (ja) 2023-05-25 2024-05-13 基板処理方法及び基板処理装置

Publications (1)

Publication Number Publication Date
CN121219097A true CN121219097A (zh) 2025-12-26

Family

ID=93589181

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480032016.2A Pending CN121219097A (zh) 2023-05-25 2024-05-13 基板处理方法和基板处理装置

Country Status (5)

Country Link
JP (1) JPWO2024241936A1 (https=)
KR (1) KR20260016511A (https=)
CN (1) CN121219097A (https=)
TW (1) TW202513208A (https=)
WO (1) WO2024241936A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000005893A (ja) * 1998-06-26 2000-01-11 Mitsubishi Heavy Ind Ltd レーザ加工装置
JP2006281268A (ja) * 2005-03-31 2006-10-19 Hitachi Via Mechanics Ltd レーザ加工機
JP2007190560A (ja) * 2006-01-17 2007-08-02 Miyachi Technos Corp レーザ加工装置
JP2012170985A (ja) * 2011-02-22 2012-09-10 Disco Corp レーザ加工装置
JP2016131997A (ja) * 2015-01-19 2016-07-25 パナソニックＩｐマネジメント株式会社 レーザ切断光学ユニット及びレーザ切断装置
JP7304433B2 (ja) 2019-12-26 2023-07-06 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
JPWO2024241936A1 (https=) 2024-11-28
WO2024241936A1 (ja) 2024-11-28
TW202513208A (zh) 2025-04-01
KR20260016511A (ko) 2026-02-03

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