TW202510124A - 絕緣膜形成材料、半導體裝置的製造方法及半導體裝置 - Google Patents

絕緣膜形成材料、半導體裝置的製造方法及半導體裝置 Download PDF

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Publication number
TW202510124A
TW202510124A TW113114789A TW113114789A TW202510124A TW 202510124 A TW202510124 A TW 202510124A TW 113114789 A TW113114789 A TW 113114789A TW 113114789 A TW113114789 A TW 113114789A TW 202510124 A TW202510124 A TW 202510124A
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TW
Taiwan
Prior art keywords
insulating film
forming material
film forming
group
semiconductor
Prior art date
Application number
TW113114789A
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English (en)
Chinese (zh)
Inventor
足立憲哉
米田聡
松川大作
Original Assignee
日商艾曲迪微系統股份有限公司
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Publication of TW202510124A publication Critical patent/TW202510124A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Formation Of Insulating Films (AREA)
TW113114789A 2023-04-19 2024-04-19 絕緣膜形成材料、半導體裝置的製造方法及半導體裝置 TW202510124A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023068850 2023-04-19
JP2023-068850 2023-04-19

Publications (1)

Publication Number Publication Date
TW202510124A true TW202510124A (zh) 2025-03-01

Family

ID=93152953

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113114789A TW202510124A (zh) 2023-04-19 2024-04-19 絕緣膜形成材料、半導體裝置的製造方法及半導體裝置

Country Status (5)

Country Link
JP (1) JPWO2024219502A1 (https=)
KR (1) KR20260005243A (https=)
CN (1) CN120981899A (https=)
TW (1) TW202510124A (https=)
WO (1) WO2024219502A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4868183B2 (ja) * 2008-09-30 2012-02-01 日産化学工業株式会社 新規なフッ素化テトラカルボン酸二無水物、これより得られるポリイミド前駆体、ポリイミドとその利用
JPWO2015118836A1 (ja) * 2014-02-10 2017-03-23 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体を含む樹脂組成物、硬化膜の製造方法及び電子部品
JP7238271B2 (ja) 2018-05-21 2023-03-14 住友ベークライト株式会社 電子装置、及び電子装置の製造方法
JP7378949B2 (ja) * 2019-03-29 2023-11-14 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルムの製法
WO2022070362A1 (ja) * 2020-09-30 2022-04-07 昭和電工マテリアルズ株式会社 樹脂組成物、半導体装置の製造方法、硬化物及び半導体装置
WO2022201497A1 (ja) * 2021-03-26 2022-09-29 昭和電工マテリアルズ株式会社 半導体装置の製造方法、半導体装置、集積回路要素、及び、集積回路要素の製造方法
CN117203746A (zh) * 2021-04-28 2023-12-08 富士胶片株式会社 接合体的制造方法、半导体器件的制造方法及树脂组合物
TW202307090A (zh) * 2021-05-17 2023-02-16 日商富士軟片股份有限公司 含聚醯亞胺部形成用組成物、接合體之製造方法、接合體、器件之製造方法及器件
WO2023022179A1 (ja) * 2021-08-20 2023-02-23 アオイ電子株式会社 半導体モジュールおよびその製造方法、電子装置、電子モジュール、ならびに電子装置の製造方法
JP2023039804A (ja) * 2021-09-09 2023-03-22 Ｈｄマイクロシステムズ株式会社 樹脂組成物、半導体装置の製造方法、硬化物及び半導体装置

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Publication number Publication date
WO2024219502A1 (ja) 2024-10-24
JPWO2024219502A1 (https=) 2024-10-24
CN120981899A (zh) 2025-11-18
KR20260005243A (ko) 2026-01-09

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