KR20260005243A - 절연막 형성 재료, 반도체 장치의 제조 방법 및 반도체 장치 - Google Patents

절연막 형성 재료, 반도체 장치의 제조 방법 및 반도체 장치

Info

Publication number
KR20260005243A
KR20260005243A KR1020257035004A KR20257035004A KR20260005243A KR 20260005243 A KR20260005243 A KR 20260005243A KR 1020257035004 A KR1020257035004 A KR 1020257035004A KR 20257035004 A KR20257035004 A KR 20257035004A KR 20260005243 A KR20260005243 A KR 20260005243A
Authority
KR
South Korea
Prior art keywords
insulating film
group
forming material
film forming
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257035004A
Other languages
English (en)
Korean (ko)
Inventor
켄야 아다치
사토시 요네다
다이사쿠 마츠카와
Original Assignee
에이치디 마이크로시스템즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이치디 마이크로시스템즈 가부시키가이샤 filed Critical 에이치디 마이크로시스템즈 가부시키가이샤
Publication of KR20260005243A publication Critical patent/KR20260005243A/ko
Pending legal-status Critical Current

Links

Classifications

    • H01L24/04—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H01L24/03—
    • H01L24/07—
    • H01L24/80—
    • H01L25/0655—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H01L2224/024—
    • H01L2224/8085—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Formation Of Insulating Films (AREA)
KR1020257035004A 2023-04-19 2024-04-19 절연막 형성 재료, 반도체 장치의 제조 방법 및 반도체 장치 Pending KR20260005243A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2023-068850 2023-04-19
JP2023068850 2023-04-19
PCT/JP2024/015649 WO2024219502A1 (ja) 2023-04-19 2024-04-19 絶縁膜形成材料、半導体装置の製造方法及び半導体装置

Publications (1)

Publication Number Publication Date
KR20260005243A true KR20260005243A (ko) 2026-01-09

Family

ID=93152953

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257035004A Pending KR20260005243A (ko) 2023-04-19 2024-04-19 절연막 형성 재료, 반도체 장치의 제조 방법 및 반도체 장치

Country Status (5)

Country Link
JP (1) JPWO2024219502A1 (https=)
KR (1) KR20260005243A (https=)
CN (1) CN120981899A (https=)
TW (1) TW202510124A (https=)
WO (1) WO2024219502A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019204818A (ja) 2018-05-21 2019-11-28 住友ベークライト株式会社 電子装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4868183B2 (ja) * 2008-09-30 2012-02-01 日産化学工業株式会社 新規なフッ素化テトラカルボン酸二無水物、これより得られるポリイミド前駆体、ポリイミドとその利用
JPWO2015118836A1 (ja) * 2014-02-10 2017-03-23 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体を含む樹脂組成物、硬化膜の製造方法及び電子部品
JP7378949B2 (ja) * 2019-03-29 2023-11-14 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルムの製法
WO2022070362A1 (ja) * 2020-09-30 2022-04-07 昭和電工マテリアルズ株式会社 樹脂組成物、半導体装置の製造方法、硬化物及び半導体装置
WO2022201497A1 (ja) * 2021-03-26 2022-09-29 昭和電工マテリアルズ株式会社 半導体装置の製造方法、半導体装置、集積回路要素、及び、集積回路要素の製造方法
CN117203746A (zh) * 2021-04-28 2023-12-08 富士胶片株式会社 接合体的制造方法、半导体器件的制造方法及树脂组合物
TW202307090A (zh) * 2021-05-17 2023-02-16 日商富士軟片股份有限公司 含聚醯亞胺部形成用組成物、接合體之製造方法、接合體、器件之製造方法及器件
WO2023022179A1 (ja) * 2021-08-20 2023-02-23 アオイ電子株式会社 半導体モジュールおよびその製造方法、電子装置、電子モジュール、ならびに電子装置の製造方法
JP2023039804A (ja) * 2021-09-09 2023-03-22 Ｈｄマイクロシステムズ株式会社 樹脂組成物、半導体装置の製造方法、硬化物及び半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019204818A (ja) 2018-05-21 2019-11-28 住友ベークライト株式会社 電子装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
비특허문헌 1 : F.C. Chen et al., "System on Integrated Chips(SoIC TM) for 3D Heterogeneous Integration", 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), p.594-599(2019)

Also Published As

Publication number Publication date
TW202510124A (zh) 2025-03-01
WO2024219502A1 (ja) 2024-10-24
JPWO2024219502A1 (https=) 2024-10-24
CN120981899A (zh) 2025-11-18

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