TW202503954A - 基板取出方法及基板移送系統 - Google Patents

基板取出方法及基板移送系統 Download PDF

Info

Publication number
TW202503954A
TW202503954A TW113102137A TW113102137A TW202503954A TW 202503954 A TW202503954 A TW 202503954A TW 113102137 A TW113102137 A TW 113102137A TW 113102137 A TW113102137 A TW 113102137A TW 202503954 A TW202503954 A TW 202503954A
Authority
TW
Taiwan
Prior art keywords
substrate
robot
edge
detection
detection unit
Prior art date
Application number
TW113102137A
Other languages
English (en)
Chinese (zh)
Inventor
長瀬竜治
濱崎友貴
Original Assignee
日商平田機工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商平田機工股份有限公司 filed Critical 日商平田機工股份有限公司
Publication of TW202503954A publication Critical patent/TW202503954A/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW113102137A 2023-03-28 2024-01-19 基板取出方法及基板移送系統 TW202503954A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2023/012398 2023-03-28
PCT/JP2023/012398 WO2024201688A1 (ja) 2023-03-28 2023-03-28 基板取り出し方法、及び基板移送システム

Publications (1)

Publication Number Publication Date
TW202503954A true TW202503954A (zh) 2025-01-16

Family

ID=92904229

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113102137A TW202503954A (zh) 2023-03-28 2024-01-19 基板取出方法及基板移送系統

Country Status (5)

Country Link
JP (1) JPWO2024201688A1 (https=)
KR (1) KR20250168239A (https=)
CN (1) CN120917558A (https=)
TW (1) TW202503954A (https=)
WO (1) WO2024201688A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10120172A (ja) * 1996-10-17 1998-05-12 Mecs:Kk 薄型基板の搬送装置
JPH10335420A (ja) * 1997-06-04 1998-12-18 Mecs:Kk ワークのアライメント装置
JP2001135706A (ja) 1998-01-13 2001-05-18 Toshiba Corp 処理方法
JP2001217297A (ja) * 2000-02-02 2001-08-10 Olympus Optical Co Ltd 基板搬送方法
JP3955499B2 (ja) * 2001-08-07 2007-08-08 日本電産サンキョー株式会社 ハンドの位置合わせ方法およびその装置

Also Published As

Publication number Publication date
CN120917558A (zh) 2025-11-07
KR20250168239A (ko) 2025-12-02
WO2024201688A1 (ja) 2024-10-03
JPWO2024201688A1 (https=) 2024-10-03

Similar Documents

Publication Publication Date Title
JP7082274B2 (ja) ロードポート、及びロードポートにおけるマッピング処理方法
US20240153807A1 (en) Substrate transfer method
TWI894624B (zh) 機械手、基板搬送裝置、及保持單元
JP2004363363A (ja) 搬送装置及び処理装置並びに搬送方法
TW202503954A (zh) 基板取出方法及基板移送系統
JP2024048046A (ja) 基板搬送システム及び画像補正方法
US20240312821A1 (en) Automatic teaching apparatus for semiconductor manufacturing equipment
TW202427658A (zh) 基板搬送系統及基板位置調整方法
TWI881542B (zh) 基板搬送裝置及基板搬送方法
KR20060083244A (ko) 반도체 자재 반출 기능을 갖는 로더장치
KR20220072236A (ko) 이송 장치
JP7851486B2 (ja) 搬送装置
JP4976811B2 (ja) 基板処理システム、基板搬送装置、基板搬送方法、および記録媒体
KR100583728B1 (ko) 웨이퍼 이송 로봇 및 이를 이용한 반도체 제조 설비
JP7474688B2 (ja) 補正方法及び基板搬送装置
WO2025220193A1 (ja) 容器開閉装置、及び搬送装置
JPWO2020049671A1 (ja) キャリアの位置決め部材及びキャリア載置台
JPWO2024201688A5 (https=)
WO2023167043A1 (ja) 基板搬送方法、および半導体製造システム
TW202545697A (zh) 工件搬送機器人及工件搬送機器人的控制方法
WO2024116894A1 (ja) 基板搬送方法、および基板処理システム
JP2026019371A (ja) ロボットシステム
JP2025112377A (ja) 搬送装置及びウェーハ収納容器洗浄装置
KR200382386Y1 (ko) 반도체 자재 반출 기능을 갖는 로더장치