KR20250168239A - 기판 취출 방법, 및 기판 이송 시스템 - Google Patents

기판 취출 방법, 및 기판 이송 시스템

Info

Publication number
KR20250168239A
KR20250168239A KR1020257032136A KR20257032136A KR20250168239A KR 20250168239 A KR20250168239 A KR 20250168239A KR 1020257032136 A KR1020257032136 A KR 1020257032136A KR 20257032136 A KR20257032136 A KR 20257032136A KR 20250168239 A KR20250168239 A KR 20250168239A
Authority
KR
South Korea
Prior art keywords
substrate
robot hand
detection
detection unit
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257032136A
Other languages
English (en)
Korean (ko)
Inventor
류지 나가세
유키 하마사키
Original Assignee
히라따기꼬오 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히라따기꼬오 가부시키가이샤 filed Critical 히라따기꼬오 가부시키가이샤
Publication of KR20250168239A publication Critical patent/KR20250168239A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H01L21/67766—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • H01L21/67265—
    • H01L21/67383—
    • H01L21/67742—
    • H01L21/67778—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020257032136A 2023-03-28 2023-03-28 기판 취출 방법, 및 기판 이송 시스템 Pending KR20250168239A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/012398 WO2024201688A1 (ja) 2023-03-28 2023-03-28 基板取り出し方法、及び基板移送システム

Publications (1)

Publication Number Publication Date
KR20250168239A true KR20250168239A (ko) 2025-12-02

Family

ID=92904229

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257032136A Pending KR20250168239A (ko) 2023-03-28 2023-03-28 기판 취출 방법, 및 기판 이송 시스템

Country Status (5)

Country Link
JP (1) JPWO2024201688A1 (https=)
KR (1) KR20250168239A (https=)
CN (1) CN120917558A (https=)
TW (1) TW202503954A (https=)
WO (1) WO2024201688A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001135706A (ja) 1998-01-13 2001-05-18 Toshiba Corp 処理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10120172A (ja) * 1996-10-17 1998-05-12 Mecs:Kk 薄型基板の搬送装置
JPH10335420A (ja) * 1997-06-04 1998-12-18 Mecs:Kk ワークのアライメント装置
JP2001217297A (ja) * 2000-02-02 2001-08-10 Olympus Optical Co Ltd 基板搬送方法
JP3955499B2 (ja) * 2001-08-07 2007-08-08 日本電産サンキョー株式会社 ハンドの位置合わせ方法およびその装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001135706A (ja) 1998-01-13 2001-05-18 Toshiba Corp 処理方法

Also Published As

Publication number Publication date
CN120917558A (zh) 2025-11-07
WO2024201688A1 (ja) 2024-10-03
JPWO2024201688A1 (https=) 2024-10-03
TW202503954A (zh) 2025-01-16

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St.27 status event code: A-2-3-E10-E13-lim-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

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St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

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P11 Amendment of application requested

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P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000