TW202446582A - 液狀壓縮成型材、電子零件及半導體裝置 - Google Patents

液狀壓縮成型材、電子零件及半導體裝置 Download PDF

Info

Publication number
TW202446582A
TW202446582A TW113109176A TW113109176A TW202446582A TW 202446582 A TW202446582 A TW 202446582A TW 113109176 A TW113109176 A TW 113109176A TW 113109176 A TW113109176 A TW 113109176A TW 202446582 A TW202446582 A TW 202446582A
Authority
TW
Taiwan
Prior art keywords
anhydride
resin
liquid compression
compression molding
resin composition
Prior art date
Application number
TW113109176A
Other languages
English (en)
Chinese (zh)
Inventor
武淵匡道
酒井洋介
Makoto Suzuki
上村剛
Original Assignee
日商納美仕股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕股份有限公司 filed Critical 日商納美仕股份有限公司
Publication of TW202446582A publication Critical patent/TW202446582A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW113109176A 2023-05-29 2024-03-13 液狀壓縮成型材、電子零件及半導體裝置 TW202446582A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-087755 2023-05-29
JP2023087755 2023-05-29

Publications (1)

Publication Number Publication Date
TW202446582A true TW202446582A (zh) 2024-12-01

Family

ID=93657575

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113109176A TW202446582A (zh) 2023-05-29 2024-03-13 液狀壓縮成型材、電子零件及半導體裝置

Country Status (6)

Country Link
EP (1) EP4723167A1 (https=)
JP (1) JPWO2024247416A1 (https=)
KR (1) KR20260015129A (https=)
CN (1) CN121100404A (https=)
TW (1) TW202446582A (https=)
WO (1) WO2024247416A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01185318A (ja) * 1988-01-21 1989-07-24 Toshiba Corp 注型用エポキシ樹脂組成物
JP3797990B2 (ja) * 2003-08-08 2006-07-19 株式会社東芝 熱硬化性フラックス及びはんだペースト
JP2006232950A (ja) 2005-02-23 2006-09-07 Matsushita Electric Works Ltd 封止用液状エポキシ樹脂組成物、半導体装置及びその製造方法
JP5894723B2 (ja) * 2009-12-29 2016-03-30 株式会社朝日ラバー 半導体発光装置の製造方法
JP5442529B2 (ja) * 2010-05-10 2014-03-12 日東電工株式会社 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置。
EP2976380B1 (en) * 2013-03-22 2018-10-10 Henkel IP & Holding GmbH Diene/dienophile couples and thermosetting resin compositions having reworkability
JP7454906B2 (ja) * 2016-10-14 2024-03-25 株式会社レゾナック アンダーフィル材、電子部品装置及び電子部品装置の製造方法
KR102917473B1 (ko) * 2019-03-25 2026-01-23 미쯔비시 케미컬 주식회사 에폭시 수지 및 그 제조 방법

Also Published As

Publication number Publication date
EP4723167A1 (en) 2026-04-08
JPWO2024247416A1 (https=) 2024-12-05
WO2024247416A1 (ja) 2024-12-05
KR20260015129A (ko) 2026-02-02
CN121100404A (zh) 2025-12-09

Similar Documents

Publication Publication Date Title
CN103328530B (zh) 环氧树脂组合物及使用该环氧树脂组合物的半导体封装材料
KR102014573B1 (ko) 액상 봉지재, 그것을 사용한 전자부품
JP7420559B2 (ja) 封止用樹脂組成物
TWI763877B (zh) 半導體密封用熱硬化性環氧樹脂薄片、半導體裝置及其製造方法
TW201723073A (zh) 液狀環氧樹脂組成物
CN103897342A (zh) 用于封装半导体器件的环氧树脂组合物和使用其封装的半导体器件
KR20190114968A (ko) 액상 에폭시 수지 밀봉재 및 반도체 장치
JP3952143B2 (ja) 液状エポキシ樹脂組成物及び半導体装置
CN117178021A (zh) 环氧树脂组合物
JP7337462B2 (ja) エポキシ樹脂組成物
JP5647769B2 (ja) Ｃｏｆ封止用樹脂組成物
TW202440783A (zh) 環氧樹脂組成物、電子零件、半導體裝置、半導體裝置之製造方法
TW202446582A (zh) 液狀壓縮成型材、電子零件及半導體裝置
JP2014227465A (ja) 射出成形用液状樹脂組成物および半導体装置
JP7295826B2 (ja) エポキシ樹脂組成物
WO2023062877A1 (ja) 液状封止剤、電子部品及びその製造方法、並びに半導体装置
JP7606797B1 (ja) 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
KR101972411B1 (ko) 반도체 봉지용 일액형 에폭시 수지 조성물
KR101947282B1 (ko) 에폭시 수지 조성물
WO2025004453A1 (ja) 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
KR102696698B1 (ko) 과립형 에폭시 수지 조성물
TWI891989B (zh) 酚樹脂混合物、硬化性樹脂組成物及其硬化物
WO2025203722A1 (ja) 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
KR100257377B1 (ko) 반도체소자봉지용 에폭시 수지조성물 및 이에 사용되는 저응력화 변성제
WO2021075197A1 (ja) 樹脂組成物