Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
  • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
  • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
  • B29C43/32—Component parts, details or accessories; Auxiliary operations
  • B29C43/34—Feeding the material to the mould or the compression means
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
  • C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/62—Alcohols or phenols
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/62—Alcohols or phenols
  • C08G59/621—Phenols
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
  • C08K3/013—Fillers, pigments or reinforcing additives
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
  • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
  • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Definitions

• the present invention relates to a liquid compression molding material, and electronic components and semiconductor devices manufactured using the same.
• liquid curable resin compositions used to seal various elements such as semiconductor elements by compression molding have mainly been solid resin compositions such as granular ones.
• liquid curable resin compositions so-called liquid compression molding materials
• liquid compression molding materials may be abbreviated as "LCM (Liquid Compression Molding) materials.”
• the present invention was made in consideration of the above circumstances, and aims to provide a liquid compression molding material that suppresses warping of sealing articles and has excellent fast curing properties, as well as electronic components and semiconductor devices manufactured using the same.
• the liquid compression molding material of the first aspect of the present invention is made of a resin composition containing (A) an epoxy resin, (B1) a phenol-based curing agent, (B2) an acid anhydride-based curing agent, and (C) an inorganic filler, and the glass transition temperature Tg of a cured product of the resin composition is in the range of 50°C to 120°C.
• the second liquid compression molding material of the present invention is made of a resin composition containing (A) an epoxy resin, (B1) a phenol-based hardener, (B2) an acid anhydride-based hardener, and (C) an inorganic filler, and the content of the inorganic filler (C) in the entire resin composition is 55% to 85% by mass.
• the (B1) phenol-based hardener preferably includes at least one selected from the group consisting of phenol novolac resin, alkylated phenol novolac resin, allylated phenol novolac resin, cresol novolac resin, phenol aralkyl resin (wherein the resin contains a phenylene skeleton and/or a biphenylene skeleton), naphthol aralkyl resin, triphenol methane resin, and dicyclopentadiene-type phenol resin.
• the (B2) acid anhydride-based hardener contains at least one selected from the group consisting of phthalic anhydride, methyl hymic anhydride, succinic anhydride substituted with an alkenyl group, methyl nadic anhydride, and glutaric anhydride.
• the viscosity at room temperature is preferably 10 Pa ⁇ s to 1000 Pa ⁇ s.
• the elastic modulus at 260°C of the cured product obtained by heat curing the resin composition at 180°C for 60 minutes is preferably in the range of 0.05 GPa to 0.5 GPa.
• the ratio of the phenol equivalent b1 of the (B1) phenol-based curing agent to the acid anhydride equivalent b2 of the (B2) acid anhydride-based curing agent, b1:b2, is preferably 10:90 to 90:10.
• Another embodiment of the liquid compression molding material of the first and second aspects of the present invention preferably further contains a curing accelerator (D).
• the electronic component of the present invention is provided with a sealing material made of a hardened liquid compression molding material of the first or second of the present invention.
• the semiconductor device of the present invention comprises a substrate, a semiconductor element disposed on the substrate, and a hardened product of the first or second liquid compression molding material of the present invention that seals the gap between the semiconductor element and the substrate.
• the present invention provides a liquid compression molding material that suppresses warping of sealing articles and has excellent fast curing properties, as well as electronic components and semiconductor devices manufactured using the same.
• the LCM material of the first embodiment is made of a resin composition containing (A) an epoxy resin, (B1) a phenol-based curing agent, (B2) an acid anhydride-based curing agent, and (C) an inorganic filler, and the glass transition temperature Tg of the cured product of the resin composition is in the range of 50° C. to 120° C.
• the glass transition temperature Tg is the temperature at which the loss tangent (tan ⁇ ) is maximum in a curve of change in the loss tangent (tan ⁇ ) versus temperature measured by a dynamic mechanical analysis (DMA) method. The measurement method will be described in detail later.
• the elastic modulus of the cured resin composition changes significantly at the glass transition temperature Tg, and has a relatively very high elastic modulus in the temperature range below the glass transition temperature Tg when the cured product is in a glassy state, and has a relatively very low elastic modulus in the temperature range above the glass transition temperature Tg when the cured product is in a rubbery state.
• the heating temperature during molding and the heating temperature for post-cure performed after molding are usually performed at temperatures exceeding about 130°C. For this reason, in the LCM material of the first embodiment, the glass transition temperature Tg of the cured product is set to 120°C or less.
• the glass transition temperature Tg is preferably 110°C or less, more preferably 100°C or less, and even more preferably 90°C or less.
• a combination of a phenol-based curing agent (B1) and an acid anhydride-based curing agent (B2) is used as the curing agent (B).
• the phenol-based curing agent has the effect of lowering the glass transition temperature Tg of the cured product compared to when only an acid anhydride-based curing agent is used as the curing agent. For this reason, it is necessary to use a phenol-based curing agent as the curing agent (B) in order to control the glass transition temperature Tg of the cured product so that the elastic modulus of the cured product suitable for suppressing warping during molding and heat treatment during post-cure is obtained.
• the LCM material of the first embodiment is also used in combination with an acid anhydride-based curing agent, which is relatively more reactive than the phenol-based curing agent. As a result, the LCM material of the first embodiment can also ensure excellent rapid curing.
• the acid anhydride curing agent has the effect of increasing the glass transition temperature Tg of the cured product. Therefore, in the LCM material of the first embodiment, considering that an acid anhydride curing agent must be used to ensure excellent fast curing properties, the glass transition temperature Tg is 50°C or higher.
• the glass transition temperature Tg is preferably 60°C or higher, and more preferably 71.5°C or higher.
• a suitable combination of the upper and lower limit values of the glass transition temperature Tg can be any value selected from the multiple upper limit values described above and any value selected from the multiple lower limit values described above.
• the glass transition temperature Tg of the cured product can be controlled by appropriately selecting the ratio of the phenol equivalent b1 of the (B1) phenol-based curing agent to the acid anhydride equivalent b2 of the (B2) acid anhydride-based curing agent.
• the glass transition temperature Tg can also be controlled by appropriately selecting, for example, the epoxy equivalent of the (A) epoxy resin and the degree of flexibility-rigidity of the molecular chain structure of the (A) epoxy resin.
• the crosslink density of the cured product can be increased, thereby increasing the glass transition temperature Tg, and by using an epoxy resin with a highly rigid skeletal structure, the glass transition temperature Tg can be increased.
• Epoxy Resin The epoxy resin used in the LCM material of the first embodiment is not particularly limited as long as it is a variety of epoxy resins generally used for semiconductor encapsulation. However, from the viewpoint of easily ensuring a viscosity suitable for the LCM material, it is preferable to use a liquid epoxy resin as the epoxy resin.
• the epoxy resin blended in the LCM material may be one type of epoxy resin or two or more types of epoxy resins.
• aliphatic epoxy resins include monofunctional aliphatic epoxy compounds having one epoxy group in the molecule, such as alkyl alcohol glycidyl ethers (butyl glycidyl ether, 2-ethylhexyl glycidyl ether, etc.) and alkenyl alcohol glycidyl ethers (vinyl glycidyl ether, allyl glycidyl ether, etc.); difunctional aliphatic epoxy compounds having two epoxy groups in the molecule, such as polyalkylene glycol diglycidyl ethers, such as alkylene glycol diglycidyl ether and polytetramethylene glycol diglycidyl ether, and alkenylene glycol diglycidyl ether; and polyfunctional aliphatic epoxy compounds having three or more epoxy groups in the molecule, such as polyglycidyl ethers of trifunctional or higher alcohols, such as trimethylolpropane, pentaeryth
• Phenol-based hardeners have the effect of lowering the glass transition temperature Tg of the cured product compared to acid anhydride-based hardeners.
• Any monomer, oligomer, or polymer having a phenolic hydroxyl group can be used as the phenol-based hardener, and examples thereof include phenol novolac resin, alkylated phenol novolac resin, allylated phenol novolac resin, cresol novolac resin, phenol aralkyl resin (resin containing a phenylene skeleton and/or a biphenylene skeleton), naphthol aralkyl resin, triphenol methane resin, and dicyclopentadiene-type phenol resin.

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• Chemical & Material Sciences (AREA)
• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Organic Chemistry (AREA)
• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Compositions Of Macromolecular Compounds (AREA)
• Epoxy Resins (AREA)
• Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

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• 2024
  • 2024-03-01 CN CN202480030505.4A patent/CN121100404A/zh active Pending
  • 2024-03-01 EP EP24814903.1A patent/EP4723167A1/en active Pending
  • 2024-03-01 KR KR1020257030790A patent/KR20260015129A/ko active Pending
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