TW202445282A - 印刷配線基板用曝光裝置、曝光方法、印刷配線基板的製造方法 - Google Patents

印刷配線基板用曝光裝置、曝光方法、印刷配線基板的製造方法 Download PDF

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Publication number
TW202445282A
TW202445282A TW113114084A TW113114084A TW202445282A TW 202445282 A TW202445282 A TW 202445282A TW 113114084 A TW113114084 A TW 113114084A TW 113114084 A TW113114084 A TW 113114084A TW 202445282 A TW202445282 A TW 202445282A
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Taiwan
Prior art keywords
substrate
mask
exposure
laser beam
irradiation
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TW113114084A
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English (en)
Chinese (zh)
Inventor
大谷義和
山岡裕
倉田昌実
宇佐美健人
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日商信越工程股份有限公司
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Application filed by 日商信越工程股份有限公司 filed Critical 日商信越工程股份有限公司
Publication of TW202445282A publication Critical patent/TW202445282A/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Sustainable Development (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
TW113114084A 2023-04-19 2024-04-16 印刷配線基板用曝光裝置、曝光方法、印刷配線基板的製造方法 TW202445282A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2023/015608 WO2024218897A1 (ja) 2023-04-19 2023-04-19 プリント配線基板用露光装置、露光方法及びプリント配線基板の製造方法
WOPCT/JP2023/015608 2023-04-19

Publications (1)

Publication Number Publication Date
TW202445282A true TW202445282A (zh) 2024-11-16

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ID=93152108

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Application Number Title Priority Date Filing Date
TW113114084A TW202445282A (zh) 2023-04-19 2024-04-16 印刷配線基板用曝光裝置、曝光方法、印刷配線基板的製造方法

Country Status (6)

Country Link
JP (1) JPWO2024218897A1 (https=)
KR (1) KR20260002933A (https=)
CN (1) CN121002448A (https=)
DE (1) DE112023006228T5 (https=)
TW (1) TW202445282A (https=)
WO (1) WO2024218897A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3591922B2 (ja) * 1995-07-17 2004-11-24 キヤノン株式会社 光量測定装置
JP3726270B2 (ja) * 1996-05-23 2005-12-14 株式会社ニコン 露光装置及び方法
JP3605722B2 (ja) * 1999-09-28 2004-12-22 住友重機械工業株式会社 レーザ穴あけ加工方法及び加工装置
JP2007158225A (ja) * 2005-12-08 2007-06-21 Canon Inc 露光装置
US20080073596A1 (en) * 2006-08-24 2008-03-27 Asml Netherlands B.V. Lithographic apparatus and method
JP2017132120A (ja) 2016-01-27 2017-08-03 株式会社沖データ 露光装置、画像形成装置及び露光装置製造方法

Also Published As

Publication number Publication date
CN121002448A (zh) 2025-11-21
DE112023006228T5 (de) 2026-02-26
JPWO2024218897A1 (https=) 2024-10-24
KR20260002933A (ko) 2026-01-06
WO2024218897A1 (ja) 2024-10-24

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