TW202444155A - 配線基板及安裝構造體 - Google Patents
配線基板及安裝構造體 Download PDFInfo
- Publication number
- TW202444155A TW202444155A TW113102997A TW113102997A TW202444155A TW 202444155 A TW202444155 A TW 202444155A TW 113102997 A TW113102997 A TW 113102997A TW 113102997 A TW113102997 A TW 113102997A TW 202444155 A TW202444155 A TW 202444155A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductor
- disposed
- recess
- insulating layer
- groove
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023-012812 | 2023-01-31 | ||
| JP2023012812 | 2023-01-31 | ||
| JP2023202215 | 2023-11-29 | ||
| JP2023-202215 | 2023-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202444155A true TW202444155A (zh) | 2024-11-01 |
Family
ID=92146633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113102997A TW202444155A (zh) | 2023-01-31 | 2024-01-25 | 配線基板及安裝構造體 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024162040A1 (https=) |
| TW (1) | TW202444155A (https=) |
| WO (1) | WO2024162040A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016051834A (ja) * | 2014-09-01 | 2016-04-11 | イビデン株式会社 | プリント配線基板およびその製造方法 |
| JP6346916B2 (ja) * | 2016-06-13 | 2018-06-20 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
| JP7567134B2 (ja) * | 2019-10-25 | 2024-10-16 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
-
2024
- 2024-01-19 JP JP2024574434A patent/JPWO2024162040A1/ja not_active Withdrawn
- 2024-01-19 WO PCT/JP2024/001451 patent/WO2024162040A1/ja not_active Ceased
- 2024-01-25 TW TW113102997A patent/TW202444155A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2024162040A1 (https=) | 2024-08-08 |
| WO2024162040A1 (ja) | 2024-08-08 |
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