TW202444147A - 可折疊設備用的電路基板、可折疊設備、以及可折疊設備用的膜材料和積層板 - Google Patents

可折疊設備用的電路基板、可折疊設備、以及可折疊設備用的膜材料和積層板 Download PDF

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Publication number
TW202444147A
TW202444147A TW113112404A TW113112404A TW202444147A TW 202444147 A TW202444147 A TW 202444147A TW 113112404 A TW113112404 A TW 113112404A TW 113112404 A TW113112404 A TW 113112404A TW 202444147 A TW202444147 A TW 202444147A
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TW
Taiwan
Prior art keywords
foldable device
resin layer
layer
base film
circuit substrate
Prior art date
Application number
TW113112404A
Other languages
English (en)
Chinese (zh)
Inventor
正木剛史
川守崇司
Original Assignee
日商力森諾科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202444147A publication Critical patent/TW202444147A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW113112404A 2023-04-03 2024-04-01 可折疊設備用的電路基板、可折疊設備、以及可折疊設備用的膜材料和積層板 TW202444147A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-060221 2023-04-03
JP2023060221 2023-04-03

Publications (1)

Publication Number Publication Date
TW202444147A true TW202444147A (zh) 2024-11-01

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ID=92971919

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113112404A TW202444147A (zh) 2023-04-03 2024-04-01 可折疊設備用的電路基板、可折疊設備、以及可折疊設備用的膜材料和積層板

Country Status (4)

Country Link
JP (1) JPWO2024210100A1 (https=)
KR (1) KR20250170069A (https=)
TW (1) TW202444147A (https=)
WO (1) WO2024210100A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3544930B2 (ja) 2000-10-04 2004-07-21 日本メクトロン株式会社 フレキシブルプリント基板およびそれを用いた電子機器
JP6888262B2 (ja) * 2016-09-30 2021-06-16 住友ベークライト株式会社 配線基板および電子装置
JP7306381B2 (ja) * 2018-05-11 2023-07-11 株式会社レゾナック 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム
JP7730624B2 (ja) * 2019-06-28 2025-08-28 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム、金属張積層板及びフレキシブル回路基板

Also Published As

Publication number Publication date
WO2024210100A1 (ja) 2024-10-10
JPWO2024210100A1 (https=) 2024-10-10
KR20250170069A (ko) 2025-12-04

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