JPWO2024210100A1 - - Google Patents
Info
- Publication number
- JPWO2024210100A1 JPWO2024210100A1 JP2025512559A JP2025512559A JPWO2024210100A1 JP WO2024210100 A1 JPWO2024210100 A1 JP WO2024210100A1 JP 2025512559 A JP2025512559 A JP 2025512559A JP 2025512559 A JP2025512559 A JP 2025512559A JP WO2024210100 A1 JPWO2024210100 A1 JP WO2024210100A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023060221 | 2023-04-03 | ||
| PCT/JP2024/013479 WO2024210100A1 (ja) | 2023-04-03 | 2024-04-01 | フォルダブルデバイス用回路基板、フォルダブルデバイス、並びにフォルダブルデバイス用フィルム材及び積層板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024210100A1 true JPWO2024210100A1 (https=) | 2024-10-10 |
Family
ID=92971919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025512559A Pending JPWO2024210100A1 (https=) | 2023-04-03 | 2024-04-01 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024210100A1 (https=) |
| KR (1) | KR20250170069A (https=) |
| TW (1) | TW202444147A (https=) |
| WO (1) | WO2024210100A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3544930B2 (ja) | 2000-10-04 | 2004-07-21 | 日本メクトロン株式会社 | フレキシブルプリント基板およびそれを用いた電子機器 |
| JP6888262B2 (ja) * | 2016-09-30 | 2021-06-16 | 住友ベークライト株式会社 | 配線基板および電子装置 |
| JP7306381B2 (ja) * | 2018-05-11 | 2023-07-11 | 株式会社レゾナック | 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム |
| JP7730624B2 (ja) * | 2019-06-28 | 2025-08-28 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミドフィルム、金属張積層板及びフレキシブル回路基板 |
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2024
- 2024-04-01 JP JP2025512559A patent/JPWO2024210100A1/ja active Pending
- 2024-04-01 TW TW113112404A patent/TW202444147A/zh unknown
- 2024-04-01 WO PCT/JP2024/013479 patent/WO2024210100A1/ja not_active Ceased
- 2024-04-01 KR KR1020257035270A patent/KR20250170069A/ko active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202444147A (zh) | 2024-11-01 |
| WO2024210100A1 (ja) | 2024-10-10 |
| KR20250170069A (ko) | 2025-12-04 |