KR20250170069A - 폴더블 디바이스용 회로 기판, 폴더블 디바이스, 및 폴더블 디바이스용 필름재 및 적층판 - Google Patents

폴더블 디바이스용 회로 기판, 폴더블 디바이스, 및 폴더블 디바이스용 필름재 및 적층판

Info

Publication number
KR20250170069A
KR20250170069A KR1020257035270A KR20257035270A KR20250170069A KR 20250170069 A KR20250170069 A KR 20250170069A KR 1020257035270 A KR1020257035270 A KR 1020257035270A KR 20257035270 A KR20257035270 A KR 20257035270A KR 20250170069 A KR20250170069 A KR 20250170069A
Authority
KR
South Korea
Prior art keywords
foldable device
layer
circuit board
resin layer
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257035270A
Other languages
English (en)
Korean (ko)
Inventor
다케시 마사키
다카시 가와모리
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20250170069A publication Critical patent/KR20250170069A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020257035270A 2023-04-03 2024-04-01 폴더블 디바이스용 회로 기판, 폴더블 디바이스, 및 폴더블 디바이스용 필름재 및 적층판 Pending KR20250170069A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2023-060221 2023-04-03
JP2023060221 2023-04-03
PCT/JP2024/013479 WO2024210100A1 (ja) 2023-04-03 2024-04-01 フォルダブルデバイス用回路基板、フォルダブルデバイス、並びにフォルダブルデバイス用フィルム材及び積層板

Publications (1)

Publication Number Publication Date
KR20250170069A true KR20250170069A (ko) 2025-12-04

Family

ID=92971919

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257035270A Pending KR20250170069A (ko) 2023-04-03 2024-04-01 폴더블 디바이스용 회로 기판, 폴더블 디바이스, 및 폴더블 디바이스용 필름재 및 적층판

Country Status (4)

Country Link
JP (1) JPWO2024210100A1 (https=)
KR (1) KR20250170069A (https=)
TW (1) TW202444147A (https=)
WO (1) WO2024210100A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002111138A (ja) 2000-10-04 2002-04-12 Nippon Mektron Ltd フレキシブルプリント基板およびそれを用いた電子機器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6888262B2 (ja) * 2016-09-30 2021-06-16 住友ベークライト株式会社 配線基板および電子装置
JP7306381B2 (ja) * 2018-05-11 2023-07-11 株式会社レゾナック 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム
JP7730624B2 (ja) * 2019-06-28 2025-08-28 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム、金属張積層板及びフレキシブル回路基板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002111138A (ja) 2000-10-04 2002-04-12 Nippon Mektron Ltd フレキシブルプリント基板およびそれを用いた電子機器

Also Published As

Publication number Publication date
TW202444147A (zh) 2024-11-01
WO2024210100A1 (ja) 2024-10-10
JPWO2024210100A1 (https=) 2024-10-10

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Legal Events

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)