TW202442705A - 樹脂組成物及散熱性電路基板用片材 - Google Patents

樹脂組成物及散熱性電路基板用片材 Download PDF

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Publication number
TW202442705A
TW202442705A TW112151274A TW112151274A TW202442705A TW 202442705 A TW202442705 A TW 202442705A TW 112151274 A TW112151274 A TW 112151274A TW 112151274 A TW112151274 A TW 112151274A TW 202442705 A TW202442705 A TW 202442705A
Authority
TW
Taiwan
Prior art keywords
resin composition
methyl
butene
thermal conductivity
sheet
Prior art date
Application number
TW112151274A
Other languages
English (en)
Chinese (zh)
Inventor
松原佑樹
村田裕輔
稻田翼
佐藤悠
Original Assignee
日商可樂麗股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商可樂麗股份有限公司 filed Critical 日商可樂麗股份有限公司
Publication of TW202442705A publication Critical patent/TW202442705A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F10/00—Homopolymers and copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • C08F10/14—Monomers containing five or more carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW112151274A 2022-12-28 2023-12-28 樹脂組成物及散熱性電路基板用片材 TW202442705A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022212742 2022-12-28
JP2022-212742 2022-12-28

Publications (1)

Publication Number Publication Date
TW202442705A true TW202442705A (zh) 2024-11-01

Family

ID=91717801

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112151274A TW202442705A (zh) 2022-12-28 2023-12-28 樹脂組成物及散熱性電路基板用片材

Country Status (3)

Country Link
JP (1) JPWO2024143449A1 (https=)
TW (1) TW202442705A (https=)
WO (1) WO2024143449A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60116764A (ja) * 1983-11-30 1985-06-24 Mitsubishi Chem Ind Ltd 金属薄膜層を施した成形品
DE3482557D1 (de) * 1983-11-30 1990-07-26 Mitsubishi Chem Ind 3-methylbuten-1-polymer, dessen zusammensetzung und giessform.
JP2006273948A (ja) * 2005-03-28 2006-10-12 Mitsui Chemicals Inc 熱伝導性樹脂組成物およびその用途
JP2008007590A (ja) * 2006-06-28 2008-01-17 Mitsui Chemicals Inc 熱伝導性樹脂組成物およびその用途
JP5551549B2 (ja) * 2010-09-08 2014-07-16 帝人デュポンフィルム株式会社 実装用回路基板

Also Published As

Publication number Publication date
WO2024143449A1 (ja) 2024-07-04
JPWO2024143449A1 (https=) 2024-07-04

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