JPWO2024143449A1 - - Google Patents

Info

Publication number
JPWO2024143449A1
JPWO2024143449A1 JP2024567915A JP2024567915A JPWO2024143449A1 JP WO2024143449 A1 JPWO2024143449 A1 JP WO2024143449A1 JP 2024567915 A JP2024567915 A JP 2024567915A JP 2024567915 A JP2024567915 A JP 2024567915A JP WO2024143449 A1 JPWO2024143449 A1 JP WO2024143449A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024567915A
Other languages
Japanese (ja)
Other versions
JPWO2024143449A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024143449A1 publication Critical patent/JPWO2024143449A1/ja
Publication of JPWO2024143449A5 publication Critical patent/JPWO2024143449A5/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F10/00Homopolymers and copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • C08F10/14Monomers containing five or more carbon atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/38Boron-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08L23/20Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2024567915A 2022-12-28 2023-12-27 Pending JPWO2024143449A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022212742 2022-12-28
PCT/JP2023/046868 WO2024143449A1 (ja) 2022-12-28 2023-12-27 樹脂組成物及び放熱性回路基板用シート

Publications (2)

Publication Number Publication Date
JPWO2024143449A1 true JPWO2024143449A1 (https=) 2024-07-04
JPWO2024143449A5 JPWO2024143449A5 (https=) 2025-09-11

Family

ID=91717801

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024567915A Pending JPWO2024143449A1 (https=) 2022-12-28 2023-12-27

Country Status (3)

Country Link
JP (1) JPWO2024143449A1 (https=)
TW (1) TW202442705A (https=)
WO (1) WO2024143449A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60116764A (ja) * 1983-11-30 1985-06-24 Mitsubishi Chem Ind Ltd 金属薄膜層を施した成形品
DE3482557D1 (de) * 1983-11-30 1990-07-26 Mitsubishi Chem Ind 3-methylbuten-1-polymer, dessen zusammensetzung und giessform.
JP2006273948A (ja) * 2005-03-28 2006-10-12 Mitsui Chemicals Inc 熱伝導性樹脂組成物およびその用途
JP2008007590A (ja) * 2006-06-28 2008-01-17 Mitsui Chemicals Inc 熱伝導性樹脂組成物およびその用途
JP5551549B2 (ja) * 2010-09-08 2014-07-16 帝人デュポンフィルム株式会社 実装用回路基板

Also Published As

Publication number Publication date
TW202442705A (zh) 2024-11-01
WO2024143449A1 (ja) 2024-07-04

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250623