TW202440717A - 樹脂組成物、接著劑、密封材、硬化物、半導體裝置及電子零件 - Google Patents

樹脂組成物、接著劑、密封材、硬化物、半導體裝置及電子零件 Download PDF

Info

Publication number
TW202440717A
TW202440717A TW112139427A TW112139427A TW202440717A TW 202440717 A TW202440717 A TW 202440717A TW 112139427 A TW112139427 A TW 112139427A TW 112139427 A TW112139427 A TW 112139427A TW 202440717 A TW202440717 A TW 202440717A
Authority
TW
Taiwan
Prior art keywords
component
resin composition
epoxy
mass
meth
Prior art date
Application number
TW112139427A
Other languages
English (en)
Chinese (zh)
Inventor
目黒健斗
齊藤篤志
Original Assignee
日商納美仕有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW202440717A publication Critical patent/TW202440717A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
TW112139427A 2022-10-28 2023-10-16 樹脂組成物、接著劑、密封材、硬化物、半導體裝置及電子零件 TW202440717A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-173403 2022-10-28
JP2022173403 2022-10-28

Publications (1)

Publication Number Publication Date
TW202440717A true TW202440717A (zh) 2024-10-16

Family

ID=90830737

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112139427A TW202440717A (zh) 2022-10-28 2023-10-16 樹脂組成物、接著劑、密封材、硬化物、半導體裝置及電子零件

Country Status (5)

Country Link
JP (1) JPWO2024090259A1 (https=)
KR (1) KR20250097806A (https=)
CN (1) CN119923425A (https=)
TW (1) TW202440717A (https=)
WO (1) WO2024090259A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367532B2 (ja) 1992-10-22 2003-01-14 味の素株式会社 エポキシ樹脂組成物
JP3367531B2 (ja) 1992-10-22 2003-01-14 味の素株式会社 エポキシ樹脂組成物
JP2008001867A (ja) * 2006-06-26 2008-01-10 Three Bond Co Ltd 硬化性樹脂組成物
JP7217865B2 (ja) 2018-02-22 2023-02-06 味の素株式会社 ウエハーレベルパッケージ封止用樹脂組成物
JP2019156965A (ja) * 2018-03-13 2019-09-19 ナミックス株式会社 エポキシ樹脂組成物
WO2021033327A1 (ja) * 2019-08-21 2021-02-25 ナミックス株式会社 エポキシ樹脂組成物
WO2021033329A1 (ja) * 2019-08-21 2021-02-25 ナミックス株式会社 エポキシ樹脂組成物
JP6603004B1 (ja) * 2019-08-21 2019-11-06 ナミックス株式会社 エポキシ樹脂組成物
JP7552221B2 (ja) * 2019-10-31 2024-09-18 味の素株式会社 硬化性組成物
WO2022210261A1 (ja) * 2021-03-30 2022-10-06 ナミックス株式会社 硬化性樹脂組成物

Also Published As

Publication number Publication date
JPWO2024090259A1 (https=) 2024-05-02
CN119923425A (zh) 2025-05-02
WO2024090259A1 (ja) 2024-05-02
KR20250097806A (ko) 2025-06-30

Similar Documents

Publication Publication Date Title
TWI875853B (zh) 硬化性組成物
TWI672335B (zh) 樹脂組成物、接著劑及密封劑
TWI826714B (zh) 環氧樹脂組成物
TWI827873B (zh) 環氧樹脂組成物
TWI817988B (zh) 環氧樹脂組成物
JP7217565B1 (ja) 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
JP2025119621A (ja) 樹脂組成物
TW202440717A (zh) 樹脂組成物、接著劑、密封材、硬化物、半導體裝置及電子零件
TW202504943A (zh) 環氧樹脂組成物、接著劑、密封材、硬化物、半導體裝置及電子零件
TW202506798A (zh) 環氧樹脂組成物、接著劑、密封材、硬化物、半導體裝置及電子零件
JP7217566B1 (ja) 樹脂組成物、接着剤、封止材、硬化物及び半導体装置
WO2023181846A1 (ja) 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
WO2023181845A1 (ja) 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
WO2023181847A1 (ja) 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
KR20240054979A (ko) 수지 조성물, 전자 부품용 접착제와, 이들의 경화물, 및 전자 부품
TWI921499B (zh) 樹脂組成物
JP2003105060A (ja) 制振性を有する熱硬化性樹脂組成物およびそれを用いた接着剤
WO2023181831A1 (ja) 樹脂組成物、接着剤又は封止材、硬化物、半導体装置及び電子部品
WO2025187449A1 (ja) 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
WO2023026872A1 (ja) エポキシ樹脂組成物
WO2025187447A1 (ja) 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
TW202323393A (zh) 噴射點膠用樹脂組合物、電子部件用黏合劑及其固化物、電子部件