TW202432658A - 硬化性樹脂組成物、積層構造物、硬化物及電子零件 - Google Patents

硬化性樹脂組成物、積層構造物、硬化物及電子零件 Download PDF

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Publication number
TW202432658A
TW202432658A TW112140604A TW112140604A TW202432658A TW 202432658 A TW202432658 A TW 202432658A TW 112140604 A TW112140604 A TW 112140604A TW 112140604 A TW112140604 A TW 112140604A TW 202432658 A TW202432658 A TW 202432658A
Authority
TW
Taiwan
Prior art keywords
resin composition
curable resin
epoxy resin
inorganic filler
content
Prior art date
Application number
TW112140604A
Other languages
English (en)
Chinese (zh)
Inventor
青山良朋
中佑介
仲田和貴
Original Assignee
日商太陽控股股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商太陽控股股份有限公司 filed Critical 日商太陽控股股份有限公司
Publication of TW202432658A publication Critical patent/TW202432658A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/019—Specific properties of additives the composition being defined by the absence of a certain additive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
TW112140604A 2022-10-24 2023-10-24 硬化性樹脂組成物、積層構造物、硬化物及電子零件 TW202432658A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-169946 2022-10-24
JP2022169946 2022-10-24

Publications (1)

Publication Number Publication Date
TW202432658A true TW202432658A (zh) 2024-08-16

Family

ID=90830901

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112140604A TW202432658A (zh) 2022-10-24 2023-10-24 硬化性樹脂組成物、積層構造物、硬化物及電子零件

Country Status (6)

Country Link
EP (1) EP4610290A1 (https=)
JP (1) JPWO2024090396A1 (https=)
KR (1) KR20250110241A (https=)
CN (1) CN120380052A (https=)
TW (1) TW202432658A (https=)
WO (1) WO2024090396A1 (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62112622A (ja) * 1985-11-11 1987-05-23 Toshiba Chem Corp 封止用樹脂組成物
JP6308713B2 (ja) * 2012-08-07 2018-04-11 味の素株式会社 樹脂組成物
JP6205692B2 (ja) 2012-09-03 2017-10-04 味の素株式会社 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板
JP6439960B2 (ja) * 2014-08-07 2018-12-19 パナソニックＩｐマネジメント株式会社 絶縁樹脂シート、並びにそれを用いた回路基板および半導体パッケージ
CN106661197B (zh) * 2014-08-15 2020-05-12 尤尼吉可株式会社 树脂组合物和使用该树脂组合物的层叠体
TWI620763B (zh) * 2017-04-27 2018-04-11 Taiwan Union Technology Corporation 樹脂組成物、及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板
CN109608828B (zh) * 2018-12-20 2020-10-27 广东生益科技股份有限公司 一种热固性树脂组合物及使用其的预浸料、层压板和覆金属箔层压板
CN109651763B (zh) * 2018-12-25 2020-10-27 广东生益科技股份有限公司 一种热固性树脂组合物及使用其的预浸料、层压板和覆金属箔层压板
CN109694555B (zh) * 2018-12-29 2021-07-30 广东生益科技股份有限公司 一种热固性树脂组合物及包含其的预浸料、层压板和高频电路基板
JP2020176239A (ja) * 2019-04-22 2020-10-29 帝人株式会社 エポキシ樹脂組成物、プリプレグ、プリプレグの製造方法、及び繊維強化複合材料の製造方法
CN111960956B (zh) * 2019-05-20 2022-12-30 广东生益科技股份有限公司 双端胺基活性酯、其制备方法、热固性树脂组合物及其应用
JP2022043685A (ja) * 2020-09-04 2022-03-16 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物および電子部品

Also Published As

Publication number Publication date
EP4610290A1 (en) 2025-09-03
WO2024090396A1 (ja) 2024-05-02
CN120380052A (zh) 2025-07-25
KR20250110241A (ko) 2025-07-18
JPWO2024090396A1 (https=) 2024-05-02

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