TW202424056A - 聚醯亞胺前驅物的製造方法、聚醯亞胺前驅物、感光性樹脂組成物、硬化物、圖案硬化物的製造方法及電子零件 - Google Patents

聚醯亞胺前驅物的製造方法、聚醯亞胺前驅物、感光性樹脂組成物、硬化物、圖案硬化物的製造方法及電子零件 Download PDF

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Publication number
TW202424056A
TW202424056A TW112143936A TW112143936A TW202424056A TW 202424056 A TW202424056 A TW 202424056A TW 112143936 A TW112143936 A TW 112143936A TW 112143936 A TW112143936 A TW 112143936A TW 202424056 A TW202424056 A TW 202424056A
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TW
Taiwan
Prior art keywords
polyimide precursor
group
general formula
photosensitive resin
carbon atoms
Prior art date
Application number
TW112143936A
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English (en)
Chinese (zh)
Inventor
會田祥貴
大江匡之
Original Assignee
日商艾曲迪微系統股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商艾曲迪微系統股份有限公司 filed Critical 日商艾曲迪微系統股份有限公司
Publication of TW202424056A publication Critical patent/TW202424056A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW112143936A 2022-11-25 2023-11-14 聚醯亞胺前驅物的製造方法、聚醯亞胺前驅物、感光性樹脂組成物、硬化物、圖案硬化物的製造方法及電子零件 TW202424056A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2022/043634 2022-11-25
PCT/JP2022/043634 WO2024111129A1 (ja) 2022-11-25 2022-11-25 ポリイミド前駆体の製造方法、ポリイミド前駆体、感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品

Publications (1)

Publication Number Publication Date
TW202424056A true TW202424056A (zh) 2024-06-16

Family

ID=91196005

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112143936A TW202424056A (zh) 2022-11-25 2023-11-14 聚醯亞胺前驅物的製造方法、聚醯亞胺前驅物、感光性樹脂組成物、硬化物、圖案硬化物的製造方法及電子零件

Country Status (3)

Country Link
JP (1) JPWO2024111129A1 (enrdf_load_stackoverflow)
TW (1) TW202424056A (enrdf_load_stackoverflow)
WO (1) WO2024111129A1 (enrdf_load_stackoverflow)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551522A (en) * 1985-04-26 1985-11-05 E. I. Du Pont De Nemours And Company Process for making photopolymerizable aromatic polyamic acid derivatives
JP2005148611A (ja) * 2003-11-19 2005-06-09 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物及びそれを用いたパターンの製造方法、電子部品
JP2010077192A (ja) * 2008-09-24 2010-04-08 Fujifilm Corp 樹脂組成物、該樹脂組成物を用いた硬化物、フレキシブル銅張り積層板及びフレキシブルプリント基板
JP2010260996A (ja) * 2009-05-11 2010-11-18 Fujifilm Corp テトラカルボン酸二無水物、及び重合体
WO2019193647A1 (ja) * 2018-04-03 2019-10-10 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体の製造方法、感光性樹脂組成物の製造方法、パターン硬化物の製造方法、層間絶縁膜、カバーコート層又は表面保護膜の製造方法、及び電子部品の製造方法

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Publication number Publication date
WO2024111129A1 (ja) 2024-05-30
JPWO2024111129A1 (enrdf_load_stackoverflow) 2024-05-30

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