JPWO2024111129A1 - - Google Patents

Info

Publication number
JPWO2024111129A1
JPWO2024111129A1 JP2024559834A JP2024559834A JPWO2024111129A1 JP WO2024111129 A1 JPWO2024111129 A1 JP WO2024111129A1 JP 2024559834 A JP2024559834 A JP 2024559834A JP 2024559834 A JP2024559834 A JP 2024559834A JP WO2024111129 A1 JPWO2024111129 A1 JP WO2024111129A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024559834A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024111129A1 publication Critical patent/JPWO2024111129A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2024559834A 2022-11-25 2022-11-25 Pending JPWO2024111129A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/043634 WO2024111129A1 (ja) 2022-11-25 2022-11-25 ポリイミド前駆体の製造方法、ポリイミド前駆体、感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品

Publications (1)

Publication Number Publication Date
JPWO2024111129A1 true JPWO2024111129A1 (enrdf_load_stackoverflow) 2024-05-30

Family

ID=91196005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024559834A Pending JPWO2024111129A1 (enrdf_load_stackoverflow) 2022-11-25 2022-11-25

Country Status (3)

Country Link
JP (1) JPWO2024111129A1 (enrdf_load_stackoverflow)
TW (1) TW202424056A (enrdf_load_stackoverflow)
WO (1) WO2024111129A1 (enrdf_load_stackoverflow)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551522A (en) * 1985-04-26 1985-11-05 E. I. Du Pont De Nemours And Company Process for making photopolymerizable aromatic polyamic acid derivatives
JP2005148611A (ja) * 2003-11-19 2005-06-09 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物及びそれを用いたパターンの製造方法、電子部品
JP2010077192A (ja) * 2008-09-24 2010-04-08 Fujifilm Corp 樹脂組成物、該樹脂組成物を用いた硬化物、フレキシブル銅張り積層板及びフレキシブルプリント基板
JP2010260996A (ja) * 2009-05-11 2010-11-18 Fujifilm Corp テトラカルボン酸二無水物、及び重合体
WO2019193647A1 (ja) * 2018-04-03 2019-10-10 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体の製造方法、感光性樹脂組成物の製造方法、パターン硬化物の製造方法、層間絶縁膜、カバーコート層又は表面保護膜の製造方法、及び電子部品の製造方法

Also Published As

Publication number Publication date
WO2024111129A1 (ja) 2024-05-30
TW202424056A (zh) 2024-06-16

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250115