TW202412595A - Package module with electromagnetic shielding structure and manufacturing method thereof - Google Patents

Abstract

The invention discloses a package module with an electromagnetic shielding structure, including a circuit substrate, an adhesive layer, an insulating layer, a connecting circuit layer, an electronic component, an outer circuit layer and an electromagnetic shielding shell. The adhesive layer is arranged on the circuit substrate, the insulating layer is arranged on the adhesive layer, the connecting circuit layer is buried in the insulating layer, the outer circuit layer is arranged on the insulating layer, the electronic component is connected to the connecting circuit layer, the electromagnetic shielding shell covers the electronic component. The outer circuit layer includes signal circuits, the electromagnetic shielding shell is electrically connected to the signal circuit, the connecting circuit layer includes grounding pads arranged at intervals, and the grounding is electrically connected to the signal circuit, and the electromagnetic shielding shell, the signal circuit and the connecting circuit layer are sequentially connected to form an electromagnetic shielding structure surrounding the electronic component. The invention also discloses a manufacturing method of a package module with an electromagnetic shielding structure.

Description

Packaging module with electromagnetic shield structure and manufacturing method thereof

The present application relates to the field of circuit board manufacturing technology, and more particularly to a packaging module with an electromagnetic shield structure and a manufacturing method thereof.

Generally speaking, high-density packaging modules must not only meet the trend of electronic products becoming thinner, smaller, and more flexible in structure, but also reduce the line width/line spacing on the packaging substrate, make finer circuits, and at the same time meet the solderability of the chip's fine pins.

However, high-density integrated packaging will also make the electromagnetic interference problem on the circuit board more and more serious. The general solution to the electromagnetic interference problem is to set a shielding metal layer around the component to reduce the interference between signals. However, the shielding metal layer in the existing technology does not surround the chip in all directions, and the reliability is insufficient. It is even more impossible to ensure that the electromagnetic shielding of the chip is achieved in all directions while setting up fine circuits and welding the fine pins of the chip.

In view of this, it is necessary to provide a method for manufacturing a packaging module with an electromagnetic shield structure that can solve the above problems.

In addition, the present application also provides a packaging module having an electromagnetic shield structure manufactured by the above-mentioned manufacturing method.

An embodiment of the present application provides a packaging module with an electromagnetic shielding structure, including a circuit substrate, an adhesive layer, an insulating layer, a connecting circuit layer, an electronic component, an external circuit layer, and an electromagnetic shielding shell; The adhesive layer is arranged on the circuit substrate, the insulating layer is arranged on the adhesive layer, the connecting circuit layer is buried in the insulating layer, the external circuit layer is arranged on the insulating layer, the electronic component is connected to the connecting circuit layer, and the electromagnetic shielding shell is arranged on the electronic component; The outer circuit layer includes a signal circuit, the electromagnetic shield shell is electrically connected to the signal circuit, the connecting circuit layer includes spaced ground pads, the ground pads are electrically connected to the signal circuit, and the electromagnetic shield shell, the signal circuit and the connecting circuit layer are sequentially connected to form an electromagnetic shield structure surrounding the electronic component.

In some embodiments, the electronic component includes a body and pins electrically connected to the body, the connection circuit layer further includes a connection pad disposed between the ground pads, and the pins are connected to the ground pad and the connection pad; A plastic sealing layer is disposed on the surface of the electronic component, and the electromagnetic shielding shell covers the plastic sealing layer.

In some embodiments, the outer circuit layer has an opening, the connecting circuit layer and a portion of the insulating layer are exposed from the opening, the pin is received in the opening, and the body protrudes from a surface of the outer circuit layer away from the insulating layer.

In some embodiments, the packaging module further includes a gel, the gel is disposed between the body and the connecting circuit layer, the gel covers the pins, and a surface of the gel facing away from the insulating layer is not higher than a surface of the outer circuit layer facing away from the insulating layer.

In some embodiments, a surface of the connection circuit layer facing away from the insulation layer is provided with solder, and the solder connects the electronic component and the connection circuit.

The present application also provides a method for manufacturing a package module with an electromagnetic shield structure, comprising the following steps: Providing a carrier board, the carrier board comprising a circuit substrate, an adhesive layer, an insulating layer and an outer copper foil layer stacked in sequence; Opening a plurality of blind holes arranged at intervals in the carrier board, the blind holes penetrating the outer copper foil layer and part of the insulating layer; Forming a metal layer on the side of the outer copper foil layer away from the insulating layer, part of the metal layer is filled into the blind hole to form a connecting circuit layer, the connecting circuit layer comprising ground pads arranged at intervals; Etching the metal layer and the outer copper foil layer to form an outer circuit layer, the outer circuit layer includes a signal line, the signal line is electrically connected to the ground pad, the outer circuit layer has an opening, and the connection circuit layer is exposed from the opening; An electromagnetic shielding shell is arranged around the electronic component, the electromagnetic shielding shell is electrically connected to the signal line, and the electromagnetic shielding shell, the signal line and the connection circuit layer form an electromagnetic shielding structure covering the electronic component.

In some embodiments, the electronic component includes a body and a plurality of pins electrically connected to the body, and the connection circuit layer further includes a connection pad disposed between the ground pads; The step of "soldering the electronic component to the connection circuit layer" includes: Solder is provided on the surface of the connection circuit layer away from the insulating layer, and the plurality of pins are soldered to the ground pad and the connection pad through the solder.

In some embodiments, after the step of "etching the metal layer and the outer copper foil layer to form an outer circuit layer", it also includes: Etching the connecting circuit layer so that the surface of the connecting circuit layer facing away from the insulating layer and the surface of the insulating layer facing the outer circuit layer are offset to form a mounting groove; and Placing the solder in the mounting groove.

In some embodiments, the pin is received in the opening, and the body protrudes from the surface of the outer circuit layer away from the insulating layer; After the step of "welding the electronic component to the connecting circuit layer", it also includes: Placing a gel between the body and the connecting circuit layer, the gel covers the pin, and the surface of the gel away from the insulating layer is not higher than the surface of the outer circuit layer away from the insulating layer.

In some embodiments, a plastic layer is provided on the surface of the electronic component; The step of "providing an electromagnetic shielding shell around the electronic component" includes: Sputtering a metal material on the plastic layer to form the electromagnetic shielding shell.

Compared with the prior art, the embedded circuit board with an electromagnetic shielding structure provided by the present application has the following advantages: (1) by arranging the electromagnetic shielding shell around the electronic component, and the electromagnetic shielding shell being electrically connected to the grounding pad to achieve grounding, the electromagnetic shielding shell, the signal line and the connecting line layer are connected to form an electromagnetic shielding structure that fully covers the electronic component, thereby achieving the maximum degree of signal shielding and increasing the reliability of anti-signal interference.

(2) By burying the connection line layer in the insulating layer, the line width and spacing between the ground pad and the connection pad can be minimized to a minimum of 2 μm, which can achieve bonding with electronic components with dense pins, is conducive to high-density packaging, and thus reduces the problem of conductive ion migration.

(3) By burying the connection line layer in the insulation layer and providing the colloid on the surface, the connection line layer is protected all around, and the high peeling strength can be achieved to the greatest extent, thereby ensuring the packaging reliability.

(4) By placing the colloid in the second opening and ensuring that the surface of the colloid facing away from the insulating layer is not higher than the surface of the outer circuit layer facing away from the insulating layer, the minimum package size is ensured.

(5) Only the plastic sealing layer is retained between the electromagnetic shield shell and the electronic component, so as to realize the most miniaturized shield design, which is beneficial to the lightness, thinness and miniaturization of electronic products.

(6) By accommodating the pins of the electronic component in the second opening, the main body protrudes from the surface of the outer circuit layer away from the insulating layer, so that the structural design of the packaging module is flexible, the yield is high, and it is suitable for most product designs and can be widely used.

The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative labor are within the scope of protection of this application.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the application. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit the application.

The following is a detailed description of some implementations of the present application in conjunction with the accompanying drawings. The following embodiments and features in the embodiments may be combined with each other without conflict.

Please refer to FIG. 1 to FIG. 15 , a method for manufacturing a package module 100 having an electromagnetic shield structure in an embodiment of the present invention includes the following steps:

In step S1, please refer to FIG. 5 , a circuit substrate 10 is provided, wherein the circuit substrate 10 includes a base layer 101, inner circuit layers 102 formed on two opposite sides of the base layer 101, and a conductive body 103 penetrating the base layer 101, wherein the conductive body 103 electrically connects the two inner circuit layers 102.

The material of the substrate layer 101 can be selected from one of polyimide (PI), liquid crystal polymer (LCP), glass fiber epoxy (FR4), polytetrafluoroethylene (PTFE), and the like.

In other embodiments, the circuit substrate 10 may also be a single-sided board, that is, the circuit substrate 10 only includes the inner circuit layer 102 formed on one side of the base layer 101 .

Please refer to FIG. 1 to FIG. 5 together. The manufacturing method of the circuit substrate 10 specifically includes the following steps:

In step S11, referring to FIG. 1 , a copper-clad substrate 10 ′ is provided. The copper-clad substrate 10 ′ includes a base layer 101 and inner copper foil layers 102 ′ formed on two opposite sides of the base layer 101 .

In step S12, please refer to FIG. 2 , a through hole 11 is formed through the copper-clad substrate 10 ′.

In this embodiment, the through hole 11 is formed by laser. In other embodiments, the through hole 11 can be formed by other methods, such as mechanical drilling, stamping, etc.

In step S13, please refer to FIG. 3 , the copper-clad substrate 10 ′ is subjected to a whole-board electroplating process to form a first metal layer 12 on a side of the inner copper foil layer 102 ′ facing away from the base layer 101 , and a conductive body 103 is formed in the through hole 11 .

In step S14, please refer to FIG. 4 , a first photosensitive pattern layer 13 is disposed on a side of the first metal layer 12 facing away from the inner copper foil layer 102 ′. The first photosensitive pattern layer 13 has a plurality of first openings 131 , and a portion of the first metal layer 12 is exposed from the first openings 131 .

The first photosensitive pattern layer 13 can be obtained by exposing and developing a first photosensitive dry film (not shown).

In step S15, please refer to FIG. 5 , the first metal layer 12 and the inner copper foil layer 102′ are simultaneously etched to form the inner circuit layer 102, and the first photosensitive pattern layer 13 is removed to obtain the circuit substrate 10.

In step S2, please refer to FIG. 6 , a copper-clad plate 20 is pressed on two opposite sides of the circuit substrate 10 to obtain a carrier 21.

The copper clad laminate 20 includes an adhesive layer 201, an insulating layer 202 and an outer copper foil layer 203 stacked in sequence. The adhesive layer 201 faces the circuit substrate 10 side, and part of the adhesive layer 201 fills the gap between the inner circuit layer 102 and the base layer 101.

The adhesive layer 201 may be one of ABF resin, prepreg (PP), epoxy resin, BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), etc. The material of the insulating layer 202 may be the same as that of the substrate layer 101.

In step S3 , please refer to FIG. 7 , a plurality of blind holes 211 are formed in the carrier board 21 .

The blind hole 211 is opened along the stacking direction of the copper clad plate 20 , and the blind hole 211 penetrates the outer copper foil layer 203 and a portion of the insulating layer 202 .

In step S4, please refer to FIG. 8 , a second metal layer 30 ′ is electroplated on the side of the outer copper foil layer 203 facing away from the insulating layer 202 , and a portion of the second metal layer 30 ′ is filled into the blind hole 211 to form a connecting circuit layer 31 .

In step S5, please refer to FIG. 9 , a second photosensitive pattern layer 40 is disposed on the side of the second metal layer 30 ′ facing away from the outer copper foil layer 203 . The second photosensitive pattern layer 40 has a third opening 401 , and a portion of the second metal layer 30 ′ is exposed from the third opening 401 .

The second photosensitive pattern layer 40 can be obtained by exposing and developing a second photosensitive dry film (not shown).

Step S6, please refer to Figure 10, the second metal layer 30' and the outer copper foil layer 203 are subjected to synchronous etching processing to form an outer circuit layer 30, and the outer circuit layer 30 includes a plurality of signal circuits 301 arranged at intervals.

The outer circuit layer 30 has a second opening 302 , and the connection circuit layer 31 and a portion of the insulation layer 202 are exposed from the second opening 302 .

Wherein, step S6 further includes the step of micro-etching the connection circuit layer 31 so that the surface of the connection circuit layer 31 facing away from the insulating layer 202 is slightly lower than the surface of the insulating layer 202 facing the outer circuit layer 30, thereby forming a mounting groove 32.

The connection circuit layer 31 includes ground pads 311 on both sides and a connection pad 312 between the ground pads 311. The ground pads 311 are electrically connected to the signal circuits 301. The ground pads 311 and the signal circuits 301 form a side wall 3021 around the second opening 302.

The cross-sectional width of the signal line 301 is greater than the cross-sectional width of the connection pad 312 and the connection pad 312. The signal line 301 is used to connect to an external circuit (not shown).

It can be understood that step S6 further includes: removing the second photosensitive pattern layer 40.

It can be understood that in practical applications, the manufacturing method of the present application further includes: setting at least one conductive hole (not shown) through the insulating layer 202 and the adhesive layer 201, and the conductive hole electrically connects the outer circuit layer 30 and the inner circuit layer 102.

Step S7, please refer to FIG. 11 , chemically tinning is performed on the surface of the connection circuit layer 31 facing the second opening 302 to form solder 33.

The solder 33 is also formed on the side wall 3021. The solder 33 is used to solder the electronic component 50 (see FIG. 12 ).

Step S8 , please refer to FIG. 12 , an electronic component 50 is disposed in the second opening 302 , and the electronic component 50 is electrically connected to the connection circuit layer 31 .

The electronic component 50 includes a body 501 and a plurality of pins 502 electrically connected to the body 501. The pins 502 are received in the second opening 302, and the body 501 protrudes from the surface of the outer circuit layer 30 away from the insulating layer 202. The plurality of pins 502 of the electronic component 50 are soldered to the connection circuit layer 31 at the bottom of the mounting groove 32 through the solder 33.

It can be understood that the electronic component 50 is a plastic-encapsulated device, and has a plastic-encapsulation layer 51 when it leaves the factory, and the plastic-encapsulation layer 51 is coated on the surface of the body 501.

In this embodiment, the electronic element 50 may include one or more active devices, such as active chips, including but not limited to power chips, digital chips, radio frequency chips, etc.

Please refer to FIG. 13 . Since the connection circuit layer 31 is embedded in the insulation layer 202 , the line width of the connection pad 312 and the ground pad 311 and the spacing between the lines can be minimized to 2 μm, so that the bonding package can be realized with the densest pins 502 without the problem of copper ion migration. In addition, the connection circuit layer 31 is protected all around, which can achieve high peeling strength to the greatest extent and ensure packaging reliability.

In step S9 , please refer to FIG. 14 , a colloid 60 is disposed at the bottom of the electronic component 50 , and the colloid 60 covers the plurality of pins 502 .

The gel 60 is disposed in the second opening 302, and the surface of the gel 60 facing away from the insulating layer 202 is not higher than the surface of the outer circuit layer 30 facing away from the insulating layer 202. Since the gel 60 is disposed in the second opening 302, the gel does not flow out, thereby ensuring the minimum package size.

In this embodiment, a bottom filling process can be used to apply a viscous resin glue to the edge of the electronic component 50, so that it can penetrate to the bottom of the body 501 through capillary action, and then heat it to solidify to form the glue 60. The glue 60 is used to improve the mechanical strength of the welding of the electronic component 50, improve the service life, and enhance the reliability. The material of the glue 60 can be epoxy resin.

In step S10 , please refer to FIG. 15 , an electromagnetic shielding case 70 is disposed on the surface of the electronic component 50 .

The electromagnetic shield shell 70 is coated on the plastic packaging layer 51. The electromagnetic shield shell 70 is in contact with the signal line 301, so that the electromagnetic shield shell 70 is electrically connected to the ground pad 311 to achieve grounding. The electromagnetic shield shell 70, the signal line 301 and the connection line layer 31 are connected to form an electromagnetic shield structure that fully covers the electronic component 50.

In this embodiment, a metal material may be selectively sputtered or coated on the surface of the electronic element 50 to form the electromagnetic shielding shell 70. The metal material may be silver or copper.

Please refer to Figure 15. The present application also provides a packaging module 100 having an electromagnetic shield structure manufactured by the above-mentioned manufacturing method. The packaging module 100 includes a circuit substrate 10, an adhesive layer 201, an insulating layer 202 and an outer circuit layer 30 stacked in sequence, and a connecting circuit layer 31 buried in the insulating layer 202, an electronic component 50 electrically connected to the connecting circuit layer 31, a colloid 60 arranged between the connecting circuit layer 31 and the electronic component 50, and an electromagnetic shield shell 70 arranged around the electronic component 50.

The circuit substrate 10 includes a base layer 101 , inner circuit layers 102 formed on two opposite sides of the base layer 101 , and a conductive body 103 penetrating the base layer 101 , wherein the conductive body 103 electrically connects the two inner circuit layers 102 .

The outer circuit layer 30 has a second opening 302, and the connection circuit layer 31 and a portion of the insulation layer 202 are exposed from the second opening 302. The surface of the connection circuit layer 31 facing away from the insulation layer 202 is slightly lower than the surface of the insulation layer 202 facing the outer circuit layer 30. The connection circuit layer 31 includes ground pads 311 located on both sides and a connection pad 312 located between the ground pads 311, and the ground pads 311 are electrically connected to the signal circuit 301. The ground pads 311 and the signal circuit 301 form a side wall 3021 around the second opening 302. Solder 33 is formed on the surface of the connection circuit layer 31 facing the second opening 302 and the sidewall 3021 .

The cross-sectional width of the signal line 301 is greater than the cross-sectional width of the connection pad 312 and the cross-sectional width of the connection pad 312 .

The electronic component 50 includes a body 501 and a plurality of pins 502 electrically connected to the body 501. The pins 502 are received in the second opening 302, and the colloid 60 covers the plurality of pins 502. The body 501 protrudes from the surface of the outer circuit layer 30 away from the insulating layer 202. The plurality of pins 502 of the electronic component 50 are soldered to the connecting circuit layer 31 through the solder 33. A plastic sealing layer 51 is also provided on the surface of the electronic component 50, and the plastic sealing layer 51 covers the surface of the body 501 except the surface where the pins 502 are provided.

The surface of the colloid 60 facing away from the insulating layer 202 is not higher than the surface of the outer circuit layer 30 facing away from the insulating layer 202 .

The electromagnetic shielding shell 70 covers the plastic packaging layer 51. The electromagnetic shielding shell 70 contacts the signal line 301, so that the electromagnetic shielding shell 70 is electrically connected to the ground pad 311 to achieve grounding. The electromagnetic shielding shell 70, the signal line 301 and the connection line layer 31 are connected to form an electromagnetic shielding structure that fully covers the electronic component 50.

In this embodiment, the package module 100 having the electromagnetic shield structure can be widely used in small signal modules, display panels, Mini LEDs, wireless headphones, mobile phones or watch motherboards, etc.

Compared with the prior art, the packaging module 100 with an electromagnetic shield structure provided by the present application has the following advantages:

(1) By arranging the electromagnetic shielding shell 70 around the electronic component 50, and the electromagnetic shielding shell 70 is electrically connected to the grounding pad 311 to achieve grounding, the electromagnetic shielding shell 70, the signal line 301 and the connecting line layer 31 are connected to form an electromagnetic shielding structure that fully covers the electronic component 50, thereby achieving maximum signal shielding and increasing the reliability of anti-signal interference.

(2) By burying the connection line layer 31 in the insulating layer 202, the line width and spacing between the ground pad 311 and the connection pad 312 can be minimized to a minimum of 2 μm, which can achieve bonding with the electronic component 50 with dense pins 502, which is beneficial to high-density packaging and does not cause the problem of copper ion migration.

(3) By burying the connection circuit layer 31 in the insulating layer 202 and providing the colloid 60 on the surface, the connection circuit layer 31 is protected on all sides, and the peeling strength can be maximized to ensure the packaging reliability.

(4) By placing the colloid 60 in the second opening 302 and ensuring that the surface of the colloid 60 facing away from the insulating layer 202 is not higher than the surface of the outer circuit layer 30 facing away from the insulating layer 202, the minimum package size is ensured.

(5) Only the plastic packaging layer 51 is retained between the electromagnetic shield shell 70 and the electronic component 50, so as to realize the most miniaturized shield design, which is beneficial to the lightness, thinness and miniaturization of electronic products.

(6) By accommodating the pin 502 of the electronic component 50 in the second opening 302, the main body 501 protrudes from the surface of the outer circuit layer 30 away from the insulating layer 202, so that the structural design of the packaging module 100 is flexible, the yield is high, and it is suitable for most product designs and can be widely used.

The above is only the best implementation method of this application and is not any form of limitation on this application. Although this application has been disclosed as the best implementation method as above, it is not used to limit this application. Any technical personnel familiar with this profession can make some changes or modifications to the equivalent implementation methods of equivalent changes by using the technical contents disclosed above without departing from the scope of the technical solution of this application. However, any simple modification, equivalent change and modification made to the above implementation methods based on the technical essence of this application without departing from the content of the technical solution of this application are still within the scope of the technical solution of this application.

100: Package module 10: Circuit substrate 101: Base material layer 102: Inner circuit layer 103: Conductor 10’: Copper-clad substrate 102’: Inner copper foil layer 11: Through hole 12: First metal layer 13: First photosensitive pattern layer 131: First opening 20: Copper-clad substrate 201: Adhesive layer 202: Insulation layer 203: Outer copper foil layer 21: Carrier 211: Blind hole 30’: Second metal layer 30: Outer circuit layer 301: Signal line 302: Second opening 3021: Side wall 31: Connection circuit layer 311: Ground pad 312: Connection pad 32: Mounting slot 33: Solder 40: Second photosensitive pattern layer 401: Third opening 50: Electronic components 501: Main body 502: Pins 51: Plastic layer 60: Colloid 70: Electromagnetic shield shell

FIG1 is a schematic cross-sectional view of a copper-clad substrate provided in an embodiment of the present application. FIG2 is a schematic cross-sectional view after a through hole is opened in the copper-clad substrate shown in FIG1. FIG3 is a schematic cross-sectional view after a first metal layer is set on both sides of the copper-clad substrate shown in FIG2. FIG4 is a schematic cross-sectional view after a first photosensitive pattern layer is set on the first metal layer shown in FIG3. FIG5 is a schematic cross-sectional view of a circuit substrate obtained after etching the first metal layer shown in FIG4 and the inner copper foil layer to form an inner circuit layer. FIG6 is a schematic cross-sectional view after copper-clad substrates are set on both sides of the circuit substrate shown in FIG5. FIG7 is a schematic cross-sectional view of a plurality of second blind holes opened in the copper-clad substrate shown in FIG6. FIG8 is a schematic cross-sectional view after forming a second metal layer on one side of the copper-clad plate shown in FIG7. FIG9 is a schematic cross-sectional view after setting a second photosensitive pattern layer on the second metal layer shown in FIG8. FIG10 is a schematic cross-sectional view after etching the second metal layer shown in FIG9 and the outer copper foil layer to form an outer circuit layer. FIG11 is a schematic cross-sectional view after setting solder on the connecting circuit layer shown in FIG10. FIG12 is a schematic cross-sectional view after setting an electronic component in the second opening shown in FIG11. FIG13 is a top view of the ground pad and the connecting pad shown in FIG12. FIG14 is a schematic cross-sectional view after setting a colloid in the groove described in FIG12. FIG15 is a schematic cross-sectional view of the electronic component shown in FIG14 after an electromagnetic shielding shell is installed on its surface.

100:Packaging module

10: Circuit board

101: Base material layer

102: Inner wiring layer

103: Conductor

201: Adhesive layer

202: Insulation layer

30: External circuit layer

301:Signal line

302: Second opening

31: Connection circuit layer

33: Solder

50: Electronic components

501:Entity

502: Pin

51: Plastic sealing layer

60:Colloid

70: Electromagnetic shielding shell

Claims (10)

A packaging module with an electromagnetic shielding structure is improved in that it includes a circuit substrate, an adhesive layer, an insulating layer, a connecting circuit layer, an electronic component, an external circuit layer, and an electromagnetic shielding shell; the adhesive layer is arranged on the circuit substrate, the insulating layer is arranged on the adhesive layer, the connecting circuit layer is buried in the insulating layer, the external circuit layer is arranged on the insulating layer, the electronic component is connected to the connecting circuit layer, and the electromagnetic shielding shell is arranged on the electronic component; The outer circuit layer includes a signal circuit, the electromagnetic shield shell is electrically connected to the signal circuit, the connection circuit layer includes spaced ground pads, the ground pads are electrically connected to the signal circuit, and the electromagnetic shield shell, the signal circuit and the connection circuit layer are sequentially connected to form an electromagnetic shield structure surrounding the electronic component. The packaging module as described in claim 1, wherein the electronic component includes a body and pins electrically connected to the body, the connection circuit layer further includes a connection pad disposed between the ground pads, and the pins are connected to the ground pad and the connection pad; A plastic sealing layer is disposed on the surface of the electronic component, and the electromagnetic shielding shell covers the plastic sealing layer. A packaging module as described in claim 2, wherein the external circuit layer has an opening, the connecting circuit layer and a portion of the insulating layer are exposed from the opening, the pins are accommodated in the opening, and the body protrudes from the surface of the external circuit layer away from the insulating layer. A packaging module as described in claim 3, wherein the packaging module further includes a gel, wherein the gel is disposed between the main body and the connecting circuit layer, the gel covers the pins, and the surface of the gel facing away from the insulating layer is not higher than the surface of the outer circuit layer facing away from the insulating layer. A packaging module as described in claim 1, wherein a surface of the connecting circuit layer facing away from the insulating layer is provided with solder, and the solder connects the electronic component and the connecting circuit. A method for manufacturing a package module with an electromagnetic shield structure, the improvement of which is that it includes the following steps: Providing a carrier board, the carrier board including a circuit substrate, an adhesive layer, an insulating layer and an outer copper foil layer stacked in sequence; Opening a plurality of blind holes arranged at intervals on the carrier board, the blind holes penetrating the outer copper foil layer and part of the insulating layer; Forming a metal layer on the side of the outer copper foil layer away from the insulating layer, part of the metal layer is filled into the blind hole to form a connecting circuit layer, the connecting circuit layer including ground pads arranged at intervals; Etching the metal layer and the outer copper foil layer to form an outer circuit layer, the outer circuit layer includes a signal line, the signal line is electrically connected to the ground pad, the outer circuit layer has an opening, and the connection circuit layer is exposed from the opening; An electromagnetic shielding shell is arranged around the electronic component, the electromagnetic shielding shell is electrically connected to the signal line, and the electromagnetic shielding shell, the signal line and the connection circuit layer form an electromagnetic shielding structure covering the electronic component. The method for manufacturing a package module as described in claim 6, wherein the electronic component includes a body and a plurality of pins electrically connected to the body, and the connection circuit layer further includes a connection pad disposed between the ground pads; The step of "welding the electronic component to the connection circuit layer" includes: Solder is provided on the surface of the connection circuit layer away from the insulation layer, and the plurality of pins are welded to the ground pad and the connection pad through the solder. The method for manufacturing a package module as described in claim 7, wherein after the step of "etching the metal layer and the outer copper foil layer to form an outer circuit layer", it further includes: etching the connecting circuit layer so that the surface of the connecting circuit layer facing away from the insulating layer and the surface of the insulating layer facing the outer circuit layer are offset to form a mounting groove; and placing the solder in the mounting groove. The method for manufacturing a package module as described in claim 7, wherein the pin is received in the opening, and the body protrudes from the surface of the outer circuit layer away from the insulating layer; After the step of "welding the electronic component to the connecting circuit layer", it further comprises: Placing a gel between the body and the connecting circuit layer, the gel covering the pin, and the surface of the gel away from the insulating layer is not higher than the surface of the outer circuit layer away from the insulating layer. The method for manufacturing a packaging module as described in claim 6, wherein a plastic sealing layer is provided on the surface of the electronic component; The step of "providing an electromagnetic shielding shell around the electronic component" includes: Sputtering a metal material on the plastic sealing layer to form the electromagnetic shielding shell.