TW202411664A - 檢查裝置 - Google Patents

檢查裝置 Download PDF

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Publication number
TW202411664A
TW202411664A TW112118353A TW112118353A TW202411664A TW 202411664 A TW202411664 A TW 202411664A TW 112118353 A TW112118353 A TW 112118353A TW 112118353 A TW112118353 A TW 112118353A TW 202411664 A TW202411664 A TW 202411664A
Authority
TW
Taiwan
Prior art keywords
probe
hole
grounding
block
aforementioned
Prior art date
Application number
TW112118353A
Other languages
English (en)
Chinese (zh)
Inventor
武井大悟
Original Assignee
日商友華股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商友華股份有限公司 filed Critical 日商友華股份有限公司
Publication of TW202411664A publication Critical patent/TW202411664A/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW112118353A 2022-05-27 2023-05-17 檢查裝置 TW202411664A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-086638 2022-05-27
JP2022086638A JP2023174031A (ja) 2022-05-27 2022-05-27 検査装置

Publications (1)

Publication Number Publication Date
TW202411664A true TW202411664A (zh) 2024-03-16

Family

ID=88919238

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112118353A TW202411664A (zh) 2022-05-27 2023-05-17 檢查裝置

Country Status (3)

Country Link
JP (1) JP2023174031A (ja)
TW (1) TW202411664A (ja)
WO (1) WO2023228830A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4438601B2 (ja) * 2004-10-28 2010-03-24 株式会社ヨコオ 検査ユニットの製法
JP4607004B2 (ja) * 2005-12-27 2011-01-05 株式会社ヨコオ 検査ユニット
JP5193200B2 (ja) * 2007-06-22 2013-05-08 日本発條株式会社 導電性接触子ホルダおよび導電性接触子ユニット
JP5131766B2 (ja) * 2008-08-07 2013-01-30 株式会社ヨコオ 誤挿入防止型ケルビン検査用治具
JP2010175371A (ja) * 2009-01-29 2010-08-12 Yokowo Co Ltd 検査ソケット
JP5597108B2 (ja) * 2010-11-29 2014-10-01 株式会社精研 接触検査用治具
JP6475479B2 (ja) * 2014-11-27 2019-02-27 株式会社ヨコオ 検査ユニット
US11495901B2 (en) * 2017-09-08 2022-11-08 Enplas Corporation Electric connection socket connecting a circuit board and an integrated circuit package

Also Published As

Publication number Publication date
WO2023228830A1 (ja) 2023-11-30
JP2023174031A (ja) 2023-12-07

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