TW202411664A - Inspection device - Google Patents

Abstract

An inspection device of the present invention includes: a probe; and an insulating block provided with a first hole through which the probe is inserted, and a second hole in communication with the first hole, through which the probe is inserted, and which has a diameter smaller than that of the first hole; wherein the ratio of the thickness of the insulating block to the depth of the first hole is 1.40 or less.

Description

Inspection device

The present invention relates to an inspection device.

In recent years, various inspection devices have been developed for inspecting semiconductor devices such as integrated circuits (ICs). For example, Patent Document 1 describes a high-frequency probe socket. The probe socket has a plurality of probes and a noise shielding body. The plurality of probes are inserted into the noise shielding body.

[Prior Art Literature]

[Patent Literature]

Patent document 1: Japanese Patent Publication No. 2018-529951

For example, sometimes, an inspection device such as a high-frequency probe socket described in Patent Document 1 is used to inspect the high-frequency characteristics of an inspected object such as a semiconductor device. In this inspection, it is sometimes required to stably inspect the high-frequency characteristics of the inspected object.

One of the purposes of the present invention is to stably inspect the high-frequency characteristics of the object being inspected. Other purposes of the present invention can be found in the description of this specification.

One aspect of the inspection device of the present invention comprises:

Probe; and

The insulating block is provided with: a first hole for the aforementioned probe to be inserted through; and a second hole connected to the aforementioned first hole for the aforementioned probe to be inserted through, and the aperture of the second hole is smaller than the aperture of the aforementioned first hole; and

The ratio of the thickness of the aforementioned insulating block to the depth of the aforementioned first hole is less than 1.40.

One aspect of the inspection device of the present invention comprises:

Probe; and

The conductive block is for the aforementioned probe to be inserted through; and

The conductive block has a protrusion that contacts the inspection substrate.

According to the above aspects of the present invention, the high-frequency characteristics of the inspected object can be stably inspected.

10,10K: Inspection device

20: Subject of inspection

22: Ground electrode

24: Connect the electrodes

30: Check the substrate

32: Ground contact

34: Contact part

110: Ground probe

110K1: Upper ground probe

110K2: Lower ground probe

112: Grounding tube

112K1: Upper grounding tube

112K2: Lower grounding tube

112a: Wide section

114: Grounding plunger

114K1: Upper ground plunger

114K2: Lower ground plunger

120,120K: Connecting probe

122: Connecting tube

124: First connecting plunger

126: Second connecting plunger

130,130K: Pin plate

132:Through hole

134: Gap

140,140K: Pin block

142: convex part

150,150K:Retaining parts

160,160K: Ground through hole

162,162K: Large diameter hole

164,164K: small diameter hole

166,166K: Conical hole

170: Connecting through hole

D,DK: Depth

T,TK:Thickness

Figure 1 is a top perspective view showing the inspection device of the embodiment together with the inspection substrate.

Figure 2 is a bottom perspective view of the inspection device showing the implementation form.

Figure 3 shows the A-A’ section of Figure 1 together with the object to be inspected and the substrate to be inspected.

Figure 4 is an enlarged view of a portion of Figure 3.

FIG5 is a cross-sectional view showing the inspection device of the comparative example together with the object to be inspected and the inspection substrate.

Figure 6 is an enlarged view of a portion of Figure 5.

The following uses drawings to explain the implementation of the present invention. In all drawings, the same symbols are attached to the same components, and the description is appropriately omitted.

FIG. 1 is an upper perspective view showing the inspection device 10 of the embodiment together with the inspection substrate 30. FIG. 2 is a lower perspective view showing the inspection device 10 of the embodiment. FIG. 3 is a view showing the A-A' section of FIG. 1 together with the inspected object 20 and the inspection substrate 30. FIG. 4 is an enlarged view of a portion of FIG. 3.

In order to explain the direction, the X direction, Y direction and Z direction are defined. The Z direction is a direction parallel to the vertical direction. The X direction is one of the horizontal directions perpendicular to the Z direction. The Y direction is one of the horizontal directions perpendicular to the Z direction and the X direction. In the implementation form, the X direction is set as the left-right direction, the Y direction is set as the front-back direction, and the Z direction is set as the up-down direction for explanation. In each figure, the directions indicated by the arrows of the X-axis, Y-axis and Z-axis are defined as the left direction, the front direction and the up direction respectively. In Figures 3 and 4, the white circle with a black dot showing the Y direction indicates that the direction indicated by the arrow of the Y axis is from the back side to the front side of the paper.

As shown in FIG1 , the inspection device 10 has two grounding probes 110, six connecting probes 120, a pin plate 130, a pin block 140, and a retainer 150. As shown in FIG3 , each grounding probe 110 has a grounding barrel 112 and a grounding plunger 114. Each connecting probe 120 has a connecting barrel 122, a first connecting plunger 124, and a second connecting plunger 126.

As shown in FIG3 , an object to be inspected 20 is arranged above the inspection device 10. The object to be inspected 20 is, for example, a semiconductor device such as an integrated circuit (IC). An inspection substrate 30 is arranged below the inspection device 10. The inspection substrate 30 is, for example, a wiring substrate such as a printed circuit board (PCB). The object to be inspected 20 and the inspection substrate 30 are electrically connected to each other via the inspection device 10.

Referring to FIG. 1 , the configuration of two ground probes 110 and six connection probes 120 is described.

When viewed in the Z direction, the two ground probes 110 are arranged roughly parallel to the X direction. In the example shown in FIG. 1 , when viewed in the Z direction, the two ground probes 110 are arranged on both sides of the X direction relative to the center of the holding member 150 in the horizontal direction.

When viewed from the Z direction, the six connection probes 120 include: three connection probes 120 located on the left side of the two grounding probes 110; and three connection probes 120 located on the right side of the two grounding probes 110. When viewed from the Z direction, the three connection probes 120 on the left side are arranged approximately parallel to the Y direction and approximately at equal intervals. When viewed from the Z direction, the three connection probes 120 on the right side are arranged approximately parallel to the Y direction and approximately at equal intervals. When viewed from the Z direction, the central connection probe 120 among the three connection probes 120 on the left side and the central connection probe 120 among the three connection probes 120 on the right side are arranged approximately parallel to the two grounding probes 110 in the X direction.

The configuration of the two grounding probes 110 and the six connecting probes 120 is not limited to the example illustrated in FIG. 1. The configuration of the grounding probes 110 and the connecting probes 120 is appropriately changed according to the configuration of the electrodes of the inspected object 20 and the configuration of the electrodes of the inspection substrate 30.

Next, referring to FIG. 3 , the structure of each ground probe 110 and each connection probe 120 is described. If not specifically stated, the structure described below for the ground probe 110 is also applicable to the two ground probes 110. If not specifically stated, the structure described below for the connection probe 120 is also applicable to the six connection probes 120.

The grounding tube 112 extends approximately parallel to the Z direction. The grounding tube 112 is inserted into the grounding insertion hole 160 provided in the pin block 140 and the retaining member 150. Thus, the pin block 140 and the retaining member 150 serve as a support body to support the grounding probe 110 approximately parallel to the Z direction. The lower end of the grounding insertion hole 160 does not penetrate the pin block 140 in the Z direction. In the example shown in FIG. 3 , the lower end of the grounding insertion hole 160 is located above the lower end surface of the protrusion 142 of the pin block 140 described later in the Z direction. Specifically, in the example shown in FIG. 3 , the lower end of the grounding insertion hole 160 is located approximately in the center of the pin block 140 in the Z direction. However, the lower end of the grounding through hole 160 may also be offset upward or downward in the Z direction relative to the approximate center of the pin block 140 in the Z direction.

The grounding plunger 114 is disposed on the upper end side of the grounding tube 112. The upper end of the grounding through hole 160 is formed to open upward on the upper surface of the retaining member 150. Thus, the upper end of the grounding plunger 114 can protrude upward from the upper surface of the retaining member 150 through the upper end of the grounding through hole 160. The grounding plunger 114 is pushed upward by a spring (not shown) disposed inside the grounding tube 112. Therefore, when the grounding plunger 114 has been pushed upward, the upper end of the grounding plunger 114 can contact the grounding electrode 22 disposed on the lower surface of the object 20 to be inspected.

The connecting tube 122 extends roughly parallel to the Z direction. The connecting tube 122 is inserted into the connecting insertion hole 170 provided in the pin plate 130, the pin block 140 and the retaining member 150. Thus, the pin plate 130 and the retaining member 150 serve as a supporting body to support the connecting probe 120. The connecting insertion hole 170 passes the retaining member 150, the pin block 140 and the pin plate 130 in the Z direction between the upper surface of the retaining member 150 and the lower surface of the pin plate 130.

The first connection plunger 124 is arranged on the upper end side of the connection tube 122. The upper end of the connection insertion hole 170 is formed to open upward on the upper surface of the retainer 150. Thereby, the upper end of the first connection plunger 124 can protrude upward from the upper surface of the retainer 150 through the upper end of the connection insertion hole 170. The first connection plunger 124 is pushed upward by a spring (not shown) arranged inside the connection tube 122. Therefore, when the first connection plunger 124 has been pushed upward, the upper end of the first connection plunger 124 can contact the connection electrode 24 arranged on the lower surface of the object 20 to be inspected.

The second connection plunger 126 is arranged on the lower end side of the connection tube 122. The lower end of the connection insertion hole 170 is formed to open downward on the lower surface of the pin plate 130. Thereby, the lower end of the second connection plunger 126 can protrude downward from the lower surface of the pin plate 130 through the lower end of the connection insertion hole 170. The second connection plunger 126 is pushed downward by a spring not shown in the figure arranged inside the connection tube 122. Therefore, in the state where the second connection plunger 126 has been pushed downward, the lower end of the second connection plunger 126 can contact the contact portion 34 arranged on the upper surface of the inspection substrate 30. The contact portion 34 of the inspection substrate 30 is provided with an electrode not shown in the figure, for example.

The connection electrode 24 of the inspected object 20 and the contact portion 34 of the inspection substrate 30 are electrically connected to each other via the connection probe 120. The six connection probes 120 are independent of each other and are used as probes for power supply or signal. For example, the central connection probe 120 among the three connection probes 120 on the left side shown in FIG1 is a probe for power supply. The two connection probes 120 on both sides of the three connection probes 120 on the left side shown in FIG1 are probes for signals. The central connection probe 120 among the three connection probes 120 on the right side shown in FIG1 is a probe for power supply. The two connection probes 120 on both sides of the three connection probes 120 on the right side shown in FIG1 are probes for signals.

Next, referring to Figures 1 to 3, the pin plate 130, the pin block 140 and the retaining member 150 are described.

The pin plate 130 is an insulating block such as a resin block. The pin plate 130 is disposed below the pin block 140. As shown in FIG. 1 and FIG. 2 , the pin plate 130 is formed into a substantially quadrilateral shape when viewed from the Z direction. However, the shape of the pin plate 130 is not limited to this example.

The pin block 140 is a conductive block such as a metal block. The pin block 140 is arranged between the pin plate 130 and the retainer 150 in the Z direction. As shown in FIG. 1 and FIG. 2 , when viewed from the Z direction, the pin block 140 is formed into a substantially quadrilateral shape. However, the shape of the pin block 140 is not limited to this example.

The retainer 150 is an insulating block such as a resin block. The retainer 150 is arranged above the pin block 140 in the Z direction. As shown in FIG. 1 and FIG. 2 , when viewed from the Z direction, the retainer 150 is formed into a substantially quadrilateral shape. However, the shape of the retainer 150 is not limited to this example.

As shown in FIG. 2 and FIG. 3 , a through hole 132 is provided in the pin plate 130. The through hole 132 penetrates the pin plate 130 in the Z direction. A convex portion 142 is provided on the lower surface of the pin block 140. The convex portion 142 penetrates the through hole 132 of the pin plate 130 in the Z direction. As shown in FIG. 3 , the lower end surface of the convex portion 142 contacts the ground contact portion 32 arranged on the upper surface of the inspection substrate 30. For example, a ground electrode not shown is arranged on the ground contact portion 32 of the inspection substrate 30. In this way, the ground electrode 22 of the inspected object 20 and the ground contact portion 32 of the inspection substrate 30 can be electrically connected to each other through the ground probe 110, the pin block 140 and the convex portion 142.

As shown in FIG3 , the horizontal peripheral portion of the through hole 132 on the lower surface of the pin plate 130 faces the upper surface of the inspection substrate 30 in the Z direction with a gap 134 therebetween. In other words, the height of the protrusion 142 in the Z direction is greater than the thickness of the pin plate 130 in the Z direction. Therefore, the lower end surface of the protrusion 142 can be made to protrude further downward than the lower surface of the pin plate 130. Therefore, compared with the case where the lower surface of the pin plate 130 contacts the upper surface of the inspection substrate 30, the lower end surface of the protrusion 142 can be made to contact the ground contact portion 32 of the inspection substrate 30 reliably. However, the lower surface of the pin plate 130 can also contact the upper surface of the inspection substrate 30.

The two ground probes 110 are arranged at a position in the pin block 140 that overlaps with the protrusion 142 in the Z direction. Therefore, compared with the case where the two ground probes 110 are arranged at a position in the pin block 140 that is offset in the horizontal direction from the position, the two ground probes 110 and the protrusion 142 can be easily electrically connected to each other. However, the two ground probes 110 can also be arranged at a position in the pin block 140 that is offset in the horizontal direction from the above position.

Next, referring to FIG. 4 , the upper end portion and the periphery of the ground probe 110 are described.

The portion of the grounding through hole 160 that passes the retaining member 150 in the Z direction includes a large diameter hole 162, a small diameter hole 164, and a tapered hole 166. The large diameter hole 162 is located below the tapered hole 166. The upper end of the large diameter hole 162 is connected to the lower end of the tapered hole 166. The small diameter hole 164 is located above the tapered hole 166. The lower end of the small diameter hole 164 is connected to the upper end of the tapered hole 166. The horizontal diameter of the small diameter hole 164 is smaller than the horizontal diameter of the large diameter hole 162. The horizontal diameter of the tapered hole 166 decreases from the bottom to the top.

The grounding tube 112 is provided with a wide portion 112a. The horizontal diameter of the wide portion 112a of the grounding tube 112 is larger than the horizontal diameters of the upper and lower portions of the wide portion 112a of the grounding tube 112 in the Z direction. The wide portion 112a is inserted into the large diameter hole 162. The horizontal diameter of the wide portion 112a is smaller than the horizontal diameter of the large diameter hole 162. The horizontal diameter of the wide portion 112a is larger than the horizontal diameter of the portion of the grounding through hole 160 through which the pin block 140 is passed in the Z direction. Therefore, the lower surface of the wide portion 112a can be snapped onto the horizontal peripheral portion of the grounding through hole 160 on the upper surface of the pin block 140. Thereby, the lower surface of the wide portion 112a can be brought into contact with the portion of the upper surface of the pin block 140. Therefore, the wide portion 112a can be electrically connected to the upper surface of the pin block 140.

Next, referring to FIG. 3 and FIG. 4 , an example of the assembly method of the inspection device 10 is described. In this example, the inspection device 10 is assembled as follows.

First, insert each grounding probe 110 into the grounding insertion hole 160 of the pin block 140 from above the pin block 140. In this way, the wide portion 112a of the grounding probe 110 is buckled on the horizontal peripheral portion of the grounding insertion hole 160 on the upper surface of the pin block 140.

Next, overlap the pin block 140 and the retaining member 150 in the Z direction. Thus, the retaining member 150 is disposed above the pin block 140. The upper portion of each grounding probe 110 is inserted through the large diameter hole 162, the small diameter hole 164 and the tapered hole 166 of the retaining member 150.

Next, the pin block 140 and the retaining member 150 are reversed up and down. Thus, the pin block 140 is arranged above the retaining member 150. Next, in the state where the pin block 140 is arranged above the retaining member 150, each connecting probe 120 is inserted into the connecting insertion hole 170 of the pin block 140 and the retaining member 150 from above the pin block 140. Next, the pin plate 130 and the pin block 140 are overlapped in the Z direction. Thus, the portion of each connecting probe 120 located on the opposite side of the retaining member 150 is inserted into the connecting insertion hole 170 of the pin plate 130.

In this way, the inspection device 10 is assembled.

In the above example, the lower portion of the grounding probe 110 is inserted into the grounding insertion hole 160 of the pin block 140 before the upper portion of the grounding probe 110 is inserted into the large diameter hole 162, the small diameter hole 164, and the tapered hole 166. Therefore, compared with the case where the lower portion of the grounding probe 110 is inserted into the grounding insertion hole 160 of the pin block 140 after the upper portion of the grounding probe 110 is inserted into the large diameter hole 162, the small diameter hole 164, and the tapered hole 166, the wide portion 112a of the grounding probe 110 can be reliably contacted with the pin block 140.

FIG5 is a cross-sectional view showing the inspection device 10K of the comparative example together with the inspected object 20 and the inspection substrate 30. FIG6 is an enlarged view of a portion of FIG5. Except for the following, the inspection device 10K of the comparative example is the same as the inspection device 10 of the embodiment.

As shown in FIG5 , the comparative example inspection device 10K has two upper grounding probes 110K1, two lower grounding probes 110K2, two connecting probes 120K, a pin plate 130K, a pin block 140K, and a retaining member 150K.

As shown in FIG. 5 , each upper grounding probe 110K1 has an upper grounding tube 112K1 and an upper grounding plunger 114K1. The upper grounding tube 112K1 is inserted into the upper portion of the grounding insertion hole 160K. The upper portion of the grounding insertion hole 160K connects the retaining member 150K and the upper portion of the pin block 140K in the Z direction. The upper grounding plunger 114K1 is disposed on the upper end side of the upper grounding tube 112K1. The upper grounding plunger 114K1 is pushed upward. The upper end of the upper grounding plunger 114K1 can contact the grounding electrode 22 of the object 20 to be inspected.

As shown in FIG6 , the portion of the ground through hole 160K of the comparative example that passes the retaining member 150K in the Z direction includes a large diameter hole 162K, a small diameter hole 164K, and a tapered hole 166K.

As shown in FIG5 , each lower grounding probe 110K2 has a lower grounding tube 112K2 and a lower grounding plunger 114K2. The lower grounding tube 112K2 is inserted into the lower portion of the grounding through hole 160K. The lower portion of the grounding through hole 160K connects the lower portion of the pin plate 130K and the pin block 140K in the Z direction. The lower grounding plunger 114K2 is disposed on the lower end side of the lower grounding tube 112K2. The lower grounding plunger 114K2 is pushed downward. The lower end of the lower grounding plunger 114K2 can contact the grounding contact portion 32 of the inspection substrate 30.

Compare the implementation type with the comparative example.

As shown in FIG. 4 and FIG. 6 , the thickness T in the Z direction of the portion through which the upper grounding probe 110K1 is inserted in the holder 150 of the embodiment is thinner than the thickness TK in the Z direction of the portion through which the upper grounding probe 110K1 is inserted in the holder 150 of the embodiment. Therefore, compared with the comparative example, the inductance in the holder 150 can be reduced in the embodiment. Thereby, compared with the comparative example, the high-frequency characteristics of the object 20 to be inspected can be stably inspected in the embodiment. The thickness T in the Z direction of the above-mentioned portion of the holder 150 of the embodiment is, for example, not less than 0.4 mm and not more than 0.6 mm, but is not limited thereto.

As shown in FIG. 4 and FIG. 6 , the depth D in the Z direction of the large-diameter hole 162 of the embodiment is deeper than the depth DK in the Z direction of the large-diameter hole 162K of the comparative example. The depth D of the large-diameter hole 162 of the embodiment is, for example, not less than 0.4 mm and not more than 0.6 mm, but is not limited thereto.

As shown in FIG. 4 and FIG. 6 , the ratio T/D of the thickness T to the depth D of the embodiment is greater than the ratio TK/DK of the thickness TK to the depth DK of the comparative example. In the embodiment, the ratio T/D is set to 1.30, and the loss (unit: dB) of the inspection device 10 is measured under the band condition of 8 GHz. In the comparative example, the ratio TK/DK is set to 1.50, and the loss (unit: dB) of the inspection device 10K is measured under the same conditions as the embodiment. Compared with the loss in the comparative example, the loss in the embodiment is lower by about 10 dB. Therefore, it can be said that the smaller the ratio T/D of the embodiment is, the more stable the high-frequency characteristics of the inspection object 20 can be inspected. Therefore, the above ratio T/D of the implementation type can be set to less than 1.40, preferably less than 1.30.

The lower limit of the above ratio T/D of the embodiment can be determined, for example, from the perspective of the strength of the retainer 150. For example, the smaller the ratio T/D of the embodiment, the lower the strength of the retainer 150. Therefore, the above ratio T/D of the embodiment can also be set to, for example, 1.20 or more.

In the comparative example, as shown in FIG5 , the pin block 140K is electrically connected to the ground contact portion 32 of the inspection substrate 30 via the lower ground probe 110K2. The pin block 140K in the comparative example does not have the protrusion 142 whose lower end surface contacts the ground contact portion 32 as in the embodiment. In contrast, in the embodiment, as shown in FIG3 , the pin block 140 is electrically connected to the ground contact portion 32 of the inspection substrate 30 via the protrusion 142. Therefore, the contact area between the lower end surface of the protrusion 142 in the embodiment and the ground contact portion 32 of the inspection substrate 30 can be made larger than the contact area between the lower end of the lower ground probe 110K2 in the comparative example and the ground contact portion 32 of the inspection substrate 30. Therefore, compared with the comparative example, in the implementation form, the ground connection between the pin block 140 and the inspection substrate 30 can be strengthened. Thereby, compared with the comparative example, in the implementation form, the high-frequency characteristics of the inspection object 20 can be stably inspected.

The above has been described with reference to the drawings for the implementation forms of the present invention, but such implementation forms are examples of the present invention, and various structures other than those described above may also be adopted.

According to this manual, the following inspection devices are provided.

(Sample 1)

In the embodiment 1, the inspection device comprises: a probe; and an insulating block, which is provided with: a first hole for the probe to be inserted; and a second hole, which is connected to the first hole for the probe to be inserted, and the diameter of the second hole is smaller than the diameter of the first hole; and the ratio of the thickness of the insulating block to the depth of the first hole is less than 1.40.

"Probe" is equivalent to the "grounding probe" of the above-mentioned implementation. "Insulation block" is equivalent to the "retainer" of the above-mentioned implementation. "First hole" is equivalent to the "large diameter hole" of the above-mentioned implementation. "Second hole" is equivalent to the "small diameter hole" of the above-mentioned implementation.

According to the above-mentioned aspect, the smaller the ratio is, the more stably the high-frequency characteristics of the inspected object can be inspected. Therefore, compared with the case where the ratio is higher than the value in the above-mentioned aspect, the high-frequency characteristics of the inspected object can be inspected stably in the above-mentioned aspect.

(Sample 2)

In Example 2, the inspection device is further equipped with: a conductive block for the aforementioned probe to be inserted through and overlapping with the aforementioned insulating block; and

After inserting the probe into the conductive block, insert the probe into the first hole and the second hole.

The "conductive block" is equivalent to the "pin block" in the above-mentioned implementation.

According to the above-mentioned state, compared with the case where the probe is inserted into the conductive block after the probe is inserted into the first hole and the second hole, the probe can be surely contacted with the conductive block.

(Sample 3)

In form 3, the inspection device is equipped with:

Probe; and

The conductive block is for the aforementioned probe to be inserted through; and

The conductive block has a protrusion that contacts the inspection substrate.

"Probe" is equivalent to the "grounding probe" and "connection probe" in the above-mentioned implementation. "Conductive block" is equivalent to the "pin block" in the above-mentioned implementation.

According to the above-mentioned aspect, the contact area between the protrusion and the inspection substrate can be made larger than the contact area between the probe and the inspection substrate when the probe is in contact with the inspection substrate. Therefore, compared with the case where the probe is in contact with the inspection substrate, the above-mentioned aspect can strengthen the ground connection between the conductive block and the inspection substrate. Thereby, compared with the case where the probe is in contact with the inspection substrate, the above-mentioned aspect can stably inspect the high-frequency characteristics of the object to be inspected.

(Sample 4)

In aspect 4, the inspection device is further equipped with: an insulating block having a through hole for the aforementioned protrusion to pass through; and

At least a portion of the surface of the aforementioned insulating block on the side where the aforementioned inspection substrate is located faces the aforementioned inspection substrate across a gap.

"Insulation block" is equivalent to the "pin plate" in the above implementation type.

According to the above state, compared with the case where the insulating block contacts the inspection substrate, the protrusion can be reliably contacted with the inspection substrate.

(Sample 5)

In Sample 5, the probe is disposed at a position in the conductive block that overlaps with the protrusion.

According to the above-mentioned aspect, compared with the case where the probe is arranged in a position offset from the position overlapping with the protrusion in the conductive block, the probe and the protrusion can be easily electrically connected to each other.

This application claims priority based on Japanese Patent Application No. 2022-086638 filed on May 27, 2022, and all of its disclosures are incorporated herein by reference.

10: Inspection device

20: Subject of inspection

22: Ground electrode

24: Connect the electrodes

30: Check the substrate

32: Ground contact

34: Contact part

110: Ground probe

112: Grounding tube

114: Grounding plunger

120: Connect the probe

122: Connecting tube

124: First connecting plunger

126: Second connecting plunger

130: Pin plate

132:Through hole

134: Gap

140: Pin block

142: convex part

150: Retaining parts

160: Grounding through hole

170: Connecting through hole

Claims (5)

An inspection device having: Probe; and The insulating block is provided with: a first hole for the aforementioned probe to be inserted through; and a second hole connected to the aforementioned first hole for the aforementioned probe to be inserted through, and the aperture of the second hole is smaller than the aperture of the aforementioned first hole; and The ratio of the thickness of the aforementioned insulating block to the depth of the aforementioned first hole is less than 1.40. The inspection device as described in claim 1 is further equipped with: a conductive block for the aforementioned probe to be inserted through and overlapping with the aforementioned insulating block; and After the probe is inserted into the conductive block, the probe is inserted into the first hole and the second hole. An inspection device having: Probe; and The conductive block is for the aforementioned probe to be inserted through; and The conductive block has a protrusion that contacts the inspection substrate. The inspection device as described in claim 3 is further provided with: an insulating block having a through hole for the aforementioned protrusion to pass through; and At least a portion of the surface of the aforementioned insulating block on the side where the aforementioned inspection substrate is located faces the aforementioned inspection substrate across a gap. In the inspection device described in claim 3 or 4, the probe is disposed at a position in the conductive block that overlaps with the protrusion.

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