TW202408223A - 攝像元件及攝像裝置 - Google Patents
攝像元件及攝像裝置 Download PDFInfo
- Publication number
- TW202408223A TW202408223A TW112108200A TW112108200A TW202408223A TW 202408223 A TW202408223 A TW 202408223A TW 112108200 A TW112108200 A TW 112108200A TW 112108200 A TW112108200 A TW 112108200A TW 202408223 A TW202408223 A TW 202408223A
- Authority
- TW
- Taiwan
- Prior art keywords
- pixel group
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- blue
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- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
- H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
- H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
- H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
- H10F39/8023—Disposition of the elements in pixels, e.g. smaller elements in the centre of the imager compared to larger elements at the periphery
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8053—Colour filters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8057—Optical shielding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Color Television Image Signal Generators (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-050590 | 2022-03-25 | ||
| JP2022050590 | 2022-03-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202408223A true TW202408223A (zh) | 2024-02-16 |
Family
ID=88101167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112108200A TW202408223A (zh) | 2022-03-25 | 2023-03-07 | 攝像元件及攝像裝置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12615447B2 (https=) |
| EP (1) | EP4503641A4 (https=) |
| JP (1) | JPWO2023181735A1 (https=) |
| KR (1) | KR20240166529A (https=) |
| CN (1) | CN118715783A (https=) |
| TW (1) | TW202408223A (https=) |
| WO (1) | WO2023181735A1 (https=) |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006269735A (ja) | 2005-03-24 | 2006-10-05 | Sony Corp | 固体撮像装置および固体撮像装置の製造方法 |
| JP4212606B2 (ja) * | 2006-05-12 | 2009-01-21 | シャープ株式会社 | 撮像素子の製造方法 |
| JP4212605B2 (ja) * | 2006-05-12 | 2009-01-21 | シャープ株式会社 | 撮像素子および撮像素子の製造方法 |
| JP4968893B2 (ja) * | 2006-09-14 | 2012-07-04 | キヤノン株式会社 | 撮像素子及び撮像システム |
| FR2929478B1 (fr) * | 2008-03-28 | 2011-04-01 | St Microelectronics Sa | Capteur d'image a sensibilite amelioree |
| KR101012235B1 (ko) * | 2008-09-04 | 2011-02-08 | 주식회사 동부하이텍 | 이미지 센서 및 그 제조 방법 |
| JP5702625B2 (ja) | 2011-02-22 | 2015-04-15 | ソニー株式会社 | 撮像素子、撮像素子の製造方法、画素設計方法および電子機器 |
| JP6233188B2 (ja) * | 2013-12-12 | 2017-11-22 | ソニー株式会社 | 固体撮像素子およびその製造方法、並びに電子機器 |
| US10680022B2 (en) | 2013-12-12 | 2020-06-09 | Sony Corporation | Solid state imaging device, manufacturing method of the same, and electronic equipment |
| JP2015153975A (ja) * | 2014-02-18 | 2015-08-24 | ソニー株式会社 | 固体撮像素子、固体撮像素子の製造方法および電子機器 |
| JP6237431B2 (ja) | 2014-04-15 | 2017-11-29 | ソニー株式会社 | 焦点検出装置、電子機器 |
| CN107004685B (zh) * | 2014-12-18 | 2022-06-14 | 索尼公司 | 固体摄像器件和电子装置 |
| KR20200037244A (ko) | 2017-08-18 | 2020-04-08 | 소니 주식회사 | 촬상 소자 및 촬상 장치 |
| KR102423990B1 (ko) | 2017-11-22 | 2022-07-21 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 고체 촬상 소자 및 전자기기 |
| JP6970595B2 (ja) | 2017-11-24 | 2021-11-24 | ブリルニクス シンガポール プライベート リミテッド | 固体撮像装置、固体撮像装置の製造方法、および電子機器 |
| JP6607275B2 (ja) | 2018-03-28 | 2019-11-20 | ソニー株式会社 | 固体撮像装置、および電子機器 |
| KR102721299B1 (ko) | 2019-11-12 | 2024-10-25 | 삼성전자주식회사 | 이미지 센서, 그것을 포함하는 이미지 장치 및 그것의 동작 방법 |
-
2023
- 2023-02-17 JP JP2024509849A patent/JPWO2023181735A1/ja active Pending
- 2023-02-17 EP EP23774334.9A patent/EP4503641A4/en active Pending
- 2023-02-17 KR KR1020247034659A patent/KR20240166529A/ko active Pending
- 2023-02-17 CN CN202380021830.XA patent/CN118715783A/zh active Pending
- 2023-02-17 WO PCT/JP2023/005628 patent/WO2023181735A1/ja not_active Ceased
- 2023-02-17 US US18/846,379 patent/US12615447B2/en active Active
- 2023-03-07 TW TW112108200A patent/TW202408223A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US12615447B2 (en) | 2026-04-28 |
| CN118715783A (zh) | 2024-09-27 |
| KR20240166529A (ko) | 2024-11-26 |
| US20250203228A1 (en) | 2025-06-19 |
| JPWO2023181735A1 (https=) | 2023-09-28 |
| EP4503641A4 (en) | 2025-09-24 |
| EP4503641A1 (en) | 2025-02-05 |
| WO2023181735A1 (ja) | 2023-09-28 |
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