TW202407050A - 導熱性二液加成硬化型矽酮組合物、硬化物及片材 - Google Patents

導熱性二液加成硬化型矽酮組合物、硬化物及片材 Download PDF

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Publication number
TW202407050A
TW202407050A TW112126532A TW112126532A TW202407050A TW 202407050 A TW202407050 A TW 202407050A TW 112126532 A TW112126532 A TW 112126532A TW 112126532 A TW112126532 A TW 112126532A TW 202407050 A TW202407050 A TW 202407050A
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TW
Taiwan
Prior art keywords
liquid
component
group
mass
thermally conductive
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TW112126532A
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English (en)
Chinese (zh)
Inventor
多畑勇志
岩田充弘
塚田淳一
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日商信越化學工業股份有限公司
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Application filed by 日商信越化學工業股份有限公司 filed Critical 日商信越化學工業股份有限公司
Publication of TW202407050A publication Critical patent/TW202407050A/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472Five-membered rings
    • C08K5/3475Five-membered rings condensed with carbocyclic rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/544Silicon-containing compounds containing nitrogen
    • C08K5/5455Silicon-containing compounds containing nitrogen containing at least one group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/25Arrangements for cooling characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW112126532A 2022-07-26 2023-07-17 導熱性二液加成硬化型矽酮組合物、硬化物及片材 TW202407050A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022118751 2022-07-26
JP2022-118751 2022-07-26

Publications (1)

Publication Number Publication Date
TW202407050A true TW202407050A (zh) 2024-02-16

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TW112126532A TW202407050A (zh) 2022-07-26 2023-07-17 導熱性二液加成硬化型矽酮組合物、硬化物及片材

Country Status (3)

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JP (1) JPWO2024024503A1 (https=)
TW (1) TW202407050A (https=)
WO (1) WO2024024503A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2026057014A (ja) * 2024-09-20 2026-04-02 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物、ならびに製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0618860B2 (ja) * 1987-03-23 1994-03-16 タツタ電線株式会社 半導体封止用樹脂組成物
JPH0655895B2 (ja) * 1989-03-16 1994-07-27 信越化学工業株式会社 硬化性シリコーンゴム組成物
JP2002235184A (ja) * 2001-02-06 2002-08-23 Mitsubishi Cable Ind Ltd 銅または銅合金の防錆処理方法
JP2006056986A (ja) * 2004-08-19 2006-03-02 Shin Etsu Chem Co Ltd 二液硬化型シリコーン組成物
JP5606802B2 (ja) * 2009-06-02 2014-10-15 新日鐵住金株式会社 鋼管ねじ継手の防錆に適した光硬化性組成物
JP6508869B2 (ja) * 2013-02-14 2019-05-08 日東電工株式会社 粘着剤組成物、粘着剤層、粘着シート、光学部材、及びタッチパネル
JP6206240B2 (ja) * 2014-02-19 2017-10-04 株式会社オートネットワーク技術研究所 端子付き被覆電線、その製造方法及びワイヤーハーネス
KR102345272B1 (ko) * 2016-10-26 2022-01-03 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 조성물
JP2019031601A (ja) * 2017-08-07 2019-02-28 信越化学工業株式会社 付加硬化型シリコーン組成物及びシリコーンゴム硬化物
JP6915599B2 (ja) * 2018-09-07 2021-08-04 信越化学工業株式会社 熱伝導性シリコーン組成物
JP7070320B2 (ja) * 2018-10-18 2022-05-18 信越化学工業株式会社 熱伝導性シリコーン組成物
JP7627549B2 (ja) * 2020-05-26 2025-02-06 信越化学工業株式会社 二液付加硬化型シリコーンゴム組成物
JP7523870B2 (ja) * 2021-06-03 2024-07-29 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物

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WO2024024503A1 (ja) 2024-02-01
JPWO2024024503A1 (https=) 2024-02-01

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