TW202404766A - Electronic component detection device, electronic component detection method and recording media enhance determination precision by determining whether or not electronic components are supplied - Google Patents

Abstract

The invention provides an electronic component detection device, an electronic component detection method and a recording media capable of enhancing determination precision by determining whether or not electronic components are supplied. The electronic component detection device (1) comprises: a holding portion (30) having a shielded light path (35) while holding an electronic component (12); a light projection portion (31) for projecting sensor light toward a light path (35); a light receiving portion (41) for receiving the sensor light passing through the light path (35); a driving portion (50) for enabling the holding portion (30) to change the relative position relative to the light receiving portion (41); and a determination portion (90) for determining whether or not there is the electronic component (12) based upon the light receiving amount of the light receiving portion (41). The determination portion (90) stores the interrelationship of changes within the light receiving amount corresponding to the change of the relative position while the holding portion (30) that does not hold the electronic component (12) and, based upon the interrelationship, confirms detectable position range of the light receiving amount that exceeds in the threshold from the relative position, and decides the determination timing for determining whether or not there is the electronic component from the confirmed detectable position range.

Description

Electronic component detection device, electronic component detection method and recording medium

The invention of this application relates to an electronic component detection device, an electronic component detection method and an electronic component detection program.

A device that picks up electronic components such as silicon dies may include an electronic component detection device that determines whether the electronic component is picked up or released normally.

For example, Patent Document 1 discloses a die bonder. The die bonder has: a processing head including an adsorption device for adsorbing die; and an adsorption flow detection circuit including a flow sensor. The detection flow path and the bypass flow path; the air suction member sucks air through the adsorption flow detection circuit; and the control part determines whether the crystal grains are adsorbed to the adsorption device based on the detection result of the flow sensor. [Prior art documents] [Patent Document]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2014-179556

[Problem to be solved by the invention] However, in the die bonding machine described in Patent Document 1, the adsorption tool gradually deforms with use. As a result, the flow rate of the suction air may change and the determination accuracy may decrease.

The present invention was made in view of this situation, and an object of the present invention is to provide an electronic component detection device, an electronic component detection method, and an electronic component detection program with improved determination accuracy for determining the presence or absence of electronic components.

[Technical means to solve problems] An electronic component detection device according to one aspect of the present invention includes: a holding portion configured to hold the electronic component and having an optical path that is blocked when the electronic component is held; a light projecting portion that projects sensor light onto the optical path of the holding portion; The light-receiving part receives the sensor light passing through the optical path of the holding part; the driving part changes the relative position of the holding part with respect to the light-receiving part; and the determination part determines whether there are electronic components in the holding part based on the amount of light received in the light-receiving part. A determination is made, and the determination unit stores the correlation between the changes in the light reception amount in the light receiving unit corresponding to the change in the relative position when the holding unit does not hold the electronic component, and determines the light reception in the light receiving unit from the relative position based on the correlation. The detectable position range in which the quantity exceeds the threshold value is determined, and the determination timing for determining the presence or absence of electronic components is determined from the determined detectable position range.

According to this aspect, the presence or absence of the electronic component in the holding portion is determined based on changes in the amount of light received when the optical path is blocked by the electronic component. Therefore, even if the holding portion deforms or deteriorates over time, as long as the electronic components are held, the amount of light received will change sufficiently, so the presence or absence of the electronic components in the holding portion can be accurately determined. In addition, based on the correlation between the change in relative position and the change in received light amount, a detectable position range that can ensure sufficient light received amount is determined, and the determination timing is determined based on the range. Therefore, even when the detectable position range changes due to changes in the mounting positions and mounting angles of the light emitting unit and the light receiving unit, an appropriate judgment timing can be determined, thereby suppressing detection failures.

In the above aspect, the determination unit may determine whether the electronic component is present in the holding unit based on a comparison between the amount of light received by the light receiving unit and the threshold value at the determination timing.

According to the above aspect, the presence or absence of electronic components can be determined at an appropriate determination timing, so detection defects can be suppressed.

In the above aspect, the determination unit may store, as the first timing, a relative position at which the amount of light received in the light receiving unit changes from a state below the threshold to a state exceeding the threshold when the holding unit does not hold the electronic component. , when the holder does not hold the electronic component, the relative position at which the light reception amount in the light receiver changes from a state exceeding the threshold to a state below the threshold is stored as the second timing, and the difference between the first timing and the second timing is calculated. The relative position in the middle is stored as the judgment timing.

According to this aspect, since the delay between the first timing and the second timing of the determination timing is large, even if the detectable position range changes after the determination timing is determined, the determination timing will not easily deviate from the detectable position range. Therefore, sufficient light reception amount can be ensured at the judgment timing, and detection defects can be suppressed.

In the above aspect, the determination unit may store the relative position at which the light receiving amount reaches the maximum in the light receiving unit as the determination timing.

According to this aspect, even if the detectable position range changes after the determination timing is determined, it is possible to suppress a decrease in the amount of light received. Therefore, sufficient light reception amount can be ensured at the judgment timing, and detection defects can be suppressed.

In the above aspect, the holding part may have an adsorption chuck, and the optical path may be a suction hole of the adsorption chuck.

According to this aspect, there is no need to provide an optical path in the holding portion separately from the mechanism for holding the electronic components, so the structure can be simplified.

In the above aspect, the holding portion may be included in a bonding head for bonding the electronic component to the substrate.

In the above aspect, the determination unit may determine the presence or absence of the electronic components in the holding unit on a path in which the holding unit conveys the electronic components to the substrate.

According to this aspect, the presence or absence of electronic components held for bonding can be detected. For example, if it is determined in advance that the electronic component is not held on the forward path, useless movements of the bonding head can be reduced.

In the above aspect, the determination unit may store the correlation in the same path as the destination path before starting the joining, and determine the determination timing.

According to this aspect, since the correlation between changes in the relative position and changes in the amount of light received in the same path as the actual destination path is stored, the accuracy of the determination timing can be improved.

In the above aspect, the determination unit may determine the presence or absence of the electronic components in the holding unit on a return path after the holding unit transports the electronic components to the substrate.

According to this aspect, it is possible to detect electronic components held in the holding portion due to failure in bonding. At this time, the bonding head can transport the held electronic components to the substrate again and bond them, or it can release them into a recycling box. Therefore, it is possible to prevent the electronic components from being damaged due to contact with each other when trying to pick up the next electronic component while holding the electronic component.

In the above aspect, the determination unit may store the correlation in a return path after the holding unit transports the electronic component to the substrate, and determine the determination timing.

According to this aspect, when joining is performed continuously, the determination timing can be appropriately corrected. Therefore, during continuous bonding, detection failures can be suppressed even when the detectable position range changes due to changes over time in the mounting positions and mounting angles of the light emitting part and the light receiving part.

In the above aspect, the determination unit may determine the threshold based on the amount of light emitted by the light emitting unit.

According to this aspect, even when the amount of light emission changes, an appropriate detectable position range can be determined, and an appropriate determination timing can be determined.

An electronic component detection method according to another aspect of the present invention is an electronic component detection method using an electronic component detection device. The electronic component detection device includes a holding portion configured to hold the electronic component, and has a function for holding the electronic component. The light path is blocked; the light projecting part projects the sensor light to the light path of the holding part; the light receiving part receives the sensor light that has passed through the light path of the holding part; the driving part adjusts the relative position of the holding part relative to the light receiving part Change; and a determination unit that determines whether there is an electronic component in the holding part based on the amount of light received in the light receiving part, and the electronic component detection method includes: corresponding to the change in relative position when the storage holding part does not hold the electronic component. The mutual relationship between the changes in the light receiving amount in the light receiving part; and based on the mutual relationship, determine the detectable position range in which the light receiving amount in the light receiving part exceeds the threshold value from the relative position, and determine whether there are electrons or not from the determined detectable position range. Judgment timing for parts to be judged.

According to this aspect, the presence or absence of the electronic component in the holding portion is determined based on changes in the amount of light received when the optical path is blocked by the electronic component. Therefore, even if the holding portion deforms or deteriorates over time, as long as the electronic components are held, the amount of light received will change sufficiently, so the presence or absence of the electronic components in the holding portion can be accurately determined. In addition, based on the correlation between the change in relative position and the change in received light amount, a detectable position range that can ensure sufficient light received amount is determined, and the determination timing is determined based on the range. Therefore, even when the detectable position range changes due to changes in the mounting positions and mounting angles of the light emitting unit and the light receiving unit, an appropriate judgment timing can be determined, thereby suppressing detection failures.

An electronic component detection program according to another aspect of the present invention is an electronic component detection program that causes an electronic component detection device to operate. The electronic component detection device includes a holding portion configured to hold the electronic component, and has a function when holding the electronic component. The blocked optical path; the light projecting part projects the sensor light to the optical path of the holding part; the light receiving part receives the sensor light that has passed through the optical path of the holding part; the driving part changes the relative position of the holding part with respect to the light receiving part ; and a determination unit that determines the presence or absence of electronic components in the holding portion based on the amount of light received in the light receiving portion, and the electronic component detection program causes the computer to execute: store the change in relative position when the holding portion does not hold the electronic components. The mutual relationship between the changes in the light receiving amount in the corresponding light receiving part; and based on the mutual relationship, determine the detectable position range in which the light receiving amount in the light receiving part exceeds the threshold value from the relative position, and determine whether there is any detectable position range from the determined detectable position range. Judgment timing for electronic parts to be judged.

According to this aspect, the presence or absence of the electronic component in the holding portion is determined based on changes in the amount of light received when the optical path is blocked by the electronic component. Therefore, even if the holding portion deforms or deteriorates over time, as long as the electronic components are held, the amount of light received will change sufficiently, so the presence or absence of the electronic components in the holding portion can be accurately determined. In addition, based on the correlation between the change in relative position and the change in received light amount, a detectable position range that can ensure sufficient light received amount is determined, and the determination timing is determined based on the range. Therefore, even when the detectable position range changes due to changes in the mounting positions and mounting angles of the light emitting unit and the light receiving unit, an appropriate judgment timing can be determined, thereby suppressing detection failures.

[Effects of the invention] According to the invention of the present application, it is possible to provide an electronic component detection device, an electronic component detection method, and an electronic component detection program with improved determination accuracy for determining the presence or absence of electronic components.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings of this embodiment are examples, and the size or shape of each part is schematic, and the technical scope of the present invention should not be understood to be limited to the embodiment.

＜Electronic parts detection device＞ First, the structure of the electronic component detection device 1 according to one embodiment of the present invention will be described with reference to FIGS. 1 and 2 . FIG. 1 is a diagram showing the structure of an electronic component detection device according to an embodiment. FIG. 2 is an enlarged view showing the structure of the bonding head.

In addition, in FIGS. 1 and 2 , orthogonal coordinates including the X-axis, Y-axis, and Z-axis are labeled for convenience in describing positional relationships, movement directions, and the like. Let the directions parallel to the X-axis, Y-axis, and Z-axis respectively be the X-axis direction, the Y-axis direction, and the Z-axis direction. The X-axis direction is perpendicular to the paper surface, the Y-axis direction is the left-right direction of the paper surface, and the Z-axis direction is the up-down direction of the paper surface.

The electronic component inspection device 1 is provided in a so-called die bonding machine, a packaging device that bonds a crystal grain (semiconductor wafer (chip)) 12 to a lead frame 21 . The electronic component detection device 1 detects the die 12 being transported for bonding, and determines whether the die 12 is being transported normally. The crystal grain 12 corresponds to an example of an electronic component, and the lead frame 21 corresponds to an example of a substrate.

In addition, the electronic components are not limited to the die 12, and may also be active components, passive components, or micro-electro-mechanical system (Micro-Electro-Mechanical System, MEMS) devices, for example. The substrate is not limited to the lead frame 21, and may also be an interposer substrate, a semiconductor substrate, a carrier board, etc., for example.

The electronic component inspection device 1 includes a pickup unit 10 , a bonding stage 20 , a bonding head 30 , a light receiving unit 41 , a drive unit 50 and a determination unit 90 .

The pickup unit 10 transports the wafer 11 as a collective substrate of the die 12 and supplies the die 12 to the bonding head 30 . The pickup unit 10 corresponds to an example of an electronic component supply unit that supplies electronic components. The electronic parts supply unit may be, for example, a tray feeder, a parts feeder, a tape feeder, or the like.

The bonding stage 20 supplies the lead frame 21 . In addition, the bonding stage 20 is a stage for bonding the die 12 to the transported lead frame 21 . The bonding stage 20 can also serve as a movable stage for transporting the lead frame 21 . The bonding stage 20 is arranged side by side with the pickup part 10 in the Y-axis direction. The bonding stage 20 corresponds to an example of a bonding portion that performs bonding of electronic components to a substrate. The die bonding machine including the electronic component detection device 1 may include, for example, a substrate supply unit that supplies substrates accommodated in a cassette, a loader that takes out the substrates from the cassette and transports them to the bonding portion, and transports the packaged electronic components from the bonding portion. It is composed of components not shown in the figure, such as an unloader that stores the substrates of the parts in a magazine, a guide rail that slides and transports the substrates, or a substrate indexer that aligns the substrates.

The bonding head 30 is configured to pick up the die 12 . In addition, the bonding head 30 is configured to be able to bond the die 12 to the lead frame 21 . The bonding head 30 includes a light projecting part 31 , an adsorption chuck 33 , and an optical path 35 .

The light projector 31 projects the sensor light SL onto the optical path 35 . The light projecting unit 31 is the sensor head of the pair of sensor heads of the optical fiber sensor that is optically connected to the light projecting element. The light projecting part 31 is provided at the end of the bonding head 30 on the driving part 50 side. The light projecting unit 31 has a light projecting lens 32 . The light projecting lens 32 faces the optical path 35 in the Z-axis direction. The light projecting unit 31 projects the sensor light SL from the light projecting lens 32 to the optical path 35 .

In addition, the light projection unit 31 may further include a light emission sensor that detects the light emission amount of the sensor light SL.

The adsorption chuck 33 is a holding tool that adsorbs and holds the die 12 at the front end. The suction chuck 33 is provided at the end of the bonding head 30 opposite to the driving part 50 . The suction chuck 33 corresponds to an example of a holding portion configured to hold electronic components. However, as long as the holding portion can hold electronic components, it is not limited to the suction chuck. The holding part may be, for example, an electrostatic chuck that electrically adsorbs the electronic components, or a mechanical chuck that mechanically supports the electronic components.

The optical path 35 is a through hole that penetrates at least the suction chuck 33 of the bonding head 30 in the Z-axis direction. The optical path 35 is a suction hole of the suction chuck 33 and is connected to a suction tool that sucks air to cause the optical path 35 to become a negative pressure. As shown in FIG. 2 , when the die 12 is held by the suction chuck 33 , the light path 35 is blocked. That is, when the suction chuck 33 holds the die 12, the sensor light SL is not emitted from the front end of the suction chuck 33. When the suction chuck 33 does not hold the die 12, the sensor light SL is emitted from the suction chuck 33. 33's front end shot out.

In addition, although illustration is omitted, the bonding head 30 may further include a suction tool for sucking air from the optical path 35 , a heating tool for heating the die 12 , a cooling tool for cooling the die 12 , and a supply forming tool. Purge gas supply tools for purge gas in a non-oxidizing atmosphere, etc.

The light receiving unit 41 receives the sensor light SL that has passed through the optical path 35 . The light-receiving part 41 is the sensor head of the pair of sensor heads of the fiber optic sensor that is optically connected to the light-receiving element. The light-receiving element is a photoelectric sensor that outputs an electrical signal with an intensity corresponding to the amount of light received. The light receiving unit 41 has a light receiving lens 42 . The light-receiving lens 42 faces the light-emitting lens 32 across the optical path 35 in the Z-axis direction in the conveyance path of the bonding head 30 to the die 12 . The light receiving unit 41 receives the sensor light SL in the light receiving lens 42 .

The drive unit 50 is an orthogonal robot that moves the bonding head 30 in the X-axis direction, the Y-axis direction, and the Z-axis direction. The drive unit 50 includes an X-axis actuator 51 , a Y-axis actuator 52 , and a Z-axis actuator 53 . The X-axis actuator 51 moves the bonding head 30 along the X-axis direction, the Y-axis actuator 52 moves the bonding head 30 along the Y-axis direction, and the Z-axis actuator 53 moves the bonding head 30 along the Z-axis direction. .

When the bonding head 30 picks up the die 12 , the driving unit 50 moves the bonding head 30 along the X-axis direction, the Y-axis direction, and the Z-axis direction. When the bonding head 30 transports the die 12 from the pickup unit 10 to the bonding stage 20 , the driving unit 50 fixes the bonding head 30 in the X-axis direction and moves it in the Y-axis direction and the Z-axis direction. At this time, the driving unit 50 moves the bonding head 30 along a consistent conveyance path passing above the light receiving unit 41 . When the bonding head 30 bonds the die 12 to the lead frame 21 , the driving unit 50 moves the bonding head 30 along the X-axis direction, the Y-axis direction, and the Z-axis direction.

In addition, the driving unit is not limited to an orthogonal robot, but may also be a robotic manipulator. In addition, the driving unit may move the light receiving unit by changing the relative position of the light projecting unit relative to the light receiving unit, or may move both the light projecting unit and the light receiving unit.

When the bonding head 30 that does not hold the die 12 is moved, the determination unit 90 determines the detectable position range in which the light reception amount in the light receiving unit 41 exceeds the threshold value as the position on the Y-axis of the bonding head 30 . In addition, the determination unit 90 determines the determination timing for determining the presence or absence of the crystal grain 12 from the detectable position range. When the bonding head 30 holding the die 12 is moved, the determination unit 90 determines the presence or absence of the die 12 based on a comparison between the amount of light received at the determination timing and a threshold value. Specifically, the determination unit 90 determines that the die 12 is held in the bonding head 30 when the light reception amount is smaller than the threshold value, and determines that the die 12 is not held in the bonding head 30 when the light reception amount is greater than the threshold value.

The determination unit 90 includes a head control unit 91, a light emission/light reception control unit 92, a light amount determination unit 93, a position information storage unit 94, and a timing determination unit 95. Each component of the determination unit 90 includes computer hardware, software, or a combination thereof. That is, the determination unit 90 is executed by computer hardware, software, or their cooperation. A computer includes a central processing unit (CPU) and storage. The program of the present invention is stored in the memory. The CPU is configured to realize the functions of the head control unit 91 , light emission/light reception control unit 92 , light amount determination unit 93 , position information storage unit 94 and timing determination unit 95 by executing the program stored in the memory.

The head control unit 91 controls the driving unit 50 to move the bonding head 30 in the X-axis direction, the Y-axis direction, and the Z-axis direction. In addition, the head control unit 91 may also control the suction tool, heating tool, cooling tool, and purge gas supply tool of the bonding head 30 to cause the bonding head 30 to pick up, release, and bond the dies 12 .

The light emitting/light receiving control unit 92 controls the light emitting unit 31 and the light receiving unit 41 . For example, when the bonding head 30 moves on the conveyance path of the die 12, the light emitting/light receiving control unit 92 turns on the light emitting element of the light emitting part 31 and the light receiving element of the light receiving part 41. When the bonding head 30 moves outside the transport path of the die 12 or when the bonding head 30 stops, the light emitting/light receiving control unit 92 puts the light emitting element of the light emitting part 31 and the light receiving element of the light receiving part 41 in an off state. In addition, the light emitting/light receiving control unit 92 may keep the light emitting element of the light emitting part 31 and the light receiving element of the light receiving part 41 in an on state while the electronic component detection device 1 is powered on.

The light amount determination unit 93 compares the received light amount with a threshold value. Specifically, the light amount determination unit 93 determines whether the received light amount is less than a threshold or greater than or equal to the threshold. When the bonding head 30 that does not hold the die 12 is moved, the light amount determination unit 93 compares the received light amount with a threshold value over substantially the entire area of the conveyance path of the die 12 by the bonding head 30 . In addition, when moving the bonding head 30 in which it is unclear whether or not the die 12 is held, the light amount determination unit 93 compares the received light amount with a threshold value at the determination timing determined by the timing determination unit 95 . In addition, the light amount determination unit 93 may determine the threshold based on the minimum value, maximum value, average value, etc. of the received light amount.

In addition, the light amount determination unit 93 may determine the light amount considering the amount of light emitted. Specifically, it may be determined whether the difference or ratio between the amount of light emitted and the amount of light received is less than a threshold or greater than or equal to the threshold. In addition, the light amount determination unit 93 may determine the threshold based on the amount of light emitted, or may determine the threshold based on a difference between the amount of light emitted and the amount of light received, or a minimum value, a maximum value, an average value of a ratio, or the like. The light emission amount is, for example, a setting value of the light emission element, but may also be a detection value detected by a light emission sensor.

The position information storage unit 94 stores position information of the bonding head 30 in the X-axis direction, the Y-axis direction, and the Z-axis direction. At this time, the position information storage unit 94 associates the determination result of the light amount determination unit 93 with the position information and stores it. Specifically, when the bonding head 30 does not hold the die 12 , the relationship between the change in the amount of light received according to the change in the position of the bonding head 30 is stored.

Based on the correlation stored in the position information storage unit 94 , the timing determination unit 95 determines as a detectable position range a position range in which the amount of light received is equal to or greater than the threshold when the bonding head 30 not holding the die 12 is moved. The timing determination unit 95 determines the determination timing from the determined detectable position range. The determination timing is a position at which the presence or absence of the crystal grain 12 is determined when the bonding head 30 holding the crystal grain 12 is moved. When transporting the die 12 , the bonding head 30 moves along a consistent transport path that passes above the light receiving portion 41 . Therefore, a position where a sufficient amount of light reception is ensured when the bonding head 30 does not hold the die 12 can be set as the determination timing. Therefore, at the determination timing, when the bonding head 30 holds the die 12 , the light reception amount becomes smaller than the threshold value, and when the bonding head 30 does not hold the die 12 , the light reception amount becomes greater than or equal to the threshold value.

The determination timing is determined to be the center of the detectable position range, for example. When the bonding head 30 moves in the Y-axis direction above the light receiving unit 41, the intermediate position in the Y-axis direction among the detectable position range is determined as the determination timing. Specifically, when the bonding head 30 does not hold the die 12 , the intermediate position between the position where the light reception amount changes from a state below the threshold value to a state above the threshold value and the position where the light reception amount changes from a state above the threshold value to a state below the threshold value is determined. To determine the timing.

In addition, the determination timing is not limited to the intermediate position. The determination timing can be appropriately determined from the detectable position range, and for example, it can be determined to the position where the amount of light received reaches the maximum when the bonding head 30 does not hold the die 12 .

＜Electronic parts inspection method＞ Next, an electronic component detection method using the electronic component detection device 1 according to an embodiment of the present invention will be described with reference to FIGS. 3 to 7 . FIG. 3 is a flowchart showing a method of determining a judgment timing. FIG. 4 is a flowchart showing a method of determining the presence or absence of electronic components. FIG. 5 is a diagram illustrating a method of determining a determination timing. 6 and 7 are diagrams showing the status of a method of determining the presence or absence of electronic components. The horizontal axis of the timing chart shown in the lower part of FIGS. 5 and 6 represents the position of the light projector 31 in the Y-axis direction.

First, a method of determining the judgment timing will be described with reference to FIG. 3 . First, it is confirmed that the die 12 is not held in the bonding head 30 ( S11 ), and the operations of the light emitting unit 31 and the light receiving unit 41 are started ( S12 ). The light emitting element of the light emitting section 31 starts to emit light, and the light receiving element of the light receiving section 41 is brought into a state capable of receiving light. Step S12 is executed by the light emission/light reception control unit 92 of the determination unit 90 .

Next, the bonding head 30 is moved along the forward path during the bonding operation (S13). When the bonding head 30 joins the die 12 , the bonding head 30 moves along the forward path of the conveyance path while holding the die 12 , releases the die 12 to the lead frame 21 , and moves along the forward path along the forward path. The return path that advances in the opposite direction moves on the transport path without holding the crystal grains 12 . In step S13 , the bonding head 30 that does not hold the die 12 is moved on the same path as the forward path. Step S13 is executed by the head control unit 91 of the determination unit 90 .

Next, the relationship between the change in the position of the bonding head 30 and the change in the amount of light received is stored ( S14 ). As shown in FIG. 5 , when the bonding head 30 holds the die 12 and moves on the forward path, the light receiving amount becomes greater than or equal to the threshold within the position range where the light receiving lens 42 of the light receiving unit 41 is located on the extension line of the optical path 35 . In the position range before and after the light-receiving lens 42 of the light-receiving unit 41 is located on the extension line of the optical path 35 , the amount of light received is smaller than the threshold value. The position where the light reception amount changes from a state below the threshold value to a state above the threshold value is stored as the first timing T1, and the position where the light reception amount changes from a state above the threshold value to a state below the threshold value is stored as the second timing T2. The distance between the first timing T1 and the second timing T2 is substantially equal to the size of the light-receiving lens 42 in the Y-axis direction. Step S14 is executed by the light amount determination unit 93 and the position information storage unit 94 of the determination unit 90 .

Next, the determination timing TD is determined from the detectable position range (S15). As shown in FIG. 5 , the position range from the first timing T1 to the second timing T2 is determined as the detectable position range in which the received light amount exceeds the threshold value. Next, the intermediate position between the first timing T1 and the second timing T2 is calculated and stored as the determination timing TD. That is, the determination timing TD is calculated according to the following formula TD=(T1+T2)/2. Step S15 is executed by the timing determination unit 95 of the determination unit 90 .

In addition, the determination timing TD is not limited to TD=(T1+T2)/2 as long as it satisfies the relationship of T1<TD<T2. It can be T1<TD<(T1+T2)/2, or it can be (T1+T2)/2<TD<T2.

Next, a method of determining the presence or absence of electronic components will be described with reference to FIG. 4 . First, the die 12 is picked up from the pickup part 10 (S21), and the die 12 is conveyed by the bonding head 30 (S22). Steps S21 and S22 are executed by the head control unit 91 of the determination unit 90 .

Next, at the determination timing TD of the forward path, the presence or absence of the crystal grain 12 is determined (S23). As shown in FIG. 6 , using the arrival determination timing TD of the bonding head 30 as a trigger event, the determination process of comparing the received light amount with a threshold value is executed. When the amount of received light is lower than the threshold value in the determination process, it is determined that the die 12 is present in the bonding head 30 , that is, the pickup of the die 12 is performed normally, and the process proceeds to the next step. If the amount of received light exceeds the threshold in the determination process, it is determined that there is no die 12 in the bonding head 30 , that is, the pickup of the die 12 is not performed normally, and the process is restarted from step S21 . At this time, the bonding head 30 is returned to the position of the pickup part 10 and the die 12 is picked up from the pickup part 10 . Step S23 is executed by the light amount determination unit 93 and the head control unit 91 of the determination unit 90 .

When it is determined that the die 12 is present in the bonding head 30 , the die 12 is bonded to the lead frame 21 ( S24 ), and the presence or absence of the die 12 is determined at the return path determination timing TD ( S25 ). As shown in FIG. 7 , similar to step S23 , using the arrival determination timing TD of the bonding head 30 as a trigger event, a determination process of comparing the received light amount with a threshold value is executed. When the amount of received light exceeds the threshold value in the determination process, it is determined that there is no die 12 in the bonding head 30 , that is, the release of the die 12 is normally performed, and the determination of the presence or absence of the electronic component is completed. If the amount of received light is lower than the threshold value in the determination process, it is determined that the die 12 is present in the bonding head 30 , that is, the release of the die 12 is not performed normally, and the process is restarted from step S24 . At this time, the bonding head 30 is returned to the position of the bonding stage 20 and the die 12 is bonded to the lead frame 21 . Step S24 is executed by the head control unit 91 of the determination unit 90 , and step S25 is executed by the light amount determination unit 93 and the head control unit 91 of the determination unit 90 .

In addition, when it is determined in step S25 that the release of the die 12 is not performed normally, the die 12 held in the bonding head 30 may be released into a recycling box (not shown). Such a recycling box is provided between the pickup part 10 and the light receiving part 41 in the conveyance path of the bonding head 30, for example. Accordingly, after the determination in step S25 , the die 12 can be released without the bonding head 30 being separated from the return path. Therefore, picking up of the next die 12 can be started immediately, so that manufacturing efficiency can be improved.

As described above, the electronic component inspection device 1 according to one aspect of the present invention includes: an adsorption chuck 33 having an optical path 35 that is blocked when holding the die 12; and a light projection unit 31 that projects sensor light toward the optical path 35. SL; the light receiving unit 41 receives the sensor light SL that has passed through the optical path 35; the driving unit 50 moves the bonding head 30; and the determining unit 90 determines the presence or absence of the die 12 based on the amount of light received. Furthermore, the determination unit 90 stores the correlation of the changes in the received light amount corresponding to the change in the position of the bonding head 30 , determines the detectable position range in which the received light amount exceeds the threshold based on the correlation, and determines the determination timing TD from the detectable position range.

Accordingly, based on the change in the amount of light received when the optical path 35 is blocked by the crystal grain 12, the presence or absence of the crystal grain 12 in the suction chuck 33 is determined. Therefore, even if the suction chuck 33 deforms or deteriorates over time, as long as the crystal grains 12 are retained, the amount of light received will change sufficiently, so the presence or absence of the crystal grains 12 in the suction chuck 33 can be accurately determined. In addition, based on the relationship between the change in the position of the bonding head 30 and the change in the amount of received light, a detectable position range that can ensure a sufficient amount of received light is determined, and the determination timing is determined based on this range. Therefore, even when the detectable position range changes due to changes in the mounting positions and mounting angles of the light emitting unit 31 and the light receiving unit 41, the appropriate determination timing TD can be determined, thereby suppressing detection failures.

As one form, the determination unit 90 determines the presence or absence of the crystal grain 12 in the suction chuck 33 based on the comparison between the light reception amount and the threshold value at the determination timing TD.

According to this, the presence or absence of the crystal grain 12 can be determined at the appropriate determination timing TD, so detection defects can be suppressed.

As one form, the determination unit 90 stores the first timing T1 when the light reception amount changes from a state below the threshold value to a state above the threshold value, and the second timing T2 when the light reception amount changes from a state above the threshold value to a state below the threshold value, and calculates The intermediate position between the first timing T1 and the second timing T2 is stored as the determination timing TD.

Accordingly, since the time delay of the determination timing TD relative to the first timing T1 and the second timing T2 is large, even if the detectable position range changes after the determination timing TD is determined, the determination timing TD will not easily deviate from the detectable position range. Therefore, a sufficient amount of light reception can be ensured at the determination timing TD, and detection defects can be suppressed.

As one form, the determination unit 90 stores the position where the light reception amount reaches the maximum as the determination timing TD.

According to this, even if the detectable position range changes after the determination timing TD is determined, a decrease in the amount of light received can be suppressed. Therefore, a sufficient amount of light reception can be ensured at the determination timing TD, and detection defects can be suppressed.

As one form, the optical path 35 is a suction hole of the suction chuck 33 .

According to this, since there is no need to provide the optical path 35 separately from the mechanism for holding the die 12, the structure of the bonding head 30 can be simplified.

As one form, the suction chuck 33 is included in a bonding head for bonding the die 12 to the lead frame 21 .

As one form, the determination unit 90 determines whether or not the crystal grain 12 is present in the suction chuck 33 on the path in which the suction chuck 33 transports the crystal grain 12 to the lead frame 21 .

Accordingly, the presence or absence of the crystal grain 12 held for bonding can be detected. For example, if it is determined in advance that the die 12 is not held on the forward path, useless movements of the bonding head 30 can be reduced.

As one aspect, the determination unit 90 stores the correlation in the same path as the destination path before starting the joining, and determines the determination timing TD.

According to this, since the relationship between the change in the position of the bonding head 30 and the change in the amount of light received on the same path as the actual destination path is stored, the accuracy of the determination timing TD can be improved.

As one form, the determination unit 90 determines the presence or absence of the die 12 in the adsorption chuck 33 on the return path after the adsorption chuck 33 transports the die 12 to the lead frame 21 .

Accordingly, it is possible to detect the die 12 held in the adsorption chuck 33 due to the failure of bonding. At this time, the bonding head may transport the retained die 12 to the substrate again for bonding, or may release it into a recycling box. Therefore, it is possible to suppress the occurrence of damage to the crystal grains 12 and the like due to contact between the crystal grains 12 while trying to pick up the next crystal grain 12 while holding the crystal grain 12 .

As one form, the determination unit 90 stores the correlation in the return path after the suction chuck 33 transports the die 12 to the lead frame 21, and determines the determination timing TD.

Accordingly, when welding is continuously performed, the determination timing TD can be appropriately corrected. Therefore, during continuous bonding, detection failures can be suppressed even when the detectable position range changes due to changes over time in the mounting positions and mounting angles of the light emitting unit 31 and the light receiving unit 41 .

As one form, the determination unit 90 determines the threshold based on the amount of light emitted.

According to this, even when the amount of light emitted changes, an appropriate detectable position range can be determined, and an appropriate determination timing can be determined.

An electronic component detection method according to another aspect of the present invention is an electronic component detection method that performs detection using the electronic component detection device 1 . The electronic component detection method includes storing a change in the amount of received light corresponding to a change in the position of the bonding head 30 . a mutual relationship; and based on the mutual relationship, a detectable position range in which the received light amount exceeds the threshold is determined, and the determination timing TD is determined from the detectable position range.

Accordingly, based on the change in the amount of light received when the optical path 35 is blocked by the crystal grain 12, the presence or absence of the crystal grain 12 in the suction chuck 33 is determined. Therefore, even if the suction chuck 33 deforms or deteriorates over time, as long as the crystal grains 12 are retained, the amount of light received will change sufficiently, so the presence or absence of the crystal grains 12 in the suction chuck 33 can be accurately determined. In addition, based on the relationship between the change in the position of the bonding head 30 and the change in the amount of received light, a detectable position range that can ensure a sufficient amount of received light is determined, and the determination timing TD is determined based on the range. Therefore, even when the detectable position range changes due to changes in the mounting positions and mounting angles of the light emitting unit 31 and the light receiving unit 41, the appropriate determination timing TD can be determined, thereby suppressing detection failures.

An electronic component detection program according to another aspect of the present invention is an electronic component detection program that causes the electronic component detection device 1 to operate, and the electronic component detection program causes a computer to store changes in the amount of received light corresponding to changes in the position of the bonding head 30 . The mutual relationship; and based on the mutual relationship, determine the detectable position range in which the received light amount exceeds the threshold, and determine the determination timing TD from the detectable position range.

Accordingly, based on the change in the amount of light received when the optical path 35 is blocked by the crystal grain 12, the presence or absence of the crystal grain 12 in the suction chuck 33 is determined. Therefore, even if the suction chuck 33 deforms or deteriorates over time, as long as the crystal grains 12 are retained, the amount of light received will change sufficiently, so the presence or absence of the crystal grains 12 in the suction chuck 33 can be accurately determined. In addition, based on the relationship between the change in the position of the bonding head 30 and the change in the amount of received light, a detectable position range that can ensure a sufficient amount of received light is determined, and the determination timing TD is determined based on the range. Therefore, even when the detectable position range changes due to changes in the mounting positions and mounting angles of the light emitting unit 31 and the light receiving unit 41, the appropriate determination timing TD can be determined, thereby suppressing detection failures.

In addition, the electronic component inspection device, electronic component inspection method, and electronic component inspection program according to one aspect of the present invention can also be applied to packaging devices other than die bonding machines, such as flip-chip bonding machines. When the electronic component inspection device is installed in a flip-chip bonding machine, the electronic component can be inspected by a pick-up head that inverts the electronic component, or by transferring flux to the bump electrode of the electronic component. Implemented in the flux supply department. In addition, the detection of electronic components may be performed between the electronic component supply part and the flux supply part, or between the flux supply part and the substrate supply part. The electronic component inspection device, the electronic component inspection method, and the electronic component inspection program according to one aspect of the present invention can also be installed in various devices other than packaging devices, such as a conveying device or a resin sealing device.

As described above, according to one aspect of the present invention, it is possible to provide an electronic component detection device, an electronic component detection method, and an electronic component detection program with improved determination accuracy for determining the presence or absence of electronic components.

The above-described embodiments are provided to facilitate understanding of the present invention and are not intended to limitively interpret the present invention. Each component included in the embodiment and its arrangement, materials, conditions, shape, size, etc. are not limited to the illustrated contents and can be changed appropriately. In addition, structures shown in different embodiments can be partially replaced or combined with each other.

1: Electronic parts detection device 10: Picking up department 11:wafer 12: Crystal grains (semiconductor wafers, electronic components) 20:Join the carrier 21: Lead frame 30: Joint head (holding part) 31:Light projection department 32:Light projection lens 33: Adsorption chuck 35:Light path 41:Light receiving part 42:Light receiving lens 50:Drive Department 51:X-axis actuator 52:Y-axis actuator 53:Z-axis actuator 90:Judgment Department 91:Head control part 92: Light emitting/light receiving control section 93: Light quantity judgment part 94: Location information storage department 95: Timing Decision Department S11, S12, S13, S14, S15, S21, S22, S23, S24, S25: Steps SL: sensor light T1: first opportunity T2: The second opportunity TD: Decision time X, Y, Z: axis

FIG. 1 is a diagram showing the structure of an electronic component detection device according to an embodiment. FIG. 2 is an enlarged view showing the structure of the bonding head. FIG. 3 is a flowchart showing a method of determining a judgment timing. FIG. 4 is a flowchart showing a method of determining the presence or absence of electronic components. FIG. 5 is a diagram illustrating a method of determining a determination timing. FIG. 6 is a diagram showing the status of a method of determining the presence or absence of electronic components. FIG. 7 is a diagram showing the status of a method of determining the presence or absence of electronic components.

1: Electronic parts detection device

10: Picking up department

11:wafer

12:Grain

20:Join the carrier

21: Lead frame

30:joint head

31:Light projection department

33: Adsorption chuck

41:Light receiving part

50:Drive Department

51: Actuator

52:Y-axis actuator

53:Z-axis actuator

90:Judgment Department

91:Head control part

92: Light emitting/light receiving control section

93: Light quantity judgment part

94: Location information storage department

95: Timing Decision Department

SL: sensor light

X, Y, Z: axis

Claims (13)

An electronic parts detection device, including: The holding part is configured to hold the electronic component and has an optical path that is blocked when holding the electronic component; a light projecting part that projects sensor light onto the optical path of the holding part; a light receiving part that receives the sensor light that has passed through the optical path of the holding part; a driving part that changes the relative position of the holding part with respect to the light receiving part; and a determining unit that determines whether or not the electronic component is present in the holding unit based on the amount of light received by the light receiving unit, The determination part storing the relationship between changes in the amount of light received in the light receiving portion corresponding to changes in the relative position when the holding portion does not hold the electronic component, Based on the mutual relationship, a detectable position range in which the amount of light received in the light receiving portion exceeds a threshold is determined from the relative positions, and a method for determining the presence or absence of the electronic component is determined from the determined detectable position range. Determine the timing. The electronic parts detection device according to claim 1, wherein The determination unit determines whether the electronic component is present in the holding unit based on a comparison of the amount of light received by the light receiving unit and the threshold value at the determination timing. The electronic parts detection device according to claim 1, wherein The determination part When the holding portion does not hold the electronic component, the relative position at which the light receiving amount in the light receiving portion changes from a state below the threshold to a state exceeding the threshold is stored as a first timing, When the holding portion does not hold the electronic component, the relative position at which the light receiving amount in the light receiving portion changes from a state exceeding the threshold value to a state below the threshold value is stored as a second timing, The relative position between the first timing and the second timing is calculated and stored as the determination timing. The electronic parts detection device according to claim 1, wherein The determination unit stores the relative position at which the light receiving amount reaches the maximum in the light receiving unit as the determination timing. The electronic parts detection device according to claim 1, wherein The holding part has an adsorption chuck, The optical path is the suction hole of the adsorption chuck. The electronic parts detection device according to claim 1, wherein The holding portion is included in a bonding head for bonding the electronic component to the substrate. The electronic parts detection device according to claim 6, wherein The determination unit determines whether or not the electronic component is present in the holding unit on a path in which the holding unit transports the electronic component to the substrate. The electronic parts detection device according to claim 7, wherein The determination unit stores the correlation in the same path as the destination path before starting the joining, and determines the determination timing. The electronic parts detection device according to claim 6, wherein The determination unit determines whether or not the electronic component is present in the holding unit on a return path after the holding unit transports the electronic component to the substrate. The electronic parts detection device according to claim 6, wherein The determination unit stores the correlation in a return path after the holding unit transports the electronic component to the substrate, and determines the determination timing. The electronic parts detection device according to claim 1, wherein The determination unit determines the threshold based on the amount of light emitted by the light emitting unit. An electronic parts detection method is an electronic parts detection method using an electronic parts detection device for detection. The electronic parts detection device includes: The holding part is configured to hold the electronic component and has an optical path that is blocked when holding the electronic component; a light projecting part that projects sensor light onto the optical path of the holding part; a light receiving part that receives the sensor light that has passed through the optical path of the holding part; a driving part that changes the relative position of the holding part with respect to the light receiving part; and a determining unit that determines whether or not the electronic component is present in the holding unit based on the amount of light received by the light receiving unit, The electronic parts detection method includes: Stores a correlation between changes in the amount of light received in the light receiving portion corresponding to changes in the relative position when the holding portion does not hold the electronic component; and Based on the mutual relationship, a detectable position range in which the amount of light received in the light receiving portion exceeds a threshold is determined from the relative positions, and a method for determining the presence or absence of the electronic component is determined from the determined detectable position range. Determine the timing. A computer-readable recording medium stores an electronic component detection program, which is an electronic component detection program that causes an electronic component detection device to run. The electronic component detection device includes: The holding part is configured to hold the electronic component and has an optical path that is blocked when holding the electronic component; a light projecting part that projects sensor light onto the optical path of the holding part; a light receiving part that receives the sensor light that has passed through the optical path of the holding part; a driving part that changes the relative position of the holding part with respect to the light receiving part; and a determining unit that determines whether or not the electronic component is present in the holding unit based on the amount of light received by the light receiving unit, The electronic component detection program causes the computer to execute: Stores a correlation between changes in the amount of light received in the light receiving portion corresponding to changes in the relative position when the holding portion does not hold the electronic component; and Based on the mutual relationship, a detectable position range in which the amount of light received in the light receiving portion exceeds a threshold is determined from the relative positions, and a method for determining the presence or absence of the electronic component is determined from the determined detectable position range. Determine the timing.