TW202346393A - 光與濕氣硬化性樹脂組成物、電子零件用接著劑及顯示元件用接著劑 - Google Patents

光與濕氣硬化性樹脂組成物、電子零件用接著劑及顯示元件用接著劑 Download PDF

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Publication number
TW202346393A
TW202346393A TW112109327A TW112109327A TW202346393A TW 202346393 A TW202346393 A TW 202346393A TW 112109327 A TW112109327 A TW 112109327A TW 112109327 A TW112109327 A TW 112109327A TW 202346393 A TW202346393 A TW 202346393A
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TW
Taiwan
Prior art keywords
moisture
curable resin
meth
light
resin composition
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TW112109327A
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English (en)
Chinese (zh)
Inventor
徐坤
萩原康平
木田拓身
Original Assignee
日商積水化學工業股份有限公司
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Publication of TW202346393A publication Critical patent/TW202346393A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymerisation Methods In General (AREA)
TW112109327A 2022-03-14 2023-03-14 光與濕氣硬化性樹脂組成物、電子零件用接著劑及顯示元件用接著劑 TW202346393A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-039234 2022-03-14
JP2022039234 2022-03-14

Publications (1)

Publication Number Publication Date
TW202346393A true TW202346393A (zh) 2023-12-01

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ID=88023794

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TW112109327A TW202346393A (zh) 2022-03-14 2023-03-14 光與濕氣硬化性樹脂組成物、電子零件用接著劑及顯示元件用接著劑

Country Status (3)

Country Link
JP (1) JPWO2023176795A1 (https=)
TW (1) TW202346393A (https=)
WO (1) WO2023176795A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3889865B2 (ja) * 1997-09-17 2007-03-07 サカタインクス株式会社 ポリウレタン樹脂系光硬化性組成物
KR102321552B1 (ko) * 2014-05-30 2021-11-03 세키스이가가쿠 고교가부시키가이샤 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제
JP2016089174A (ja) * 2014-11-04 2016-05-23 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
WO2020149377A1 (ja) * 2019-01-18 2020-07-23 積水化学工業株式会社 硬化性樹脂組成物、及び硬化体
WO2021117880A1 (ja) * 2019-12-13 2021-06-17 Ｋｊケミカルズ株式会社 光重合開始剤

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JPWO2023176795A1 (https=) 2023-09-21
WO2023176795A1 (ja) 2023-09-21

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