TW202338177A - 聚對苯撐苯并雙噁唑纖維及其製造方法、片材、纖維補強基材、積層基材、以及電路基板 - Google Patents

聚對苯撐苯并雙噁唑纖維及其製造方法、片材、纖維補強基材、積層基材、以及電路基板 Download PDF

Info

Publication number
TW202338177A
TW202338177A TW111149606A TW111149606A TW202338177A TW 202338177 A TW202338177 A TW 202338177A TW 111149606 A TW111149606 A TW 111149606A TW 111149606 A TW111149606 A TW 111149606A TW 202338177 A TW202338177 A TW 202338177A
Authority
TW
Taiwan
Prior art keywords
fiber
base material
reinforced base
mass
sheet
Prior art date
Application number
TW111149606A
Other languages
English (en)
Chinese (zh)
Inventor
津島広樹
池田優二
Original Assignee
日商東洋紡Ｍｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東洋紡Ｍｃ股份有限公司 filed Critical 日商東洋紡Ｍｃ股份有限公司
Publication of TW202338177A publication Critical patent/TW202338177A/zh

Links

Classifications

    • D—TEXTILES; PAPER
    • D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
    • D01F—CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS; APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBON FILAMENTS
    • D01F6/00—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof
    • D01F6/58—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof from homopolycondensation products
    • D01F6/74—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof from homopolycondensation products from polycondensates of cyclic compounds, e.g. polyimides, polybenzimidazoles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Textile Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
TW111149606A 2022-01-12 2022-12-23 聚對苯撐苯并雙噁唑纖維及其製造方法、片材、纖維補強基材、積層基材、以及電路基板 TW202338177A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022003247 2022-01-12
JP2022-003247 2022-01-12

Publications (1)

Publication Number Publication Date
TW202338177A true TW202338177A (zh) 2023-10-01

Family

ID=87278863

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111149606A TW202338177A (zh) 2022-01-12 2022-12-23 聚對苯撐苯并雙噁唑纖維及其製造方法、片材、纖維補強基材、積層基材、以及電路基板

Country Status (3)

Country Link
JP (1) JPWO2023136037A1 (https=)
TW (1) TW202338177A (https=)
WO (1) WO2023136037A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4554119A (en) * 1983-04-11 1985-11-19 Celanese Corporation Process for heat treating shaped articles of poly {[benzo(1,2-d:4,5-d')bisthiazole-2,6-diyl]-1,4-phenylene}, its cis isomer or mixtures thereof
JPH04202257A (ja) * 1990-11-29 1992-07-23 Mitsui Petrochem Ind Ltd 全芳香族ヘテロ環状高分子組成物、その繊維、フィルムおよび製造方法
US5296185A (en) * 1992-12-03 1994-03-22 The Dow Chemical Company Method for spinning a polybenzazole fiber
JP2001035259A (ja) * 1999-07-21 2001-02-09 Tomoegawa Paper Co Ltd 低誘電性絶縁紙及びその製造方法
DE60229955D1 (de) * 2001-08-29 2009-01-02 Georgia Tech Res Inst Zusammensetzungen, welche stäbchenförmige polymere und nanoröhrenförmige strukturen umfassen, sowie verfahren zur herstellung derselben
JP3912586B2 (ja) * 2002-01-28 2007-05-09 東洋紡績株式会社 ポリベンザゾール繊維およびその製造方法
CN101423986B (zh) * 2008-12-12 2010-12-22 北京特斯顿新材料技术发展有限公司 一种聚对苯亚基苯并双噁唑纤维的制备方法
JP2011219659A (ja) * 2010-04-12 2011-11-04 Toyobo Co Ltd 繊維補強基材と、これを用いた積層基材及び高周波帯域用基板
CN110205698B (zh) * 2019-06-10 2022-01-04 中科金绮新材料科技有限公司 聚对苯撑苯并二噁唑高模纤维的制备工艺

Also Published As

Publication number Publication date
JPWO2023136037A1 (https=) 2023-07-20
WO2023136037A1 (ja) 2023-07-20

Similar Documents

Publication Publication Date Title
TWI398468B (zh) 低熱膨脹性低介電損耗預漬體及其應用品
TWI404752B (zh) A pre-stained body containing a thin layer of quartz glass cloth, and a wiring board using the same
CN112760782B (zh) 玻璃布
JP5720167B2 (ja) エポキシ樹脂組成物、プリプレグ、金属張積層板、プリント配線板および半導体装置
KR102060088B1 (ko) 회로 물질, 회로 라미네이트, 및 이의 제조방법
CN111002644B (zh) 一种低介电、高剥离强度的覆铜板的制备方法
JP7012505B2 (ja) ガラスクロス、プリプレグ、及びプリント配線板
CN101652401A (zh) 环氧树脂组合物、预浸料坯、层叠板、多层印刷线路板、半导体器件、绝缘树脂片、和制造多层印刷线路板的方法
CN101535542A (zh) 复合织物及印刷电路板
KR20140028973A (ko) 프리프레그, 동박적층판, 및 인쇄회로기판
TWI850577B (zh) 玻璃布、預浸體、及印刷基板
JP2014205755A (ja) プライマー層形成用樹脂組成物
JPWO2017183621A1 (ja) プリプレグ、金属張積層板及びプリント配線板
JP2022021599A (ja) ガラスクロス、プリプレグ、及びプリント配線板
JP2011219659A (ja) 繊維補強基材と、これを用いた積層基材及び高周波帯域用基板
JP2010238907A (ja) 積層板、多層プリント配線板および半導体装置
TW202338177A (zh) 聚對苯撐苯并雙噁唑纖維及其製造方法、片材、纖維補強基材、積層基材、以及電路基板
JP6015303B2 (ja) プリプレグ、積層板及びプリント配線板
JP2011099072A (ja) 樹脂組成物、絶縁層、プリプレグ、積層板、プリント配線板および半導体装置
JP7644072B2 (ja) 低誘電損失不織布、その製造、およびその使用
JP2004014611A (ja) 支持体付き絶縁フィルム、多層配線板およびその製造方法
JP4840303B2 (ja) ガラス繊維織布入り絶縁樹脂シート、積層板、多層プリント配線板、及び半導体装置
JP2005175265A (ja) 多層配線板用接着シート及び多層配線板の製造方法
JP7515299B2 (ja) ガラスクロス、プリプレグ、及びプリント配線板
JPH11273456A (ja) 電気絶縁樹脂組成物およびプリント配線板