TW202338002A - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
TW202338002A
TW202338002A TW111145774A TW111145774A TW202338002A TW 202338002 A TW202338002 A TW 202338002A TW 111145774 A TW111145774 A TW 111145774A TW 111145774 A TW111145774 A TW 111145774A TW 202338002 A TW202338002 A TW 202338002A
Authority
TW
Taiwan
Prior art keywords
resin composition
group
formula
film
photosensitive resin
Prior art date
Application number
TW111145774A
Other languages
English (en)
Chinese (zh)
Inventor
荻野浩司
坂口崇洋
石井秀則
遠藤貴文
星野有輝
Original Assignee
日商日產化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日產化學股份有限公司 filed Critical 日商日產化學股份有限公司
Publication of TW202338002A publication Critical patent/TW202338002A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/145—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW111145774A 2021-12-09 2022-11-30 樹脂組成物 TW202338002A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-199946 2021-12-09
JP2021199946 2021-12-09

Publications (1)

Publication Number Publication Date
TW202338002A true TW202338002A (zh) 2023-10-01

Family

ID=86730366

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111145774A TW202338002A (zh) 2021-12-09 2022-11-30 樹脂組成物

Country Status (5)

Country Link
JP (1) JPWO2023106101A1 (https=)
KR (1) KR20240113844A (https=)
CN (1) CN118302485A (https=)
TW (1) TW202338002A (https=)
WO (1) WO2023106101A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202513666A (zh) * 2023-07-28 2025-04-01 日商富士軟片股份有限公司 感光性樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件
WO2025070586A1 (ja) * 2023-09-29 2025-04-03 富士フイルム株式会社 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス、並びに、樹脂、樹脂の製造方法、及び、カルボン酸二無水物
WO2025142645A1 (ja) * 2023-12-26 2025-07-03 住友ベークライト株式会社 感光性樹脂組成物、硬化物および半導体装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09208697A (ja) * 1996-01-30 1997-08-12 Hitachi Chem Co Ltd 高分子化合物の製造方法
JP3321548B2 (ja) * 1996-06-17 2002-09-03 株式会社日立製作所 感光性ポリイミド前駆体組成物、およびそれを用いたパターン形成方法
JPH1124266A (ja) * 1997-07-04 1999-01-29 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いたレリーフパターンの製造法
JP4056299B2 (ja) * 2002-05-29 2008-03-05 三井化学株式会社 極薄銅箔を用いたポリイミド銅張積層板及びその製造方法
JP2005010360A (ja) 2003-06-18 2005-01-13 Hitachi Chemical Dupont Microsystems Ltd 感光性ポリイミド系樹脂組成物およびこれを用いた電子部品
TWI430024B (zh) 2010-08-05 2014-03-11 旭化成電子材料股份有限公司 A photosensitive resin composition, a method for manufacturing a hardened bump pattern, and a semiconductor device
JP5677107B2 (ja) * 2011-01-26 2015-02-25 日東電工株式会社 配線回路基板
US10093789B2 (en) 2013-08-06 2018-10-09 Mitsubishi Gas Chemical Company, Inc. Polyimide resin composition, and (polyimide resin)-fiber composite material
JP6390165B2 (ja) * 2014-05-21 2018-09-19 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体、該ポリイミド前駆体を含む感光性樹脂組成物、それを用いたパターン硬化膜の製造方法及び半導体装置
SG11201700576UA (en) * 2014-08-08 2017-02-27 Mitsui Chemicals Inc Sealing composition and method of manufacturing semiconductor device
CN113820920B (zh) * 2016-03-31 2023-07-04 旭化成株式会社 感光性树脂组合物、固化浮雕图案的制造方法和半导体装置
TW201936718A (zh) * 2018-01-10 2019-09-16 日商日產化學股份有限公司 絕緣膜用樹脂組成物
JP7222638B2 (ja) * 2018-09-14 2023-02-15 旭化成株式会社 樹脂組成物、積層体、及び硬化膜
JP7331860B2 (ja) * 2018-10-15 2023-08-23 日産化学株式会社 感光性絶縁膜組成物
TWI860437B (zh) * 2019-12-27 2024-11-01 日商富士軟片股份有限公司 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件

Also Published As

Publication number Publication date
JPWO2023106101A1 (https=) 2023-06-15
CN118302485A (zh) 2024-07-05
KR20240113844A (ko) 2024-07-23
WO2023106101A1 (ja) 2023-06-15

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