JPWO2023106101A1 - - Google Patents
Info
- Publication number
- JPWO2023106101A1 JPWO2023106101A1 JP2023566216A JP2023566216A JPWO2023106101A1 JP WO2023106101 A1 JPWO2023106101 A1 JP WO2023106101A1 JP 2023566216 A JP2023566216 A JP 2023566216A JP 2023566216 A JP2023566216 A JP 2023566216A JP WO2023106101 A1 JPWO2023106101 A1 JP WO2023106101A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/145—Polyamides; Polyesteramides; Polyimides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3472—Five-membered rings
- C08K5/3475—Five-membered rings condensed with carbocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021199946 | 2021-12-09 | ||
| PCT/JP2022/043286 WO2023106101A1 (ja) | 2021-12-09 | 2022-11-24 | 樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023106101A1 true JPWO2023106101A1 (https=) | 2023-06-15 |
| JPWO2023106101A5 JPWO2023106101A5 (https=) | 2025-08-12 |
Family
ID=86730366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023566216A Pending JPWO2023106101A1 (https=) | 2021-12-09 | 2022-11-24 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023106101A1 (https=) |
| KR (1) | KR20240113844A (https=) |
| CN (1) | CN118302485A (https=) |
| TW (1) | TW202338002A (https=) |
| WO (1) | WO2023106101A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202513666A (zh) * | 2023-07-28 | 2025-04-01 | 日商富士軟片股份有限公司 | 感光性樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件 |
| WO2025070586A1 (ja) * | 2023-09-29 | 2025-04-03 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス、並びに、樹脂、樹脂の製造方法、及び、カルボン酸二無水物 |
| WO2025142645A1 (ja) * | 2023-12-26 | 2025-07-03 | 住友ベークライト株式会社 | 感光性樹脂組成物、硬化物および半導体装置 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09208697A (ja) * | 1996-01-30 | 1997-08-12 | Hitachi Chem Co Ltd | 高分子化合物の製造方法 |
| JP3321548B2 (ja) * | 1996-06-17 | 2002-09-03 | 株式会社日立製作所 | 感光性ポリイミド前駆体組成物、およびそれを用いたパターン形成方法 |
| JPH1124266A (ja) * | 1997-07-04 | 1999-01-29 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いたレリーフパターンの製造法 |
| JP4056299B2 (ja) * | 2002-05-29 | 2008-03-05 | 三井化学株式会社 | 極薄銅箔を用いたポリイミド銅張積層板及びその製造方法 |
| JP2005010360A (ja) | 2003-06-18 | 2005-01-13 | Hitachi Chemical Dupont Microsystems Ltd | 感光性ポリイミド系樹脂組成物およびこれを用いた電子部品 |
| TWI430024B (zh) | 2010-08-05 | 2014-03-11 | 旭化成電子材料股份有限公司 | A photosensitive resin composition, a method for manufacturing a hardened bump pattern, and a semiconductor device |
| JP5677107B2 (ja) * | 2011-01-26 | 2015-02-25 | 日東電工株式会社 | 配線回路基板 |
| US10093789B2 (en) | 2013-08-06 | 2018-10-09 | Mitsubishi Gas Chemical Company, Inc. | Polyimide resin composition, and (polyimide resin)-fiber composite material |
| JP6390165B2 (ja) * | 2014-05-21 | 2018-09-19 | 日立化成デュポンマイクロシステムズ株式会社 | ポリイミド前駆体、該ポリイミド前駆体を含む感光性樹脂組成物、それを用いたパターン硬化膜の製造方法及び半導体装置 |
| SG11201700576UA (en) * | 2014-08-08 | 2017-02-27 | Mitsui Chemicals Inc | Sealing composition and method of manufacturing semiconductor device |
| CN113820920B (zh) * | 2016-03-31 | 2023-07-04 | 旭化成株式会社 | 感光性树脂组合物、固化浮雕图案的制造方法和半导体装置 |
| TW201936718A (zh) * | 2018-01-10 | 2019-09-16 | 日商日產化學股份有限公司 | 絕緣膜用樹脂組成物 |
| JP7222638B2 (ja) * | 2018-09-14 | 2023-02-15 | 旭化成株式会社 | 樹脂組成物、積層体、及び硬化膜 |
| JP7331860B2 (ja) * | 2018-10-15 | 2023-08-23 | 日産化学株式会社 | 感光性絶縁膜組成物 |
| TWI860437B (zh) * | 2019-12-27 | 2024-11-01 | 日商富士軟片股份有限公司 | 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件 |
-
2022
- 2022-11-24 JP JP2023566216A patent/JPWO2023106101A1/ja active Pending
- 2022-11-24 WO PCT/JP2022/043286 patent/WO2023106101A1/ja not_active Ceased
- 2022-11-24 KR KR1020247022134A patent/KR20240113844A/ko active Pending
- 2022-11-24 CN CN202280077192.9A patent/CN118302485A/zh active Pending
- 2022-11-30 TW TW111145774A patent/TW202338002A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN118302485A (zh) | 2024-07-05 |
| TW202338002A (zh) | 2023-10-01 |
| KR20240113844A (ko) | 2024-07-23 |
| WO2023106101A1 (ja) | 2023-06-15 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250801 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250801 |