TW202332909A - Electronic part testing device and testing board structure thereof - Google Patents

Abstract

The utility model provides an electronic part testing device and a testing plate structure thereof, the lower surface of a testing plate is provided with a plurality of concave shallow holes, and the concave shallow holes are first concave shallow holes with geometrical first boundaries respectively arranged at the bottom of each seat groove towards the outer side of the groove edge; or a plurality of second concave shallow holes with geometrical second boundaries are formed between the two seat grooves in the two adjacent rows, the second boundaries are closed, and the plurality of second concave shallow holes are formed in the same row in the radial direction of the test plate; therefore, the processing is easier, and the cost can be reduced.

Description

Electronic component testing device and test board structure and test board manufacturing method

The present invention relates to a testing device and its test board structure and a test board manufacturing method, and in particular to an electronic component testing device used in electronic component testing to transport components to be tested for testing and inspection. An electronic component testing device and its test board Construction, test panel fabrication methods.

General electronic parts usually need to be tested to determine their physical properties after they are manufactured. For example, the equipment provided in the patent application No. 411735 for "Circuit Component Loading and Unloading Device" for testing capacitor-type electronic parts is based on the round shape. The disc-shaped test board forms one or several concentric rings of component sockets that can rotate relative to the center of the ring. The sockets rotate evenly at angular intervals and in increments, and the rotation increment is the difference between adjacent sockets. The ring seat is tilted at a certain angle, and when the ring seat rotates, the component flow path dumps the component toward the ring seat. The fixed grid adjacent to the side of the outer plate of the groove seat limits the components that are not in their original position due to power. The empty slot randomly rolls down on the arc section of the ring seat's rotation path. The random rolling causes the component to return to the slot. In the path of the rotating ring seat, there is an electronic contactor used to connect the component and the testing machine. The component being tested passes under a discharge manifold. The discharge manifold plate defines a plurality of discharge holes that are aligned with a set of sockets each time the ring is rotated by an increment. The discharge tubes are aligned with the discharge ports. After the connection, the components are ejected from the slot seat by the air blast of each pneumatic valve that is selectively activated. Due to the air blast and gravity, the ejected components fall through the pipe and enter the classification storage box according to the guidance of the piping board. , the component flow path can be selectively directed to the grid in response to a signal from a detector indicating that the grid is missing components, and the sensor can detect components in the socket that have not been ejected by the ejection manifold.

JA2021-190604 "Chip Electronic Components Transport Disc for Electronic Components Inspection and Sorting Device" Japanese patent patent discloses a transport disc for this test plate, with concentric grooves formed on the back of the transport disc. The concentric grooves are formed in a concentric circle, each containing a plurality of rows of through-hole groups; it is also disclosed that a groove is formed on the back side of the transfer disc, and the groove is connected to a plurality of rows in the radial direction. The columns of the hole group are arranged side by side.

Although the previous technology of the JA2021-190604 Japanese patent application forms a groove on the back of the conveying disc, the area of the groove is huge and covers the entire annular area of multiple concentric circles, or multiple numbers in the radial direction. The rows of through-hole groups are juxtaposed, and the huge area of the grooves not only causes time-consuming and high costs in processing, but also weakens the strength of the already quite thin transport disc and makes it easy to be damaged. In addition, because the general test board is often located on a load-bearing Intermittent rotational friction is performed on the chassis. In order to avoid weakening the strength of the test plate, the groove is only made with a very small depth. Therefore, the wear caused by long-term friction can easily cause the groove to be damaged and lose its complete groove boundary. This remains to be seen. Improvements!

Therefore, an object of the present invention is to provide a test board structure that improves at least one of the deficiencies of the prior art in an electronic component testing device.

Another object of the present invention is to provide a test board manufacturing method that improves at least one of the deficiencies of the electronic component testing device in the prior art.

Another object of the present invention is to provide an electronic component testing device using the test board.

The test board structure of the electronic component testing device according to the object of the present invention includes: It is made of non-conductive material in the shape of a circular sheet, and its upper surface is provided with hollowed-out seat grooves arranged concentrically and annularly in a plurality of rows spaced apart in the radial direction. Each row of the seat grooves is provided with a plurality of ring-shaped and spaced apart rows. The radially corresponding seat grooves are arranged in multiple rows at intervals; a section of concave guide grooves is radially extended from the bottom of each seat groove on the lower surface of the test plate; and a plurality of concave shallow holes are provided on the lower surface of the test plate. The recessed shallow cavity includes a first recessed shallow cavity that is expanded toward the outside of the groove edge at the bottom of each seat groove and has a first boundary with a geometric shape.

The test board structure of another electronic component testing device according to the object of the present invention includes: a circular sheet made of non-conductive material, the upper surface of which is provided with a plurality of concentric annular hollows arranged at intervals in the radial direction. There are a plurality of seat grooves arranged in annular intervals in each row of the seat grooves, and the seat grooves corresponding to the radial direction of each column are arranged in a plurality of rows; a section of concave grooves is radially extended at the bottom of each seat groove on the lower surface of the test plate. guide groove; the lower surface of the test board is provided with a plurality of concave shallow holes, and the concave shallow holes include a second concave shallow cavity with a geometric second boundary between two adjacent rows of grooves. hole; the second boundary is a closed shape, and a plurality of the second concave shallow holes are provided in the same row in the radial direction of the test plate.

Another test board structure of an electronic component testing device according to the object of the present invention includes: a circular sheet made of non-conductive material, the upper surface of which is provided with a plurality of concentric annular hollows arranged at intervals in the radial direction. A plurality of seat grooves are arranged in each row at annular intervals, and the seat grooves corresponding to the radial direction of each column are spaced in a plurality of rows; a recessed section is radially extended at the bottom of each seat groove on the lower surface of the test plate guide groove; the lower surface of the test board is provided with a plurality of concave shallow holes, the concave shallow holes include first concave shallow holes that are expanded toward the outside of the groove edge at the bottom of the groove, and a plurality of concave shallow holes between the two grooves. The second recess is provided with a shallow hole.

Another test board structure of an electronic component testing device according to the object of the present invention includes: a circular sheet made of non-conductive material, with fixing holes provided in the middle, and the upper surface is provided with radially spaced plates. A plurality of rows of hollowed-out seat grooves are arranged concentrically in an annular shape. Each column of the seat grooves is arranged in a plurality of rings at intervals, and the seat grooves corresponding to each column in the radial direction are spaced in a plurality of rows; each seat groove on the lower surface of the test plate is A section of concave guide grooves extends radially at the bottom of the groove; a guide portion is provided on the front side of the seat groove in the direction of the intermittently rotating flow path on the upper surface of the test plate, and the guide portion is connected with the seat groove to connect the test plate to the test plate. The parts are guided into the housing.

According to another object of the present invention, a method for manufacturing a test board of an electronic component testing device includes: making a circular sheet of non-conductive material, and processing a film layer of wear-resistant material on the lower surface of the test board, After the film layer is formed, the test plate that already has the film layer is processed to form a groove including: a plurality of concentric and annular hollowed-out grooves arranged in a plurality of radially spaced rows, and radial extensions at the bottom of each groove. There are guide ditches and a plurality of concave shallow holes.

According to another object of the present invention, an electronic component testing device uses the test board as described above.

In the electronic component testing device and its test board structure and test board manufacturing method according to the embodiment of the present invention, since the area of the concave shallow holes formed on the lower surface of the test board is smaller, it is not like the previous technology that must cover the entire area of multiple concentric circles. The annular area may be juxtaposed with multiple rows of through-hole groups in the radial direction, so processing tools can be used for rapid and efficient processing and cost reduction. If a wear-resistant material is used to form a film layer on the lower surface of the test plate, due to After the film layer is formed, the seat groove, the guide groove, and the concave shallow cavity are formed on the test board that already has the film layer. Therefore, there is no need to bypass the seat groove and the guide groove when forming the film layer. The groove and the concave shallow cavity make processing easier; in addition, the guide part can also be provided on the front side of the seat groove in the direction of the intermittently rotating flow path on the upper surface of the test plate, so that the part to be tested can be placed on the seat Groove is easier. .

Please refer to Figures 1 and 2. The embodiment of the present invention is illustrated with a test board 1 of an electronic component testing device for testing capacitive components to be tested. However, the test board 1 is not limited to capacitive electronic components. Implementation; The test plate 1 is made of a non-conductive material into a circular sheet shape, and is provided with fixing holes 11 for fixation. The upper surface 121 is provided in the radial direction during intermittent rotation to transport the part to be tested H. A plurality of spaced rows (8 rows in this embodiment) are concentrically arranged with rectangular grooves 12. Each column of the grooves 12 is provided with a plurality of rings spaced apart, and each column has a radially corresponding seat groove. 12 are arranged in multiple rows at straight intervals; each seat slot 12 can accommodate a component to be tested H with electrodes respectively on the upper and lower ends, such as capacitor-type electronic components. The component to be tested H has electrodes located on the upper and lower ends respectively. The test board 1 is placed in the seat slot 12; the test board 1 is set on a bearing chassis 2 and can be driven to rotate on the upper surface of the bearing chassis 2.

Please refer to Figures 2 and 3. The load-bearing chassis 2 can be composed of a plurality of sector-shaped blocks of different sizes that are independent but can be connected and combined with each other, or it can be in the shape of a full-circle disc. The chassis 2 is provided with a plurality of radially spaced rows (8 rows in this embodiment) of concentrically arranged concave annular arc-shaped feeding suction grooves 21, and each feeding suction groove 21 is provided with an edge. There are a plurality of hollow suction holes 22 arranged at intervals at the bottom of the feed suction trench 21; the suction holes 22 can be connected to a negative pressure source for vacuuming, so that a negative pressure vacuum state is formed in the feed suction trench 21; the radial linear arrangement is A rib 23 is formed between every two inlet suction grooves 21. The ribs 23 are spaced apart in the radial direction and are in the shape of a plurality of concentric rings (7 rows in this embodiment). In the capacitor-type parts to be tested, In the electronic component testing device for H testing, the load-bearing chassis 2 corresponds to the inspection and testing site, and the ribs 23 corresponding to the testing and inspection site are provided with a plurality of collars 24 made of insulating material. Each collar is 24 is provided with an axis hole 25, and the axis hole 25 is for installation and inspection terminals (not shown in the figure). Each seat slot 12 will pass through the axis hole 25 of the same circular ring when the test plate 1 rotates intermittently. , so that the part to be tested contained in the seat groove 12 is tested and inspected.

Please refer to Figures 3 to 5. On the lower surface 122 of the test plate 1, a concave guide groove 13 is provided at the bottom of each seat groove 12 extending radially toward the outer circumference. Each guide groove 13 is connected to the bottom of the load-bearing chassis 2. The feeding suction groove 21 is turned on when the test plate 1 performs intermittent rotation, so that negative pressure is introduced from the suction hole 22 in the bearing chassis 2. When vacuuming, the negative pressure can pass through the feeding suction groove 21 to each seat groove. The part to be tested H accommodated in 12 is adsorbed; the lower surface 122 of the test plate 1 is provided with a plurality of concave shallow holes 3 corresponding to the partition ribs 23 in the load-bearing chassis 2, and the concave shallow holes 3 are provided on each side. A first concave shallow cavity 31 with a geometric first boundary 311 is expanded toward the outside of the groove edge 111 at the bottom of the seat groove 12. The first boundary 311 is, for example, a circle or a rectangle as shown in Figure 6. A boundary 311 is a closed shape and only communicates with one seat groove 12 and one guide groove 13 at the location where the first concave shallow hole 31 is located; two seat grooves on the circular paths in different adjacent rows The first boundaries 311 of the first recessed shallow holes 31 at the bottom of the groove 12 maintain a first row distance 312 without overlapping and conducting. The first recessed grooves 12 at the bottom of the two adjacent rows are The first boundaries 311 of the shallow holes 31 maintain a first line spacing 313 without overlapping or conducting; A second concave shallow cavity 32 with a geometric second boundary 321 is provided between the two seat grooves 12 in two adjacent rows. The second boundary 321 is, for example, circular, and preferably circular. The second boundary 321 is in a closed shape, and the area size of the second concave shallow cavity 32 only corresponds to the width range of the rib 23, and corresponds to the adjacent seat groove 12 on the same row of annular paths. The test board 1 is provided with a plurality of second concave shallow holes 32 in the same radial row; the second boundaries 321 of the two second concave shallow holes 32 on the circular path in different adjacent columns maintain a first The two row spacings 322 do not overlap and conduct, and the second boundaries 321 of the two second recessed shallow holes 32 between adjacent different rows maintain a second row spacing 323 without overlapping and conducting; The second boundary 321 of the second recessed shallow cavity 32 and the first boundary 311 of the first recessed shallow cavity 31 maintain an adjacent distance 324 without overlapping and conducting; The plurality of first concave shallow holes 31 at the bottom of each seat groove 12 on the lower surface 122 of the test board 1 are arranged in a concentric circle, and the plurality of second concave shallow holes 32 also form a concentric circle. Circular arrangement, a preferred embodiment is a circular path surrounded by the centers of the first concave shallow holes 31 in the same row, and the second concave shallow holes 31 in the same row. The circular path surrounded by 32 centers is on the same radius, that is, on the same circular path, and each circular path is shown in Figure 7, corresponding to the load-bearing chassis 2 One of the plurality of rows is located at the concentric ring-shaped ribs 23 .

The first concave shallow cavity 31 and the second concave shallow cavity 32 are used to accommodate powder generated by friction between the lower surface 122 of the test plate 1 and the bearing chassis 2 during long-term operation. to avoid blocking the bottom aperture of the seat groove 12. On the other hand, since the concave shallow hole 3 is corresponding to the partition rib 23 in the load-bearing chassis 2, it can help the test plate 1 and the partition rib 23 Reduce friction; as shown in Figure 8, a feasible embodiment of the test plate 1 is that a film layer 4 formed of a wear-resistant material can be processed on the lower surface 122 of the test plate 1. The film layer 4 is such as chromium or For wear-resistant materials such as Teflon, the film layer 4 can be formed into an annular shape by matching the position of the ribs 23 and the concentric annular shape in Figure 3, or can be formed on the annular shape into multiple sections spaced apart from each other by a distance. In this embodiment, the film layer 4 is formed on the entire lower surface 122 of the test board 1, and then the seat groove 12 and the guide groove are formed on the surface that already has the film layer 4. 13. The first concave shallow hole 31 and the second concave shallow hole 32 .

Please refer to Figures 9 to 10. In order to help the component H to be tested fall into the seat groove 12 when the test plate 1 is rotated intermittently, the upper surface 121 of the test plate 1 can be intermittently rotated on the front side of the seat groove 12 in the direction of the flow path. A guide portion 123 is provided, and the guide portion 123 is only connected to one of the seat slots 12, and the guide portions 123 corresponding to a plurality of the seat slots 12 are not connected to each other, so as to facilitate the placement of the seats intermittently. The rotating part H on the upper surface 121 of the test plate 1 is guided into a specific seat groove 12; the guide portion 123 is horizontal from the test plate 1 outside the periphery 125 of the opening 124 above the seat groove 12. The upper surface 121 is inclined toward the seat groove 12, and the connection point with the peripheral edge 125 of the opening 124 above the seat groove 12 is lower than the peripheral edge 125 of the opening 124 by a distance d to ensure that the patient to be guided is The part to be tested H enters the specific seat groove 12 during oblique sliding displacement, and is introduced in the direction of the opening 124 with the long axis end H1 of the part to be tested H having a rectangular parallelepiped shape.

The test board structure and manufacturing method of the electronic component testing device according to the embodiment of the present invention, because the concave shallow holes 3 formed on the lower surface 122 of the test board 1 have a smaller area, unlike the previous technology, which must cover multiple concentric circles. The entire annular area, or juxtaposed with a plurality of rows of through-hole groups in the radial direction, so processing tools can be used for rapid and efficient processing and cost reduction. If the lower surface 122 of the test plate 1 is made of wear-resistant material The film layer 4 is formed. After the film layer 4 is formed, the seat groove 12, the guide groove 13, and the recessed shallow hole 3 are formed on the test board 1 that already has the film layer 4. Therefore, the film layer 4 is formed after the film layer 4 is formed. The film layer 4 does not need to bypass the seat groove 12, the guide groove 13, and the concave shallow cavity 3, making processing easier; in addition, the seat in the direction of the flow path can also be intermittently rotated on the upper surface 121 of the test plate 1 The guide portion 123 is provided on the front side of the groove 12 to make it easier for the component H to be tested to be placed in the seat groove 12 .

However, the above are only examples of the present invention, and should not be used to limit the scope of the present invention. All simple equivalent changes and modifications made based on the patent scope of the present invention and the content of the patent specification are still within the scope of the present invention. Within the scope covered by the patent of this invention.

1:Test board 11:Fixing hole 12: Seat slot 121: Upper surface 122: Lower surface 123: Guidance Department 124:Open your mouth 125: Zhou Yuan 13:Guide trench 2: Bearing chassis 21: Feed suction ditch 22:Suction hole 23: ribs 24:shaft collar 25: Shaft hole 3: Concave shallow holes 31: The first concave is provided with a shallow hole 311:First border 312: first column spacing 313: First line spacing 32: The second concave is provided with a shallow hole 321:Second border 322: Second column spacing 323: Second line spacing 324: neighbor distance 4: Film layer H: Parts to be tested H1: end d: spacing

FIG. 1 is a schematic three-dimensional view of a test board of an electronic component testing device located on a supporting chassis, illustrating an embodiment of the present invention. Figure 2 is a schematic diagram of the seat groove provided on the upper surface of the test board of the electronic component testing device. Figure 3 is a schematic diagram of a section of the bearing chassis of the electronic component testing device. Figure 4 is a schematic diagram of an embodiment of each concave shallow hole in the test board structure of the electronic component testing device. Figure 5 is an enlarged schematic diagram of an embodiment of a shallow cavity recessed in the test board structure of the electronic component testing device. Figure 6 is an enlarged schematic diagram of another embodiment of a shallow cavity recessed in the test board structure of the electronic component testing device. Figure 7 is a schematic diagram of the embodiment of the concave shallow cavity in the test board structure of the electronic component testing device corresponding to the supporting chassis below. Figure 8 is a schematic diagram of an embodiment of the lower surface film layer and the concave shallow cavity in the test board structure of the electronic component testing device. Figure 9 is a schematic diagram of the guide portion of the seat groove of the test board structure of the electronic component testing device. Figure 10 is a partial cross-sectional schematic view of the guide portion of the seat groove of the test board structure of the electronic component testing device.

1:Test board

12: Seat slot

122: Lower surface

13:Guide trench

3: Concave shallow holes

31: The first concave is provided with a shallow hole

311:First border

312: first column spacing

313: First line spacing

32: The second concave is provided with a shallow hole

321:Second border

322: Second column spacing

323: Second line spacing

324: neighbor distance

Claims (15)

A test board structure of an electronic component testing device, including: It is made of non-conductive material in the shape of a circular sheet, and its upper surface is provided with hollowed-out seat grooves arranged concentrically and annularly in a plurality of rows spaced apart in the radial direction. Each row of the seat grooves is provided with a plurality of ring-shaped and spaced apart rows. The radially corresponding seat grooves are arranged in multiple rows at intervals; a section of concave guide grooves is radially extended from the bottom of each seat groove on the lower surface of the test plate; It is characterized in that: the lower surface of the test board is provided with a plurality of concave shallow holes, and the concave shallow holes include a first concave shallow hole with a geometric first boundary expanded at the bottom of the seat groove toward the outside of the groove edge. hole. The test board structure of the electronic component testing device of claim 1, wherein the first boundary is in a closed shape and only communicates with one of the seat grooves and one of the guide trenches at the location where the first concave shallow hole is located. . The test board structure of the electronic component testing device according to claim 1, wherein a first boundary of the first concave shallow holes at the bottom of the two adjacent rows of circular paths is maintained. The column spacing does not overlap and conducts, and the first boundaries of the first concave shallow holes at the bottom of two adjacent rows maintain a first row spacing without overlapping and conduction. The test board structure of the electronic component testing device of claim 1, wherein the first boundary is one of a circle or a rectangle. A test board structure of an electronic component testing device, including: It is made of non-conductive material in the shape of a circular sheet, and its upper surface is provided with hollowed-out seat grooves arranged concentrically and annularly in a plurality of rows spaced apart in the radial direction. Each row of the seat grooves is provided with a plurality of ring-shaped and spaced apart rows. The radially corresponding seat grooves are arranged in multiple rows at intervals; a section of concave guide grooves is radially extended from the bottom of each seat groove on the lower surface of the test plate; It is characterized in that: the lower surface of the test board is provided with a plurality of concave shallow holes, and the concave shallow holes include a second concave shallow cavity with a geometric second boundary between two adjacent rows of grooves. hole; the second boundary is a closed shape, and a plurality of the second concave shallow holes are provided in the same row in the radial direction of the test plate. The test board structure of the electronic component testing device of claim 5, wherein the second boundaries of the two second concave shallow holes on the circular paths of different adjacent rows maintain a second row distance without intersecting. Overlapping and conduction, the second boundaries of the two second recessed shallow holes between adjacent different rows maintain a second row spacing without overlapping and conduction. The test board structure of the electronic component testing device of claim 5, wherein a gap is maintained between the second boundary of the second concave shallow holes in adjacent different rows and the first boundary of the first concave shallow cavity. Neighboring distance without overlapping and conduction. A test board structure of an electronic component testing device, including: It is made of non-conductive material in the shape of a circular sheet, and its upper surface is provided with hollowed-out seat grooves arranged concentrically and annularly in a plurality of rows spaced apart in the radial direction. Each row of the seat grooves is provided with a plurality of ring-shaped and spaced apart rows. The radially corresponding seat grooves are arranged in multiple rows at intervals; a section of concave guide grooves is radially extended from the bottom of each seat groove on the lower surface of the test plate; It is characterized in that: the lower surface of the test board is provided with a plurality of concave shallow holes. The concave shallow holes include first concave shallow holes that are expanded toward the outside of the groove edge at the bottom of the groove, and a plurality of concave shallow holes located between the two grooves. The second recess is provided with a shallow hole. The test board structure of the electronic component testing device according to claim 8, wherein the circular path surrounded by the center of each of the first concave shallow holes in the same row is different from the second concave hole in the same row. It is assumed that the circular path surrounded by the center of the shallow hole is on the same radius. A test board structure of an electronic component testing device, including: It is made of non-conductive material in the shape of a circular sheet, with a fixing hole in the middle for fixing, and the upper surface is provided with hollow seat grooves arranged concentrically in a plurality of rows spaced apart in the radial direction. Each row of the seat grooves A plurality of annular slots are arranged at intervals, and the radially corresponding slots in each column are arranged in a plurality of rows; a section of concave guide grooves is radially extended at the bottom of each slot on the lower surface of the test plate; It is characterized in that: a guide part is provided on the front side of the seat groove in the direction of the intermittently rotating flow path on the upper surface of the test plate, and the guide part is connected with the seat groove to guide the part to be tested into the seat groove. The test board structure of the electronic component testing device according to claim 10, wherein the The guide portion is inclined toward the seat groove from the horizontal surface of the test plate outside the upper edge of the opening of the seat groove, and is a distance lower than the opening edge at the point where it meets the upper edge of the opening of the seat groove. A method for manufacturing a test board for an electronic component testing device, including: It is made of non-conductive material in the shape of a circular sheet, and a film layer made of wear-resistant material is processed on the lower surface of the test plate. After the film layer is formed, the film layer is then processed on the test plate that already has the film layer. It includes: a plurality of hollowed-out seat grooves arranged concentrically in a plurality of radially spaced rows, a radially extending guide groove at the bottom of each seat groove, and a plurality of concave shallow holes. The method for manufacturing a test board for an electronic component testing device as claimed in claim 12, wherein the concave shallow cavity is a first concave with a first boundary of a geometric shape at the bottom of each slot and is expanded toward the outside of the slot edge. Set up shallow holes. The method for manufacturing a test board for an electronic component testing device as claimed in claim 12, wherein the recessed shallow holes are provided with a second recessed shallow hole with a geometric second boundary between the two slots in two adjacent rows. hole; the second boundary is a closed shape, and a plurality of the second concave shallow holes are provided in the same row in the radial direction of the test plate. An electronic component testing device using the test board described in any one of claims 1 to 14.

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