TWM648235U - Electronic component inspection equipment - Google Patents

Electronic component inspection equipment Download PDF

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Publication number
TWM648235U
TWM648235U TW112206703U TW112206703U TWM648235U TW M648235 U TWM648235 U TW M648235U TW 112206703 U TW112206703 U TW 112206703U TW 112206703 U TW112206703 U TW 112206703U TW M648235 U TWM648235 U TW M648235U
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Taiwan
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under test
component under
upper terminal
test
inspection
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TW112206703U
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Chinese (zh)
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林芳旭
盧昱呈
林冠龍
吳振維
紀建兆
陸志益
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萬潤科技股份有限公司
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Priority to TW112206703U priority Critical patent/TWM648235U/en
Publication of TWM648235U publication Critical patent/TWM648235U/en

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Abstract

本創作提供一種電子元件檢查設備,包括:一機台,其上設有一機台台面;一承載底盤,設於該機台台面,該承載底盤上設置可被驅動進行旋轉的測試板,該測試板上設有座槽供承載待測元件,該待測元件設有位於上端的上電極及位於下端的下電極,其中該上電極露出於該座槽上端開口而高於該測試板上表面;一上端子,可在該待測元件被該測試板搬送鄰近該上端子前執行上提以迴避該待測元件;該上端子可在該待測元件被該測試板搬送至該上端子下方時,下移抵觸該待測元件上端的該上電極,並在完成檢查後與被該測試板搬送的該待測元件脫離接觸;藉此避免在檢查時碰撞損傷該待測元件。This invention provides an electronic component inspection equipment, including: a machine platform with a machine table; a load-bearing chassis located on the machine table; a test board that can be driven to rotate is provided on the load-bearing chassis. The test A seat is provided on the board for carrying the component under test. The component under test is provided with an upper electrode located at the upper end and a lower electrode located at the lower end. The upper electrode is exposed at the upper end opening of the seat and is higher than the surface of the test board; An upper terminal can be lifted up to avoid the component under test before the component under test is transported by the test board adjacent to the upper terminal; the upper terminal can be moved below the upper terminal when the component under test is transported by the test board. , move down the upper electrode that contacts the upper end of the component under test, and disengage from the component under test being transported by the test board after the inspection is completed; thereby avoiding collision damage to the component under test during inspection.

Description

電子元件檢查設備Electronic component inspection equipment

本創作係有關於一種檢查設備,尤指一種適於對電子元件進行測試的電子元件檢查設備。 The present invention relates to an inspection device, in particular to an electronic component inspection device suitable for testing electronic components.

一般電子元件在製造完成後通常需經過測試以確定其物理特性,例如用於電容類的電子元件測試的公告號碼第411735號的「電路元件裝卸裝置」專利申請案所提供的裝置,其以一個或數個元件槽座之同心環座可相對於環心旋轉,槽座均勻地以角度間隔並以增量方式旋轉,而該旋轉增量即是相鄰槽座間的角度間隔,該環座以某個角度頃斜,而且當環座旋轉時,元件流路向環座傾倒元件,鄰接於槽座之外板側邊之固定柵板侷限未歸位之元件因動力而隨機滾落於通過環座旋轉路徑之弧段的空槽座,隨機之滾動使元件歸位入槽座中,在旋轉環座之路徑中有用以連接元件和測試機的電子接觸器,被測試過的元件經過一噴出歧管的下方,該噴出歧管板界定了許多噴出孔,而每當環座旋轉一增量時噴出孔則與一組槽座相互對齊,噴出管與噴出口相連接,元件被選擇性啟動的各個氣壓閥門的空氣之鼓風而從槽座噴出,由空氣之鼓風和重力作用,噴出的元件經由管子落下並依管路板之導引進入分類儲盒中,元件流路能響應於表示柵板缺少元件之偵測器的信號而選擇性地被引向該柵板,感應器能偵測出在座槽中尚未被噴出歧管所噴出的元件。 General electronic components usually need to be tested to determine their physical characteristics after they are manufactured. For example, the device provided in the "Circuit Component Loading and Unloading Device" patent application No. 411735 for testing capacitor-type electronic components uses a Or a concentric ring seat of several component sockets can rotate relative to the center of the ring. The sockets rotate evenly at angular intervals and in increments. The rotation increment is the angular interval between adjacent sockets. The ring seat is It is tilted at a certain angle, and when the ring seat rotates, the component flow path dumps the components toward the ring seat. The fixed grid adjacent to the side of the outer plate of the groove seat limits the unreturned components and randomly rolls down through the ring seat due to power. The empty slot in the arc section of the rotating path rolls randomly to return the component into the slot. In the path of the rotating ring seat, there is an electronic contactor used to connect the component and the testing machine. The tested component passes through an ejection manifold. Below the tube, the discharge manifold plate defines a plurality of discharge holes, and the discharge holes are aligned with a set of slots each time the ring seat is rotated by an increment. The discharge pipe is connected to the discharge port, and the element is selectively activated. The air blast from each pneumatic valve is ejected from the slot seat. Due to the air blast and gravity, the ejected components fall through the pipe and enter the classification storage box according to the guidance of the piping board. The component flow path can respond to the indication The grid is selectively directed to the grid by signals from component detectors that detect components in the slots that have not yet been ejected from the ejection manifold.

由於該公告號碼第411735號專利申請案的先前技術在座槽中被旋轉搬送的元件被抵觸在同行環座表面滾動的端子作滾動接觸式的檢 查,端子的滾輪與元件發生的撞擊碰觸易使元件邊角損傷,有鑑於此,實有待改進之處。 Due to the prior art of the patent application No. 411735, the component being rotated and transported in the holder is pressed against the terminal rolling on the surface of the ring holder for rolling contact inspection. It has been found that the collision between the rollers of the terminals and the components can easily cause damage to the corners of the components. In view of this, there is room for improvement.

爰此,本創作之目的,在於提供一種改善先前技術至少一項缺點的電子元件檢查設備。 Therefore, the purpose of this invention is to provide an electronic component inspection device that improves at least one of the shortcomings of the prior art.

依據本創作目的之電子元件檢查設備,包括:一機台,其上設有一機台台面;一承載底盤,設於該機台台面,該承載底盤上設置可被驅動進行旋轉的測試板,並在該測試板周緣外設置有一入料單元、一檢查單元、及一排出單元;該檢查單元設有一座架、設於該座架的複數個上端子匣、及分別各以相隔間距併列方式對應設於各該上端子匣下方的複數個下端子匣;該上端子匣設有複數個相隔間距併列的上端子;該下端子匣設有複數個相隔間距併列的探針;該測試板上設有座槽供承載待測元件,該待測元件設有位於上端的上電極及位於下端的下電極,其中該上電極露出於該座槽上端開口而高於該測試板上表面;一上端子,可在該待測元件被該測試板搬送鄰近該上端子前執行上提以迴避該待測元件;該上端子可在該待測元件被該測試板搬送至該上端子下方時,下移抵觸該待測元件上端的該上電極,並在完成檢查後與被該測試板搬送的該待測元件脫離接觸。 The electronic component inspection equipment according to the purpose of this invention includes: a machine platform with a machine table; a load-bearing chassis located on the machine table; the load-bearing chassis is provided with a test plate that can be driven to rotate, and A feeding unit, an inspection unit, and a discharge unit are provided outside the periphery of the test board; the inspection unit is provided with a frame, and a plurality of upper terminal boxes located on the frame, and are arranged in parallel with each other at intervals. A plurality of lower terminal boxes are provided below each of the upper terminal boxes; the upper terminal box is provided with a plurality of upper terminals arranged side by side at intervals; the lower terminal box is provided with a plurality of probes arranged side by side at intervals; the test board is provided with There is a seat for carrying the component under test. The component under test is provided with an upper electrode at the upper end and a lower electrode at the lower end. The upper electrode is exposed at the upper end opening of the seat and is higher than the upper surface of the test board; an upper terminal , the component under test can be lifted up to avoid the component under test before it is transported by the test board adjacent to the upper terminal; the upper terminal can be moved downward when the component under test is transported below the upper terminal by the test board The upper electrode contacts the upper end of the component under test, and is out of contact with the component under test being transported by the test board after the inspection is completed.

本創作實施例之電子元件檢查設備,由於在該待測元件被該測試板搬送鄰近該上端子前,該上端子執行上提以迴避該待測元件;完成檢查後,該待測元件被該測試板搬送與該上端子脫離接觸;故在該待測元件被該測試板搬送鄰近該上端子時不會造成碰撞損傷該待測元件,使檢查結果良率可以提升。 In the electronic component inspection equipment of this creative embodiment, before the component under test is moved by the test board close to the upper terminal, the upper terminal is lifted up to avoid the component under test; after the inspection is completed, the component under test is moved by the upper terminal. The test board is transported out of contact with the upper terminal; therefore, when the component under test is transported by the test board close to the upper terminal, there will be no collision damage to the component under test, so that the yield of the inspection result can be improved.

A:機台 A:Machine

A1:機台台面 A1:Machine table

A2:機台桌面 A2:Machine desktop

B:承載底盤 B: Bearing chassis

C:測試板 C:Test board

C1:座槽 C1: Seat slot

D:入料單元 D: Feeding unit

E:檢查單元 E: Check unit

E1:第一檢查單元 E1: First inspection unit

E2:第二檢查單元 E2: Second inspection unit

E3:第三檢查單元 E3: The third inspection unit

E4:上端子匣 E4: Upper terminal box

E41:上端子 E41: Upper terminal

E42:匣蓋 E42: Box cover

E421:墊件 E421: Pad

E422:纜線孔 E422: Cable hole

E423:電纜線 E423:cable

E43:匣座 E43:Box holder

E431:連接座 E431: Connector

E432:上端子座 E432: Upper terminal block

E433:置穴 E433: Place acupoints

E434:上端子座 E434: Upper terminal block

E435:彈性件 E435: elastic parts

E436:導電片 E436: conductive sheet

E437:轉接部 E437:Transfer part

E438:連接件 E438: Connector

E439:彈片 E439:Shrapnel

E5:下端子匣 E5: Lower terminal box

E51:下端子 E51: Lower terminal

E6:座架 E6: mount

E61:鏤孔 E61: Hole

F:排出單元 F: Discharge unit

G:供料機構 G: Feeding mechanism

H:導料架 H: guide frame

K:收集機構 K: collection agency

K1:收集盒 K1: Collection box

M:待測元件 M: component under test

M1:上電極 M1: upper electrode

M2:下電極 M2: lower electrode

圖1係一種待測元件的立體示意圖,用以說明本創作實施例之檢查標的;圖2係一種電子元件檢查設備機台示意圖;圖3係該電子元件檢查設備機台台面上各機構配置示意圖;圖4係該電子元件檢查設備中該測試板的示意圖;圖5係該電子元件檢查設備中該測試板的部份放大示意圖;圖6係該電子元件檢查設備中該待測元件於該測試板座槽中凸出該測試板上表面的示意圖;圖7係該電子元件檢查設備中上、下端子於上、下端子匣中配置之示意圖;圖8係該電子元件檢查設備中該上、下端子於上、下端子匣中之配置之部份放大示意圖;圖9係該電子元件檢查設備中該上端子與被搬送的待測元件即將鄰近時,該上端子執行上提的示意圖;圖10係該電子元件檢查設備中已被上提的該上端子對應被搬送而至的下方該待測元件的示意圖;圖11係該電子元件檢查設備中該上端子下移對下方該待測元件進行檢查的示意圖;圖12係該電子元件檢查設備中該上端子檢查後,該測試板搬移該待測元件與該上端子脫離接觸的示意圖。 Figure 1 is a three-dimensional schematic diagram of a component to be tested to illustrate the inspection target of the embodiment of the present invention; Figure 2 is a schematic diagram of an electronic component inspection equipment machine; Figure 3 is a schematic diagram of the configuration of various mechanisms on the machine table of the electronic component inspection equipment ; Figure 4 is a schematic diagram of the test board in the electronic component inspection equipment; Figure 5 is a partially enlarged schematic diagram of the test board in the electronic component inspection equipment; Figure 6 is a schematic diagram of the component under test in the electronic component inspection equipment during the test The schematic diagram of the upper surface of the test board protruding from the slot of the board holder; Figure 7 is the schematic diagram of the upper and lower terminals in the upper and lower terminal boxes of the electronic component inspection equipment; Figure 8 is the schematic diagram of the upper and lower terminals of the electronic component inspection equipment. A partial enlarged schematic diagram of the arrangement of the lower terminal in the upper and lower terminal boxes; Figure 9 is a schematic diagram of the upper terminal being lifted up when the upper terminal and the transported component under test are about to approach each other in the electronic component inspection equipment; Figure 10 is a schematic diagram of the upper terminal in the electronic component inspection equipment that has been lifted up corresponding to the component under test being moved below; Figure 11 is a schematic diagram of the upper terminal in the electronic component inspection equipment moving downward to the component under test below. A schematic diagram of inspection; Figure 12 is a schematic diagram of the test board moving the component under test and the upper terminal out of contact after the upper terminal is inspected in the electronic component inspection equipment.

請參閱圖1、2所示,本創作實施例以用於電容類的待測元件M進行測試的電子元件檢查設備來作說明,但並不拘限於電容類電子元件的實施,該待測元件M設有位於上端的上電極M1及位於下端的下電極M2;該電子元件檢查設備其係在一機台A上傾斜約六十度的一機台台面A1上設有圓盤狀的一金屬材質的承載底盤B,該承載底盤B上設置可被驅動依 一順時針方向間歇進行旋轉的測試板C,並在該測試板C周緣外設置有用以載入待測元件M的一入料單元D、用以對該待測元件M進行測試其特性的一檢查單元E、及用以將完成測試的該待測元件M排出收集的一排出單元F,在該機台A水平的一機台桌面A2上設有用以提供該待測元件M的一供料機構G及用以引導該排出單元F至一收集機構K的一導料架H,在該機台A前側設有容置多個料盒K1的該收集機構K。 Please refer to Figures 1 and 2. The embodiment of this invention is illustrated with an electronic component inspection equipment used for testing a capacitive component M under test, but it is not limited to the implementation of capacitive electronic components. The component M under test There is an upper electrode M1 located at the upper end and a lower electrode M2 located at the lower end; the electronic component inspection equipment is equipped with a disc-shaped metal material on a machine table A1 which is inclined at about 60 degrees. The load-bearing chassis B is set on the load-bearing chassis B and can be driven according to the A test plate C that rotates intermittently in a clockwise direction, and is provided outside the periphery of the test plate C with a feeding unit D for loading the component under test M, and a device for testing the characteristics of the component under test M. The inspection unit E and a discharge unit F for discharging and collecting the tested component M after completion of the test are provided with a feed material for providing the tested component M on a machine desktop A2 at the level of the machine A. Mechanism G and a guide frame H used to guide the discharge unit F to a collection mechanism K. The collection mechanism K that accommodates a plurality of material boxes K1 is provided on the front side of the machine A.

請參閱圖3所示,該檢查單元E設有用以進行電容之絕緣阻抗(俗稱IR)檢查的一個第一檢查單元E1,及用以進行電容之電容量、損耗或品質因子(俗稱CD)檢查的分別位於該測試板C間歇進行旋轉的方向該第一檢查單元E1前、後的二個第二檢查單元E2、第三檢查單元E3;其中,位於間歇進行旋轉的方向該第一檢查單元E1後的該第三檢查單元E3可依需要予以省略不設。 Please refer to Figure 3. The inspection unit E is provided with a first inspection unit E1 for inspecting the insulation resistance of the capacitor (commonly known as IR), and for inspecting the capacitance, loss or quality factor (commonly known as CD) of the capacitor. There are two second inspection units E2 and a third inspection unit E3 respectively located in front and behind the first inspection unit E1 in the direction in which the test board C rotates intermittently; wherein, the first inspection unit E1 is located in the direction intermittently rotates. The third inspection unit E3 can be omitted as needed.

請參閱圖4~6所示,該測試板C上表面設有在徑向相隔間距的複數列(本實施例設有8列)同心環狀設置的鏤設矩形的座槽C1,該座槽C1每一列環狀相隔間距設置多數個,各列徑向對應的該座槽C1直線間隔排列呈多數行;該待測元件M以位於上端的上電極M1朝上、及位於下端的下電極M2朝下方式落置於該座槽C1中被該測試板C作間歇性搬送,其中該上電極M1上表面露出於該座槽C1上端開口而略高於該測試板C上表面。 Please refer to Figures 4 to 6. The upper surface of the test plate C is provided with a plurality of radially spaced rows (8 rows in this embodiment) of concentrically arranged rectangular grooves C1. Each column of C1 is provided with a plurality of rings at intervals, and the slots C1 corresponding to the radial direction of each column are linearly spaced and arranged in a plurality of rows; the component under test M has the upper electrode M1 located at the upper end facing upward, and the lower electrode M2 located at the lower end. The upper electrode M1 is placed downwardly in the seat groove C1 and is intermittently transported by the test board C. The upper surface of the upper electrode M1 is exposed at the upper end opening of the seat groove C1 and is slightly higher than the upper surface of the test board C.

請參閱圖7、8,該檢查單元E係以位於該測試板C上方匣盒狀的上端子匣E4中下方設置的可滾動輪體作為上端子E41,配合電性連接該測試板C下方對應設於各該上端子匣E4下方的匣盒狀的下端子匣E5中上方伸設的探針作為下端子E51伸經該承載底盤B進行檢查;在本實施例中係以該第一檢查單元E1為例作說明,在圖3中的第二檢查單元E2、第三檢查單 元E3僅座架的構造與該第一檢查單元E1的該座架E6不同,同樣設有上述上端子E41及下端子E51;以該第一檢查單元E1為例,其中,該上端子匣E4設有一位於上方的匣蓋E42及位於下方的匣座E43,該上端子匣E4係設於可受驅動作上、下位移的一座架E6的一鏤孔E61中,並以匣蓋E42位於該鏤孔E61上方,該匣座E43位於該鏤孔E61中並伸設於其下方,該座架E6受驅動上、下位移時,該上端子E41被連動作上下位移;該匣蓋E42位於該座架E6上表面的一墊件E421上;該匣座E43位於該匣蓋E42下方,其包括位於上方的一連接座E431及位於下方的一上端子座E432;該匣座E43上設有複數個相隔間距併列的(本實施例為8個)該上端子E41,每一個該上端子E41上方分別由下往上依序設有位於該匣座E43上凹設的一置穴E433中供安裝該上端子E41的一上端子座E434、位於該置穴E433內該上端子座E434上方提供該上端子E41上下彈性驅力的一彈簧構成的彈性件E435、一端與該上端子E41連接並電性導通的細長片狀的一導電片E436、使該導電片E436另一端受固設的一轉接部E437、位於該連接座E431中一端與該轉接部E437處該導電片E436另一端電性導通且另一端凸伸於該匣蓋E42中的一連接件E438、在該匣蓋E42中與該連接件E438焊固導通而經該匣蓋E42上一纜線孔E422延伸至該上端子匣E4外的一電纜線E423。 Please refer to Figures 7 and 8. The inspection unit E uses a rolling wheel body located in the middle and lower part of the box-shaped upper terminal box E4 above the test board C as the upper terminal E41, which is electrically connected to the corresponding lower part of the test board C. The probe extending above the box-shaped lower terminal box E5 provided below each upper terminal box E4 is used as a lower terminal E51 to extend through the load-bearing chassis B for inspection; in this embodiment, the first inspection unit is used E1 is taken as an example. In Figure 3, the second inspection unit E2 and the third inspection unit Only the structure of the base frame of unit E3 is different from that of the base frame E6 of the first inspection unit E1. It is also provided with the above-mentioned upper terminal E41 and lower terminal E51; taking the first inspection unit E1 as an example, the upper terminal box E4 There is a box cover E42 located above and a box base E43 located below. The upper terminal box E4 is located in a hole E61 of a frame E6 that can be driven to move up and down, and the box cover E42 is located in the hole E61. Above the hole E61, the box seat E43 is located in the hole E61 and extends below it. When the seat frame E6 is driven to move up and down, the upper terminal E41 is moved up and down in conjunction; the box cover E42 is located in the hole E61. On a pad E421 on the upper surface of the seat frame E6; the box seat E43 is located below the box cover E42, and includes a connecting seat E431 located above and an upper terminal seat E432 located below; the box seat E43 is provided with a plurality of There are 8 upper terminals E41 spaced apart and juxtaposed (eight in this embodiment). Above each upper terminal E41, there is a hole E433 recessed in the box seat E43 from bottom to top for installation. An upper terminal seat E434 of the upper terminal E41 is located above the upper terminal seat E434 in the hole E433, and an elastic member E435 composed of a spring that provides the upper and lower elastic driving force of the upper terminal E41 has one end connected to the upper terminal E41 and electrically connected to the upper terminal E41. A slender sheet-shaped conductive piece E436 that is electrically conductive, an adapter portion E437 fixed at the other end of the conductive piece E436, and the other end of the conductive piece E436 is electrically connected between one end of the connection base E431 and the adapter portion E437. A connector E438 with the other end protruding from the box cover E42 is in electrical conduction and is welded to the connector E438 in the box cover E42 and extends to the upper terminal through a cable hole E422 on the box cover E42. A cable E423 outside the box E4.

請參閱圖8、9,由滾動輪體構成的該上端子E41其輪軸受一彈片E439所支撐而雖受該彈性件E435向下作用的彈力卻能保持在一高度定位;在進行電性檢查時,該待測元件M被該測試板C搬送鄰近該上端子E41前,該上端子E41執行上提至高於該待測元件M上表面的上電極M1一預定間距之高度定位以迴避該待測元件M,而未與搬送而來的該待測元件M發 生碰撞;該上端子E41執行上提前,該上端子E41可與該測試板C表面保持接觸或保持一間距而不接觸;若保持接觸,則該上端子E41執行上提時係自該測試板C表面執行上提;若保持一間距而不接觸,則該上端子E41可位於與該待測元件M上表面相同的高度,而該上端子E41執行上提時係自該待測元件M上表面相同的高度執行上提。 Please refer to Figures 8 and 9. The upper terminal E41 composed of a rolling wheel body has its wheel axis supported by an elastic piece E439 and can be maintained at a high position despite the downward elastic force of the elastic piece E435; during electrical inspection When the device under test M is moved by the test board C and adjacent to the upper terminal E41, the upper terminal E41 is lifted to a height positioning of a predetermined distance higher than the upper electrode M1 on the upper surface of the device under test M to avoid the upper terminal E41. The component under test M is tested without any contact with the component under test M that is transported. A collision occurs; when the upper terminal E41 is advanced, the upper terminal E41 can maintain contact with the surface of the test board C or maintain a distance without contact; if contact is maintained, the upper terminal E41 is removed from the test board when the upper terminal E41 is advanced. The C surface is lifted up; if a distance is maintained without contact, the upper terminal E41 can be located at the same height as the upper surface of the component under test M, and the upper terminal E41 is lifted from the component under test M Lifting is performed at the same height as the surface.

請參閱圖10、11,在該待測元件M被該測試板C搬送至該上端子E41下方時,該上端子E41執行下移抵觸該待測元件C上端的該上電極M1進行檢查。 Referring to FIGS. 10 and 11 , when the device under test M is transported below the upper terminal E41 by the test board C, the upper terminal E41 moves down the upper electrode M1 that contacts the upper end of the device under test C for inspection.

請參閱圖12,完成檢查後,該待測元件M被該測試板C搬送與該上端子E41脫離接觸;所述「脫離接觸」,可採該上端子E41下抵緣保持在該待測元件M進行檢查時上表面高度之高度定位,而僅由該測試板C搬送該待測元件M與該上端子E41脫離接觸方式,而與該待測元件M脫離接觸;亦可在完成檢查後,該待測元件M被該測試板C搬送與該上端子E41脫離接觸前,該上端子E41執行上提至一高度而與該待測元件M上表面保持一間距而不接觸,該測試板C搬送該待測元件M與該上端子E41離開而脫離接觸。 Please refer to Figure 12. After the inspection is completed, the component under test M is moved by the test board C and disengages from the upper terminal E41. The "disconnection" can be achieved by maintaining the lower edge of the upper terminal E41 on the component under test. When M performs the inspection, the height of the upper surface is positioned high, and only the test board C transports the component under test M to disengage from the upper terminal E41 and out of contact with the component under test M; or after the inspection is completed, Before the component under test M is moved out of contact with the upper terminal E41 by the test board C, the upper terminal E41 is lifted to a height and maintains a distance from the upper surface of the component under test M without contact. The test board C The component under test M is moved away from the upper terminal E41 and out of contact.

本創作實施例的電子元件檢查設備,由於在該待測元件M被該測試板C搬送鄰近該上端子E41前,該上端子E41執行上提以迴避該待測元件M;完成檢查後,該待測元件M被該測試板C搬送與該上端子E41脫離接觸;故在該待測元件M被該測試板C搬送鄰近該上端子E41時不會造成碰撞損傷該待測元件M,使檢查結果良率可以提升。 In the electronic component inspection equipment of this embodiment of the invention, before the component under test M is moved by the test board C close to the upper terminal E41, the upper terminal E41 is lifted up to avoid the component under test M; after the inspection is completed, the upper terminal E41 The component under test M is transported by the test board C and is out of contact with the upper terminal E41; therefore, when the component under test M is transported by the test board C and adjacent to the upper terminal E41, there will be no collision damage to the component under test M, making inspection As a result, yield can be improved.

惟以上所述者,僅為本創作之實施例而已,當不能以此限定本創作實施之範圍,凡是依本創作申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本創作專利涵蓋之範圍內。 However, the above are only examples of the invention, and should not be used to limit the scope of the implementation of the invention. All simple equivalent changes and modifications made based on the patent scope of the invention and the contents of the patent specification are still within the scope of the invention. Within the scope covered by this creative patent.

C:測試板 C:Test board

E41:上端子 E41: Upper terminal

M:待測元件 M: component under test

M1:上電極 M1: upper electrode

Claims (5)

一種電子元件檢查設備,包括: 一機台,其上設有一機台台面; 一承載底盤,設於該機台台面,該承載底盤上設置可被驅動進行旋轉的測試板,並在該測試板周緣外設置有一入料單元、一檢查單元、及一排出單元; 該檢查單元設有一座架、設於該座架的複數個上端子匣、及分別各以相隔間距併列方式對應設於各該上端子匣下方的複數個下端子匣;該上端子匣設有複數個相隔間距併列的上端子;該下端子匣設有複數個相隔間距併列的探針; 該測試板上設有座槽供承載待測元件,該待測元件設有位於上端的上電極及位於下端的下電極,其中該上電極露出於該座槽上端開口而高於該測試板上表面; 一上端子,可在該待測元件被該測試板搬送鄰近該上端子前執行上提以迴避該待測元件;該上端子可在該待測元件被該測試板搬送至該上端子下方時,下移抵觸該待測元件上端的該上電極,並在完成檢查後與被該測試板搬送的該待測元件脫離接觸。 An electronic component inspection equipment, including: A machine platform with a machine table; A load-bearing chassis is provided on the machine table. A test plate that can be driven to rotate is provided on the load-bearing chassis, and a feeding unit, an inspection unit, and a discharge unit are provided outside the periphery of the test plate; The inspection unit is provided with a frame, a plurality of upper terminal boxes arranged on the frame, and a plurality of lower terminal boxes arranged correspondingly under each upper terminal box at intervals. The upper terminal box is provided with A plurality of upper terminals arranged side by side at intervals; the lower terminal box is provided with a plurality of probes arranged side by side at intervals; The test board is provided with a seat for carrying the component under test. The component under test is provided with an upper electrode at the upper end and a lower electrode at the lower end. The upper electrode is exposed at the upper end opening of the seat and is higher than the test board. surface; An upper terminal can be lifted up to avoid the component under test before the component under test is transported by the test board adjacent to the upper terminal; the upper terminal can be moved below the upper terminal when the component under test is transported by the test board. , move down the upper electrode that contacts the upper end of the component under test, and disengage from the component under test being transported by the test board after completing the inspection. 如請求項1所述電子元件檢查設備,其中,該上端子在該待測元件被該測試板搬送鄰近該上端子前,該上端子執行上提前,係與該測試板表面保持一間距而不接觸。The electronic component inspection equipment as claimed in claim 1, wherein the upper terminal is advanced to maintain a distance from the surface of the test board before the component to be tested is moved adjacent to the upper terminal by the test board. get in touch with. 如請求項1所述電子元件檢查設備,其中,該上端子在該待測元件被該測試板搬送鄰近該上端子前,該上端子執行上提前,係與該測試板表面保持接觸。The electronic component inspection equipment of claim 1, wherein the upper terminal is in contact with the surface of the test board before the component under test is moved adjacent to the upper terminal by the test board. 如請求項1所述電子元件檢查設備,其中,該上端子可在完成檢查後,該待測元件被該測試板搬送與該上端子脫離接觸前,上提至一高度而與該待測元件上表面保持一間距而不接觸。The electronic component inspection equipment of claim 1, wherein the upper terminal can be lifted to a height and connected to the component under test before the component under test is transported by the test board and out of contact with the upper terminal after the inspection is completed. The upper surfaces remain at a distance without touching. 如請求項1所述電子元件檢查設備,其中,該上端子可在完成檢查後,該待測元件被該測試板搬送與該上端子脫離接觸時,下抵緣保持在該待測元件上表面高度而與該待測元件脫離接觸。The electronic component inspection equipment of claim 1, wherein the upper terminal can maintain the lower edge on the upper surface of the component under test when the component under test is transported by the test board and out of contact with the upper terminal after the inspection is completed. height and disengage from the component under test.
TW112206703U 2023-06-29 2023-06-29 Electronic component inspection equipment TWM648235U (en)

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