TWM445574U - Conveyance carrying disc structure for electric components - Google Patents
Conveyance carrying disc structure for electric components Download PDFInfo
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- TWM445574U TWM445574U TW101215925U TW101215925U TWM445574U TW M445574 U TWM445574 U TW M445574U TW 101215925 U TW101215925 U TW 101215925U TW 101215925 U TW101215925 U TW 101215925U TW M445574 U TWM445574 U TW M445574U
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- receiving space
- tray structure
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本新型係有關於一種載盤構造,尤指一種使用在電子元件搬運作業中,用以承載該電子元件之搬運載盤構造。The present invention relates to a carrier structure, and more particularly to a carrier carrier structure for carrying the electronic component in an electronic component handling operation.
一般習知電子元件的搬運主要以檢測、分選、包裝的設備居多,例如被動元件或LED的檢測、分選、包裝設備,主要是用以檢測電子元件各種物理特性,並將檢測後不同物理特性的電子元件,分別經由不同的路徑予以分開收集,再分別進行包裝;有些設備則依客戶需求僅作檢測、分選作業,亦有僅作分選、包裝者。Generally, the handling of electronic components is mainly carried out by means of detecting, sorting, and packaging. For example, passive components or LEDs are detected, sorted, and packaged, and are mainly used to detect various physical characteristics of electronic components, and different physicalities after detection. The characteristic electronic components are separately collected through different paths and packaged separately; some devices are only used for testing and sorting according to customer requirements, and only for sorting and packaging.
以習知LED電子元件分選設備為例,其通常係採用一作間歇式旋轉的載盤作為搬運的載具,在載盤周緣設環列佈設全周的多數呈鏤設狀之缺槽,使待測之LED電子元件自振動機被排列入料於載盤上恰旋轉位移至振動機對應載盤入料口處之鏤設狀缺槽,而被載盤間歇式旋轉路徑中的各工作站執行預定的操作,各工作站執行的作業例如:極性檢測、極性反轉、物理數據檢測,然後載盤將鏤設狀缺槽中接受過檢測的LED電子元件經由不同的管路以氣體吹送方式,將不同檢測值的LED電子元件分別導入不同管路以進行分開收集。Taking the conventional LED electronic component sorting device as an example, a carrier that is intermittently rotated is generally used as a carrier for transporting, and a majority of the entire circumference of the carrier is disposed on the circumference of the carrier. The LED electronic components to be tested are arranged from the vibrating machine to be placed on the carrier plate and rotated to the corresponding slot of the vibrating machine corresponding to the loading port of the carrier, and are executed by each workstation in the intermittent rotation path of the carrier. The predetermined operation, the operations performed by each workstation, for example, polarity detection, polarity reversal, physical data detection, and then the carrier will pass the detected LED electronic components through the different pipelines by gas blowing. LED electronic components with different detection values are respectively introduced into different pipelines for separate collection.
該習知LED電子元件分選時,作間歇式旋轉的載盤搬運方式,因係藉LED電子元件於鏤設狀缺槽中受間歇式撥推而依循著環形路徑位移,故在位移過程中,LED電子元件下方未受任何保護,而與載盤鏤設狀缺槽中下方的其他部件產生相對位移,亦即將使LED電子元件下方受到摩擦而耗損,這對於某些將作為電性連接的端子設計在下方的LED電子元件而言,端子的部位受到摩擦耗損將影響其電性連接的穩定性,是不被允許的。When the conventional LED electronic component is sorted, the carrier-carrying mode for intermittent rotation is caused by the intermittent displacement of the LED electronic component in the squeezing slot, and follows the circular path displacement, so during the displacement process The underside of the LED electronic components is not protected, but is displaced relative to other components in the lower part of the carrier-shaped vacant slot, and is also subject to friction and wear under the LED electronic components, which will be used for some electrical connections. The terminal design is not allowed in the lower LED electronic components, the friction loss of the terminal portion will affect the stability of the electrical connection.
爰是,本新型之目的,在於提供一種具有保護電子元件在搬運時,其端子不被摩擦而耗損的電子元件之搬運載盤構造。Accordingly, it is an object of the present invention to provide a transfer carrier structure having an electronic component that protects an electronic component from being damaged by friction during transportation.
依據本新型目的之電子元件之搬運載盤構造,包括:載盤周緣上以多數個載槽呈全圓周佈設於載盤周緣,所述載槽各呈上、下兩個階層,其中,上方的階層為一可供電子元件載入的置納空間,下方階層為一可防止電子元件自置納空間掉落的底托元件。The carrier tray structure of the electronic component according to the present invention includes: a plurality of carrier grooves are arranged on the periphery of the carrier plate at a full circumference on the periphery of the carrier plate, and the carrier grooves are respectively in upper and lower levels, wherein the upper portion The hierarchy is a placement space for loading electronic components, and the lower hierarchy is a support component that prevents the electronic components from falling from the self-positioning space.
依據本新型目的之電子元件之搬運載盤構造,另可包括:載盤周緣上以多數個載槽呈全圓周佈設於載盤周緣,該載槽設有一置納空間及一底托元件,該底托元件具有一自置納空間內側緣至載盤外周緣完整佈設的承載面,可將整個置入置納空間內之電子元件完全承載。The carrier tray structure of the electronic component according to the present invention may further include: a plurality of carrier grooves are disposed on the periphery of the carrier plate at a full circumference on the periphery of the carrier plate, and the carrier groove is provided with a receiving space and a supporting member. The bottom member has a bearing surface that is completely disposed from the inner edge of the receiving space to the outer periphery of the carrier, and can completely carry the entire electronic component placed in the receiving space.
本新型實施例之設計,在使用上由於電子元件在搬運過程中被穩固定位於底托元件上,其下方的端子皆受到承托而未與載盤下方的任何其他構造碰觸或摩擦,故電子元件端子皆可以在接受正常測試下,獲得不被磨損的效益,而使整個分選設備的良率大幅提升。The design of the new embodiment is in use because the electronic component is stably fixed on the shoe during the handling process, and the lower terminals are supported without any contact or friction with any other structure under the carrier. The electronic component terminals can obtain the benefits of not being worn out under normal test, and the yield of the entire sorting device is greatly improved.
請參閱第一圖所示本新型應用於LED電子元件分選設備的實施例,本新型實施例之載盤1為一圓形盤體,係設於載置多數個檢測或分選工作站2的載台3下方,其以間歇式旋轉方式逐次將自入料口21進入的LED電子元件4承收入載盤1周緣上的載槽11;載台3係像蓋板一樣地蓋覆在載盤1周緣各載槽11上方,但仍設有載台3未蓋覆到的區段A以供進料或其他操作之需求。Referring to the first embodiment of the present invention, the present invention is applied to an LED electronic component sorting apparatus. The carrier 1 of the present invention is a circular disc body which is disposed on a plurality of detecting or sorting workstations 2 Below the stage 3, the LED electronic component 4 entering from the inlet 21 is successively received into the carrier 11 on the periphery of the carrier 1 in a batch rotation manner; the stage 3 is covered like a cover on the carrier. The periphery of each of the carrier grooves 11 is provided, but the section A not covered by the stage 3 is still provided for the purpose of feeding or other operations.
請參閱第二圖,本新型實施例之載盤1周緣上以多數個載槽11呈全圓周佈設於載盤1周緣,每一載槽11的置入口12在設計上為自圓周外徑向朝載盤1中心方向的方式設計。Referring to the second figure, the periphery of the carrier 1 of the present embodiment is disposed on the periphery of the carrier 1 at a full circumference with a plurality of carriers 11 , and the inlet 12 of each carrier 11 is designed to be radially outward. Designed in the direction of the center of the carrier 1 .
請參閱第三圖,所述載槽11各呈上、下兩個階層,其中,上方的階層為一可供LED電子元件4載入的置納空間13,下方階層為一可防止LED電子元件4自置納空間13掉落的底托元件14;所述底托元件14與形成載槽11的載盤1為一體成型的構造,底托元件14上設有對 應所述置於置納空間13中LED電子元件4上四個端子41(請配合參閱第四圖)的呈長方形四個角落佈設形態的四個鏤空測試區141、142、143、144,以及一個鏤空開設的負壓吸孔145;其中,兩個測試區141、142位於底托元件14外周緣並相隔適間距,兩個測試區143、144位於靠載盤1中心並相對為置納空間13內側底緣的一側;而置納空間13下方的底托元件14更具有一自置納空間13內側緣至載盤1外周緣完整佈設的承載面,可將整個置入置納空間內之LED電子元件4完全承載,而使LED電子元件4上四個端子41懸露於呈長方形四個角落佈設形態的四個鏤空測試區141、142、143、144可以自下往上伸探檢測用探針進行測試。Referring to the third figure, the loading slots 11 are respectively in upper and lower levels, wherein the upper layer is a receiving space 13 for the LED electronic component 4 to be loaded, and the lower layer is a LED electronic component. 4, the bottoming member 14 dropped from the receiving space 13; the supporting member 14 and the carrier 1 forming the carrier 11 are integrally formed, and the supporting member 14 is provided with a pair The four hollow test areas 141, 142, 143, 144 in the form of four rectangular corners arranged in the four corners 41 of the LED electronic component 4 in the receiving space 13 (please refer to the fourth figure), and a hollow suction suction hole 145; wherein the two test areas 141, 142 are located at an outer circumference of the bottom member 14 and are spaced apart from each other, and the two test areas 143, 144 are located at the center of the carrier 1 and are relatively arranged. 13 a side of the inner bottom edge; and the bottoming element 14 below the receiving space 13 has a bearing surface which is completely disposed from the inner edge of the receiving space 13 to the outer periphery of the carrier 1 and can be placed in the receiving space. The LED electronic component 4 is fully loaded, and the four terminals 41 on the LED electronic component 4 are suspended in four hollow test areas 141, 142, 143, and 144 which are arranged in four rectangular corners, and can be tested from bottom to top. Test with a probe.
請參閱第四圖,所述鏤空測試區143、144,其連接載盤1底部一徑向朝載盤1中心之負壓通道15。Referring to the fourth figure, the hollow test zones 143, 144 are connected to the bottom of the carrier 1 and a negative pressure channel 15 radially toward the center of the carrier 1.
請參閱第五圖,所述位於底托元件14外周緣的測試區141、142形成有朝外周緣的缺口146、147,該等缺口146、147使載槽11可以縮短自載盤1外周緣向中心內伸的深度,進而增加在載盤1周緣設置載槽11的數量;置納空間13位於載盤1外周緣的置入口12處形成朝兩側傾斜的擴寬部121,使置入口12具有較寬及容易的置入條件;置納空間13位於朝載盤1中心內側的兩端角落處各設有凹設的逃角131、132,此有助於置入 物深入抵靠置納空間13內側緣定位。Referring to the fifth figure, the test areas 141, 142 on the outer periphery of the base member 14 are formed with notches 146, 147 facing the outer periphery, and the notches 146, 147 enable the carrier groove 11 to shorten the outer circumference of the carrier plate 1. The depth extending into the center increases the number of the loading grooves 11 at the periphery of the carrier 1; the receiving space 13 is located at the inlet 12 of the outer periphery of the carrier 1 to form a widened portion 121 inclined toward both sides, so that the inlet is opened. 12 has a wide and easy insertion condition; the receiving space 13 is located at the corners of the inner side of the center of the carrier 1 and is provided with recessed escape angles 131, 132, which facilitates placement The object is positioned deeper against the inner edge of the receiving space 13.
本新型實施例在實施上,LED電子元件4自置入口12被移入置納空間13時,由於擴寬部121的設計使移入過程不致被卡住而順利移入;並在移入過程中,由載盤1底部徑向朝載盤1中心之負壓通道15通入負壓,使負壓經由鏤空測試區143、144將正在移入過程中的LED電子元件4吸引前抵至置納空間13內側緣定位;另外,藉由在鏤空開設的負壓吸孔145下方賦予負壓吸力,而使LED電子元件4定位在置納空間13中不致在搬運過程被拋落;而由於所述該載置多數個檢測或分選工作站2的載台3係像蓋板一樣地蓋覆在各載盤1周緣各載槽11上方,故載台3本身已具有防止在置納空間13中LED電子元件4在搬運過程被拋落的功能,故該在負壓吸孔145下方賦予負壓吸力的操作,可僅實施在載台3未蓋覆到的區段A。In the implementation of the new embodiment, when the LED electronic component 4 is moved into the receiving space 13 by the built-in inlet 12, the widening portion 121 is designed so that the moving in process is not jammed and smoothly moved in; and during the moving in, the loading The bottom of the disk 1 is radially negatively directed toward the negative pressure channel 15 at the center of the carrier disk 1 so that the negative pressure is attracted to the inner edge of the receiving space 13 before the LED electronic component 4 being moved in through the hollowing test zones 143, 144. Positioning; in addition, by applying a vacuum suction force under the negative pressure suction hole 145 opened in the hollow, the LED electronic component 4 is positioned in the receiving space 13 without being thrown during the handling process; The stages 3 of the detecting or sorting station 2 are covered like the cover plates over the respective loading grooves 11 on the periphery of each of the loading trays 1, so that the stage 3 itself has the LED electronic components 4 prevented from being placed in the receiving space 13. Since the conveyance process is thrown down, the operation of giving a vacuum suction force under the negative pressure suction hole 145 can be performed only in the section A which is not covered by the stage 3.
所述底托元件14上測試區141、142、143、144的數目及位置可依所檢測的LED電子元件4上端子41數目及位置對應作調整;而底托元件14除直接與載盤1一體成型外,亦可以獨立之部件固設於某一載槽11置納空間13下方,亦可以獨立之部件固設於多個或所有載盤1上各載槽11置納空間13下方。The number and position of the test areas 141, 142, 143, 144 on the base member 14 can be adjusted according to the detected number and position of the terminals 41 on the LED electronic component 4; and the bottom member 14 is directly connected to the carrier 1 In addition to the integral molding, the independent components may be fixed under the receiving space 13 of one of the loading slots 11, or may be fixed on the plurality of or all of the loading trays 11 under the receiving spaces 13 of the plurality of loading trays 11.
本新型實施例電子元件之搬運載盤構造在使用上, 由於LED電子元件4在搬運過程中被穩固定位於底托元件14上,LED電子元件4下方的四個端子41皆受到承托而未與載盤1下方的任何其他構造碰觸或摩擦,故在LED電子元件4四個端子41皆可以接受正常測試下,其可獲得不被磨損的效益,而使整個分選設備的良率大幅提升。The carrier tray structure of the electronic component of the present invention is in use, Since the LED electronic component 4 is stably fixed on the shoe component 14 during transportation, the four terminals 41 under the LED electronic component 4 are supported without being in contact with or rubbed against any other structure below the carrier disk 1 In the normal test of the four terminals 41 of the LED electronic component 4, the benefits of not being worn out can be obtained, and the yield of the entire sorting device is greatly improved.
惟以上所述者,僅為本新型之較佳實施例而已,當不能以此限定本新型實施之範圍,即大凡依本新型申請專利範圍及新型說明內容所作之簡單的等效變化與修飾,皆仍屬本新型專利涵蓋之範圍內。However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change and modification made by the novel patent application scope and the novel description content, All remain within the scope of this new patent.
1‧‧‧載盤1‧‧‧Package
11‧‧‧載槽11‧‧‧ slot
12‧‧‧置入口12‧‧‧Settings
121‧‧‧擴寬部121‧‧‧ Widening Department
13‧‧‧置納空間13‧‧‧Withheld space
131‧‧‧逃角131‧‧‧Escape
132‧‧‧逃角132‧‧‧Escape
14‧‧‧底托元件14‧‧‧Bottom components
141‧‧‧測試區141‧‧‧Test area
142‧‧‧測試區142‧‧‧Test area
143‧‧‧測試區143‧‧‧Test area
144‧‧‧測試區144‧‧‧Test area
145‧‧‧吸孔145‧‧ ‧ suction hole
146‧‧‧缺口146‧‧ ‧ gap
147‧‧‧缺口147‧‧ ‧ gap
15‧‧‧通道15‧‧‧ channel
2‧‧‧工作台2‧‧‧Workbench
21‧‧‧入料口21‧‧‧Inlet
3‧‧‧載台3‧‧‧ stage
4‧‧‧電子元件4‧‧‧Electronic components
41‧‧‧端子41‧‧‧terminal
A‧‧‧區段Section A‧‧‧
第一圖所示係本新型實施例之搬運載盤位於分選設備中之配置立體示意圖。The first figure shows a three-dimensional schematic view of the configuration of the carrier tray of the present invention in the sorting device.
第二圖所示係本新型實施例之搬運載盤構造立體示意圖。The second figure is a perspective view showing the structure of the carrier tray of the novel embodiment.
第三圖所示係本新型實施例之搬運載盤部份構造立體示意圖。The third figure is a perspective view showing a part of the structure of the carrier tray of the novel embodiment.
第四圖所示係本新型實施例之搬運載盤部份構造背面立體示意圖。The fourth figure shows a perspective view of the back side of the carrier tray portion of the present embodiment.
第五圖所示係本新型實施例之搬運載盤中載槽構造之放大立體示意圖。The fifth figure shows an enlarged perspective view of the carrier structure in the carrier tray of the present invention.
1‧‧‧載盤1‧‧‧Package
11‧‧‧載槽11‧‧‧ slot
13‧‧‧置納空間13‧‧‧Withheld space
14‧‧‧底托元件14‧‧‧Bottom components
141‧‧‧測試區141‧‧‧Test area
142‧‧‧測試區142‧‧‧Test area
143‧‧‧測試區143‧‧‧Test area
144‧‧‧測試區144‧‧‧Test area
145‧‧‧吸孔145‧‧ ‧ suction hole
4‧‧‧電子元件4‧‧‧Electronic components
41‧‧‧端子41‧‧‧terminal
Claims (15)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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TW101215925U TWM445574U (en) | 2012-08-20 | 2012-08-20 | Conveyance carrying disc structure for electric components |
CN 201320002955 CN203064682U (en) | 2012-08-20 | 2013-01-05 | Carrying tray structure for electronic element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101215925U TWM445574U (en) | 2012-08-20 | 2012-08-20 | Conveyance carrying disc structure for electric components |
Publications (1)
Publication Number | Publication Date |
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TWM445574U true TWM445574U (en) | 2013-01-21 |
Family
ID=48091247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW101215925U TWM445574U (en) | 2012-08-20 | 2012-08-20 | Conveyance carrying disc structure for electric components |
Country Status (2)
Country | Link |
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CN (1) | CN203064682U (en) |
TW (1) | TWM445574U (en) |
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TW201528399A (en) * | 2014-01-02 | 2015-07-16 | All Ring Tech Co Ltd | Electronic component transport method and apparatus |
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2012
- 2012-08-20 TW TW101215925U patent/TWM445574U/en not_active IP Right Cessation
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2013
- 2013-01-05 CN CN 201320002955 patent/CN203064682U/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI572858B (en) * | 2015-05-12 | 2017-03-01 | All Ring Tech Co Ltd | Method and device for detecting the loading of electronic components |
TWI630852B (en) * | 2015-05-12 | 2018-07-21 | 萬潤科技股份有限公司 | Electronic component packaging carrier tape replenishment method and device |
TWI615914B (en) * | 2016-01-18 | 2018-02-21 | Structure of transistor handling inspection | |
TWI677691B (en) * | 2017-06-28 | 2019-11-21 | 萬潤科技股份有限公司 | Electronic component detection method and device, and carrier disk used in the detection method |
TWI742308B (en) * | 2017-10-20 | 2021-10-11 | 德商先進裝配系統有限責任兩合公司 | Modular aufgebaute bauelement-handhabungsvorrichtung mit von einer drehachse abstehenden bauelement-greifwerkzeugen |
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