M439258M439258
• » * I 置料區33或從置料區33輸送出來時，可以藉由真空裝置、真 空吸盤或抽氣裝置的設置，使電子元件能固定在置料區33上。 如第3圖及第4圖所示，檢測單元40，固定設置於本體 20上且位於置料部32之至少一外側，且與置料區33水平設 置，或者檢測單元40可設置於一外接之座體上，再將檢測單 元40靠近並朝向電子元件而設置，以對置料區33内之至少一 電子元件進行水平檢測，其中也可設置有二檢測單元40，分別 ^朝向第一開口 34及第二開口 35内之至少一電子元件進行水平 檢測。由於進行電子元件之檢測時，僅有轉盤31及置料部32 於本體20上旋轉，因此當置料區33之第一開口 34及第二開 口 35藉由旋轉通過檢測單元40時，檢測單元40即可對置料 區33内之電子元件進行水平檢測，又檢測機上可以設置複數 個檢測單元40以同時進行水平檢測之作業，進而提升檢測電 子元件之效率。並且進行水平檢測的同時，檢測單元40不須 移動即可依序檢測各個電子元件，進而能提升檢測電子元件之 '•效率。 ' 如第3圖及第5圖所示，進料單元50，其係設置於本體 20上，並且進料單元50係位於置料部32之一側，而進料單元 50也可以是外接之一輸送道，以將電子元件從輸送道輸送至置 料區33上。其中進料單元50可以進一步具有一水平進料通 道，使得水平進料通道與置料部32相連通，當電子元件從進 料單元50輸送至置料區33時，可以藉由氣吹的方式，將電子 元件從水平進料通道快速地輸送至置料區3 3，並且透過本體 20之一側壁面抵住電子元件的移動，及中空柱36之吸力將電 7 M439258 子元件固定於置料區33上，如此進料單元50不須移動即可依 序將各個電子元件輸送至置料區33上，即可省略每一個電子 元件被進料單元50作垂直取料、移動及垂直置料的重複性動 作，以節省入料的時間，進而提升檢測電子元件之效率。• » * I When the loading area 33 is transported from the loading area 33, the electronic components can be fixed to the stocking area 33 by the arrangement of a vacuum device, a vacuum chuck or an air suction device. As shown in FIG. 3 and FIG. 4, the detecting unit 40 is fixedly disposed on the body 20 and located at least outside of the loading portion 32, and horizontally disposed with the loading area 33, or the detecting unit 40 can be disposed at an external connection. The detection unit 40 is disposed adjacent to and facing the electronic component to perform horizontal detection on at least one electronic component in the loading area 33. The second detecting unit 40 may also be disposed to face the first opening. At least one of the electronic components in the 34 and the second opening 35 performs level detection. When the electronic component is detected, only the turntable 31 and the loading portion 32 are rotated on the body 20, so when the first opening 34 and the second opening 35 of the loading region 33 are rotated through the detecting unit 40, the detecting unit 40 can perform horizontal detection on the electronic components in the loading area 33, and a plurality of detecting units 40 can be disposed on the detecting machine to simultaneously perform the horizontal detecting operation, thereby improving the efficiency of detecting the electronic components. Moreover, while the level detection is performed, the detecting unit 40 can sequentially detect the respective electronic components without moving, thereby improving the efficiency of the detecting electronic components. As shown in FIGS. 3 and 5, the feeding unit 50 is disposed on the body 20, and the feeding unit 50 is located on one side of the receiving portion 32, and the feeding unit 50 may be externally connected. A conveyor path for transporting electronic components from the conveyor path to the loading zone 33. Wherein the feeding unit 50 may further have a horizontal feeding passage such that the horizontal feeding passage communicates with the receiving portion 32, and when the electronic component is transported from the feeding unit 50 to the loading portion 33, the air blowing method may be adopted. The electronic component is quickly transported from the horizontal feed channel to the loading zone 33, and the side wall surface of one of the body 20 is pressed against the movement of the electronic component, and the suction of the hollow column 36 fixes the electric 7 M439258 sub-component to the receiving material. In the area 33, the feeding unit 50 can sequentially transport the electronic components to the loading area 33 without moving, so that each electronic component can be omitted from the feeding unit 50 for vertical take-up, movement and vertical feeding. The repetitive action to save the time of feeding, thereby improving the efficiency of detecting electronic components.
如第2圖至第6圖所示，出料單元60，其係設置於本體 20上，並且出料單元60位於置料部32之一侧，而出料單元 60也可以是外接之一封帶模組61，以將電子元件從置料區33 上輸送出來。其中當電子元件從置料區33輸送至出料單元60 時，亦可以用氣吹的方式，將電子元件快速輸送至出料單元 60，以節省出料的時間，進而提升檢測電子元件之效率。又檢 測機上可以設置有複數個出料單元60,使得當大量之電子元件 檢測完畢欲輸出時，出料單元60能同時將複數個置料區33内 之電子元件輸送出來，並且還可以藉由設置複數個出料單元 60,以將電子元件依檢測狀態作分類以輸出。 藉由本實施例之實施，可以透過進料單元50設置於本體 20上以水平方式輸送電子元件至置料區33，且檢測單元40水籲/ 平設置於置料區33之至少一外側，以對電子元件進行水平之 檢測，並於檢測作業時減少進料單元50及檢測單元40的移 動，進而提升檢測電子元件之效率。 惟上述各實施例係用以說明本創作之特點，其目的在使熟 習該技術者能瞭解本創作之内容並據以實施，而非限定本創作 之專利範圍，故凡其他未脫離本創作所揭示之精神而完成之等 效修飾或修改，仍應包含在以下所述之申請專利範圍中。As shown in FIGS. 2 to 6, the discharge unit 60 is disposed on the body 20, and the discharge unit 60 is located on one side of the receiving portion 32, and the discharge unit 60 may be an external one. A module 61 is provided to transport the electronic components from the stocking zone 33. When the electronic component is transported from the loading area 33 to the discharging unit 60, the electronic component can also be quickly transported to the discharging unit 60 by means of air blowing, thereby saving the time of discharging, thereby improving the efficiency of detecting the electronic component. . Further, the detecting machine may be provided with a plurality of discharging units 60, so that when a large number of electronic components are detected and outputted, the discharging unit 60 can simultaneously transport the electronic components in the plurality of loading zones 33, and can also borrow A plurality of discharge units 60 are provided to classify the electronic components according to the detection state for output. Through the implementation of the embodiment, the electronic component can be horizontally transported to the loading area 33 through the feeding unit 50, and the detecting unit 40 is disposed on the outer side of the loading area 33 to The electronic component is level-detected, and the movement of the feeding unit 50 and the detecting unit 40 is reduced during the detecting operation, thereby improving the efficiency of detecting the electronic component. However, the above embodiments are intended to illustrate the features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the contents of the present invention and to implement it, and not to limit the scope of the patent of the present invention. Equivalent modifications or modifications made by the spirit of the disclosure should still be included in the scope of the claims described below.