TWI618666B - Carrier disk and electronic component measurement method and device using the same - Google Patents
Carrier disk and electronic component measurement method and device using the same Download PDFInfo
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- TWI618666B TWI618666B TW106100321A TW106100321A TWI618666B TW I618666 B TWI618666 B TW I618666B TW 106100321 A TW106100321 A TW 106100321A TW 106100321 A TW106100321 A TW 106100321A TW I618666 B TWI618666 B TW I618666B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G37/00—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes
- B65G37/02—Flow-sheets for conveyor combinations in warehouses, magazines or workshops
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Testing Of Individual Semiconductor Devices (AREA)
- Packaging Frangible Articles (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
本發明提供一種載盤及使用該載盤的電子元件量測方法及裝置,包括:複數個載槽,環列佈設於載盤之周緣,所述載槽的上方設有一由載槽的內周側朝載槽中央處延伸凸出,並遮蓋待測元件頂部部份面積的遮蓋部,載槽的下方設有一可供待測元件載入的置納空間,在載盤間歇性旋轉搬運待測元件時,該遮蓋部與該載槽可一同間歇性旋轉;一搬送步驟,載盤以間歇性旋轉流路使遮蓋部與載槽一同進行間歇性旋轉,搬送載槽內的待測元件至一量測區域;一量測步驟,待測元件停留在量測區域時,探針元件向上碰觸待測元件,並頂升待測元件,使待測元件受遮蓋部擋抵。 The invention provides a carrier disc and a method and device for measuring electronic components using the carrier disc. The carrier disc includes a plurality of carrier grooves, which are arranged in a circle on the periphery of the carrier disc. An inner periphery of the carrier groove is provided above the carrier groove. The cover extends from the side to the center of the loading slot and covers the area of the top part of the component to be tested. Below the loading slot is a receiving space for loading the component to be tested. When a component is in use, the cover portion and the loading slot can rotate intermittently together. In a transfer step, the cover plate rotates the cover portion and the loading slot intermittently with an intermittent rotating flow path, and transfers the component to be tested in the loading slot to a Measurement area; in a measurement step, when the device under test stays in the measurement area, the probe element touches the device under test and lifts up the device under test, so that the cover of the device under test is blocked.
Description
本發明係有關於一種載盤及使用該載盤的量測方法及裝置,尤指一種用以搬送電子元件進行物理特性量測、分類或包裝的載盤及使用該載盤的電子元件量測方法及裝置。 The present invention relates to a carrier disk and a measurement method and device using the same, and more particularly, to a carrier disk for transporting electronic components for physical property measurement, classification, or packaging, and electronic component measurement using the carrier disk. Method and device.
習知電子元件如發光二極體(LED)或被動元件等,在產出後通常會進行物理特性之量測,以進行分類與包裝;專利號第I447060號「工件搬運裝置」已揭露一種工件搬運裝置,具備有平台底座,和旋轉自如配置在平台底座上且於外圍部設有複數之工件收納孔的搬運平台,及經由分離供應部連結於搬運平台,可將工件供應至搬運平台之工件收納孔內的線性進料器;其中,線性進料器、分離供應部、工件收納孔的上面由平台罩蓋覆蓋著;此外,於搬運平台的外圍部,沿著間歇旋轉方向依下述順序設有第1檢查部、第2檢查部、排出部;工件具有長方體形狀於上面具有發光面的本體以及從本體朝長度方向的前方及後方突出作為電極的引線端子;搬運平台旋轉搬運工件到達第1檢查部,搬運平台就會停止,此時,於引線端子之正下方位置的平台底座內,設有垂直方向進退自如的探針,利用控制部的作用使探針朝引線端子前進,以抵接著引線端子的狀態將工件往上推,使工件的上面成為抵接在第1檢查部罩蓋之下面的狀態後就停止往上推,對工件的電性特性進行測定之後,探針就向下退出,並再繼續使搬運平台間歇旋轉搬運工件,當工件到達第2檢查部時,對工件實施與第1檢查 部不同檢查項目的檢查,經第2檢查部檢查結束後的工件會到達排出部從工件收納孔排出。 Known electronic components such as light-emitting diodes (LEDs) or passive components are usually measured for physical characteristics after classification for classification and packaging; Patent No. I447060 "Work Handling Device" has disclosed a workpiece The conveying device includes a platform base, a conveying platform rotatably arranged on the platform base, and a plurality of workpiece storage holes provided on the periphery, and a conveyance platform connected to the conveyance platform via a separate supply unit, which can supply the workpiece to the conveyance platform. The linear feeder in the storage hole; the upper surface of the linear feeder, the separation supply unit, and the workpiece storage hole are covered by the platform cover; in addition, the peripheral portion of the conveying platform is in the following order along the intermittent rotation direction The first inspection section, the second inspection section, and the discharge section are provided; the workpiece has a rectangular parallelepiped body with a light emitting surface on the upper side; and lead terminals protruding from the body toward the front and rear in the longitudinal direction as electrodes; the conveying platform rotates and conveys the workpiece to the first 1 Inspection section, the transport platform will stop. At this time, a vertical direction is provided in the platform base directly below the lead terminal. The retractable probe advances the probe toward the lead terminal by the action of the control unit, and pushes the workpiece up in a state of abutting the lead terminal, so that the upper surface of the workpiece is in contact with the lower surface of the cover of the first inspection portion. After that, it stopped pushing up and measured the electrical characteristics of the workpiece. After that, the probe retracted downward and continued to rotate the conveying platform intermittently to convey the workpiece. When the workpiece reached the second inspection section, the workpiece was compared with the first an examination In the inspection of different inspection items, the workpiece after the inspection by the second inspection section reaches the discharge section and is discharged from the workpiece storage hole.
先前技術在搬運平台間歇旋轉搬運工件時,工件可能會在工件收納孔內跳動而非平整貼附於平台底座的上面,又因工件收納孔的上面被平台罩蓋覆蓋著,故工件的上面可能會碰觸到平台罩蓋的下面,在平台罩蓋不動而搬運平台相對平台罩蓋間歇旋轉搬運工件的情形下,工件的上面可能會因相對位移之摩擦到平台罩蓋造成損傷,以發光二極體(LED)工件為例,其上面的發光面係為透明膠填充,在無外殼的保護下又更有損傷的疑慮;且工件到達檢查部時,平台底座內的探針會以抵接著引線端子的狀態將工件往上推,使工件的上面成為抵觸在檢查部平台罩蓋之下面的狀態,該抵觸之摩擦亦會使工件的上面發生損傷之情形。 In the prior art, when the workpiece is intermittently rotated and conveyed, the workpiece may bounce in the workpiece receiving hole instead of being flatly attached to the upper surface of the platform base, and because the upper surface of the workpiece receiving hole is covered by the platform cover, the upper surface of the workpiece may It will touch the underside of the platform cover. When the platform cover is not moving and the conveying platform rotates and rotates the workpiece intermittently relative to the platform cover, the upper part of the workpiece may be damaged by the relative displacement due to the friction of the platform cover. As an example, the polar body (LED) workpiece is filled with transparent glue, which is more suspected of being damaged under the protection of the shell; and when the workpiece reaches the inspection section, the probe in the platform base will abut. The state of the lead terminal pushes the workpiece up so that the upper surface of the workpiece is in contact with the lower surface of the platform cover of the inspection section, and the friction caused by the interference may cause damage to the upper surface of the workpiece.
爰是,本發明的目的,在於提供一種可減少電子元件在搬送過程中發生損傷的載盤。 That is, an object of the present invention is to provide a carrier disk which can reduce damage to electronic components during transportation.
本發明的另一目的,在於提供一種使用如所述載盤的電子元件量測方法。 Another object of the present invention is to provide an electronic component measurement method using the carrier plate.
本發明的又一目的,在於提供一種使用如所述電子元件量測方法的裝置。 Another object of the present invention is to provide a device using the electronic component measurement method.
依據本發明目的之載盤,包括:複數個載槽,環列佈設於載盤之周緣,所述載槽的上方設有一由載槽的內周側朝載槽中央處延伸凸出,並遮蓋待測元件頂部部份面積的遮蓋部,載槽的下方設有一可供待測元件載入的置納空間,在載盤間歇性旋轉搬運待測元件時,該遮蓋部與該載槽可一同間歇性旋轉。 A carrier disk according to the purpose of the present invention includes: a plurality of carrier grooves arranged in a circle on the peripheral edge of the carrier disk, and an upper part of the carrier groove is provided with a protrusion extending from the inner peripheral side of the carrier groove toward the center of the carrier groove and covering it. A covering part of the area of the top part of the device under test. A receiving space for loading the device under test is provided below the loading slot. When the loading disc is intermittently rotated to carry the device under test, the cover part and the loading slot can be used together. Intermittent rotation.
依據本發明另一目的之電子元件量測方法,係使用如申請專利範圍第1至8項任一項所述載盤,包括:一搬送步驟,載盤以間歇性旋轉流路使遮蓋部與載槽一同進行間歇性旋轉,搬送載槽內的待測元件至一量測區域;一量測步驟,待測元件停留在量測區域時,探針元件向上碰觸待測元件,並頂升待測元件,使待測元件受遮蓋部擋抵。 According to another aspect of the present invention, an electronic component measurement method uses a carrier disc as described in any one of claims 1 to 8 of the patent application scope, including: a transport step, the carrier disc intermittently rotates the flow path to cover the cover and the The loading tank rotates intermittently together to transport the device under test in the loading tank to a measurement area. In a measurement step, when the device under test stays in the measurement area, the probe element touches the device under test and lifts up. The component under test is blocked by the covered part of the component under test.
依據本發明又一目的之電子元件量測裝置,包括:使用如所述電子元件量測方法的裝置。 An electronic component measuring device according to another object of the present invention includes a device using the electronic component measuring method as described above.
本發明實施例之載盤及使用該載盤的電子元件量測方法及裝置,在載盤相對蓋板進行旋轉搬運待測元件時,位於載槽上方的遮蓋部可保護待測元件之頂部,使待測元件不會在搬運過程中因跳動而導致其頂部直接與蓋板產生摩擦而受損;而在載盤停止轉動、探針頂升待測元件時,遮蓋部會擋抵在待測元件頂部周邊,使待測元件頂部不會整面直接碰觸到透光片,可降低待測元件頂部的發光面因碰觸而產生之受損,亦可防止待測元件頂部碰觸到透光片,避免待測元件上之粉塵沾附到透光片而影響日後量測精度之問題。 In the carrier plate and the method and device for measuring electronic components using the carrier plate according to the embodiments of the present invention, when the carrier plate rotates and transports the component to be tested relative to the cover plate, a covering portion located above the loading slot can protect the top of the component to be tested. Prevents the DUT from being damaged due to the bounce caused by the top directly contacting the cover during the transportation process; and when the carrier disc stops rotating and the probe lifts the DUT, the cover part will block the DUT The periphery of the top of the component, so that the entire top of the component under test does not directly touch the light-transmitting sheet, which can reduce the damage caused by the touch of the light-emitting surface on the top of the component under test, and prevent the top of the component under test from touching the transparent surface. Light film, to avoid dust on the component under test from adhering to the light transmitting film and affecting future measurement accuracy.
1‧‧‧載盤 1‧‧‧ tray
11‧‧‧載槽 11‧‧‧ Loading trough
12‧‧‧置入口 12‧‧‧ entrance
13‧‧‧遮蓋部 13‧‧‧ cover
14‧‧‧鏤空部 14‧‧‧ Hollow
15‧‧‧置納空間 15‧‧‧ Admission space
151‧‧‧閃避區間 151‧‧‧Dodge interval
152‧‧‧負壓吸孔 152‧‧‧Negative pressure suction hole
2‧‧‧限制片 2‧‧‧ Restricted
21‧‧‧區段 21‧‧‧ section
2’‧‧‧限制片 2’‧‧‧ Restricted
3‧‧‧蓋板 3‧‧‧ cover
31‧‧‧環形內緣 31‧‧‧circle inner edge
32‧‧‧區段 Section 32‧‧‧
4‧‧‧量測區域 4‧‧‧Measurement area
4’‧‧‧量測區域 4’‧‧‧Measurement area
41‧‧‧透光片 41‧‧‧Translucent sheet
42‧‧‧光學量測元件 42‧‧‧Optical measuring element
5‧‧‧分選區域 5‧‧‧Sorting area
5’‧‧‧分選區域 5’‧‧‧ sorting area
A‧‧‧工作台 A‧‧‧Workbench
A’‧‧‧工作台 A’‧‧‧ workbench
A1‧‧‧探針 A1‧‧‧ Probe
B‧‧‧載盤 B‧‧‧carriage
B1‧‧‧遮蓋構件 B1‧‧‧ Covering member
B11‧‧‧鏤槽 B11‧‧‧Slotted
B12‧‧‧遮蓋部 B12‧‧‧ Covering Department
B13‧‧‧鏤空部 B13‧‧‧Hollow
B2‧‧‧置納構件 B2‧‧‧ Admittance component
B21‧‧‧置納槽 B21‧‧‧Acceptor
B211‧‧‧閃避區間 B211‧‧‧Dodge interval
B212‧‧‧負壓吸孔 B212‧‧‧Negative pressure suction hole
B3‧‧‧載槽 B3‧‧‧carrying trough
W‧‧‧電子元件 W‧‧‧Electronic components
W1‧‧‧電極片 W1‧‧‧ electrode pad
W2‧‧‧發光面 W2‧‧‧ Illuminated surface
圖1係本發明第一實施例中載盤位於量測裝置中之配置立體示意圖。 FIG. 1 is a schematic perspective view of a configuration in which a carrier disk is located in a measuring device in the first embodiment of the present invention.
圖2係本發明第一實施例中載盤構造之立體示意圖。 FIG. 2 is a schematic perspective view of a carrier structure in the first embodiment of the present invention.
圖3係本發明第一實施例中載盤部分構造與電子元件之立體示意圖。 FIG. 3 is a schematic perspective view of a structure of a carrier plate and electronic components in the first embodiment of the present invention.
圖4係本發明第一實施例中載盤之載槽構造之剖面示意圖。 FIG. 4 is a schematic cross-sectional view of a carrier groove structure of a carrier disk in the first embodiment of the present invention.
圖5係本發明第一實施例中遮蓋部分佈在載槽周緣之立體示意圖。 FIG. 5 is a schematic perspective view of the covering part being arranged on the periphery of the loading slot in the first embodiment of the present invention.
圖6係本發明第一實施例中電子元件位於載槽置納空間之示意圖。 FIG. 6 is a schematic diagram of an electronic component located in a receiving space of a loading slot in the first embodiment of the present invention.
圖7係本發明第一實施例中電子元件受探針頂升碰觸遮蓋部之示意圖。 FIG. 7 is a schematic diagram of an electronic component touching a cover part by a probe lifting in a first embodiment of the present invention.
圖8係本發明第二實施例中載盤位於量測裝置中之配置立體示意圖。 FIG. 8 is a schematic perspective view showing a configuration in which a carrier disk is located in a measuring device in the second embodiment of the present invention.
圖9係本發明第三實施例中載盤構造之部分立體示意圖。 FIG. 9 is a partial perspective view of a carrier structure in a third embodiment of the present invention.
圖10係本發明第三實施例中遮蓋構件與置納構件之配置示意圖。 FIG. 10 is a schematic diagram of the configuration of the covering member and the receiving member in the third embodiment of the present invention.
請參閱圖1,本發明第一實施例之載盤及使用該載盤的電子元件量測方法及裝置可以圖中所示之裝置來說明,包括:一載盤1,為一圓形盤體,其可為陶瓷、金屬、玻璃纖維…等材料所製成,載盤1設於一工作台A上,載盤1周緣環列佈設等間距凹設之載槽11,可承接自震動送料機(圖未示)的輸送槽道輸入的待測元件W,並以間歇性旋轉流路搬送待測元件W;一限制片2,設於載盤1周緣並圍擋於載槽11外,以防止待測元件W在搬送過程中被離心力拋甩出載槽11外,限制片2設有一缺空無圍擋之區段21,該區段21用以接設震動送料機的輸送槽道;一蓋板3,呈一環形片狀,其設於限制片2上方,其環形內緣31之內徑小於載盤1外徑,而使其環形內緣31部位有一部份蓋覆於載盤1之各載槽11上方,該蓋板3設有一段缺空的區段32,該區段32處與限制片2的區段21對應,以共同形成用以在該處接設震動送料機的輸送槽道的部位,蓋板3上設有可供設置量測工作站的量測區域4及供設置分選工作站的分選區域5,量測區域4設有一透光片41與一光學量測元件42,其中透光片41為藍寶石玻璃片,光學量測元件42為積分球。 Please refer to FIG. 1. The carrier disk and the electronic component measurement method and device using the carrier disk according to the first embodiment of the present invention can be illustrated by the device shown in the figure, including: a carrier disk 1, which is a circular disk body It can be made of ceramics, metal, glass fiber, etc., the carrier 1 is set on a work table A, and the carrier 1 is arranged in a circle at the periphery of the carrier 1 in a concave groove at an equal interval, which can accept a self-vibrating feeder. (Not shown) The component W to be tested is input from the conveying channel, and the component W to be tested is transported in an intermittent rotating flow path; a limiting piece 2 is provided on the periphery of the carrier plate 1 and is enclosed outside the carrier groove 11 to Prevent the component to be tested W from being thrown out of the loading slot 11 by the centrifugal force during the conveying process, and the limiting piece 2 is provided with an empty and unblocked section 21, which is used to connect the conveying channel of the vibration feeder; A cover plate 3 is in the shape of an annular plate, which is arranged above the restricting plate 2. The inner diameter of the annular inner edge 31 is smaller than the outer diameter of the carrier plate 1, and a part of the annular inner edge 31 covers the carrier plate. Above each of the loading grooves 1 of 1, the cover plate 3 is provided with a section 32 that is vacant, and the section 32 corresponds to the section 21 of the limiting piece 2 for common formation. At the place where the conveying channel of the vibrating feeder is connected, the cover plate 3 is provided with a measurement area 4 where a measurement workstation can be set and a sorting area 5 where a sorting workstation can be set. The measurement area 4 is provided with a The light-transmitting sheet 41 and an optical measuring element 42, wherein the light-transmitting sheet 41 is a sapphire glass sheet, and the optical measuring element 42 is an integrating sphere.
請參閱圖2、3、4,本發明第一實施例之載盤1的載槽11呈輻射狀地以全圓周佈設於載盤1周緣,每一載槽11自圓周外徑的置入口12朝載 盤1中心方向凹設,所述載槽11的上方設有一遮蓋部13與一鏤空部14,遮蓋部13與載盤1一體成形,由載槽11的內周側朝載槽11中央處延伸凸出,遮蓋部13可遮蓋待測元件W頂部周緣部份面積,鏤空部14可顯露未被遮蓋部13遮蓋之待測元件W頂部,載槽11的遮蓋部13下方設有一可供電子元件W載入的置納空間15;在本實施例中,遮蓋部13係分別設於載槽11的左、右兩側,但亦可設於載槽11的內、外兩側或是分佈在載槽11的周緣(如圖5),鏤空部14位於兩相對方向之遮蓋部13之間;置納空間15之左、右兩側底部各設有一由內向外凹設之閃避區間151,置納空間15之內側面底部設有一負壓吸孔152。 Please refer to FIGS. 2, 3, and 4. The carrier grooves 11 of the carrier disk 1 according to the first embodiment of the present invention are arranged radially around the periphery of the carrier disk 1 in a radial manner. Asahi The disk 1 is recessed in the center direction. A covering portion 13 and a hollow portion 14 are provided above the loading slot 11. The covering portion 13 is integrally formed with the loading plate 1 and extends from the inner peripheral side of the loading slot 11 toward the center of the loading slot 11. Convexly, the covering portion 13 can cover the area of the peripheral edge of the top of the component W to be tested, the hollow portion 14 can reveal the top of the component W to be tested that is not covered by the covering portion 13, and an electronic component is provided under the covering portion 13 of the loading slot 11 W loading storage space 15; in this embodiment, the covering portions 13 are respectively provided on the left and right sides of the loading slot 11, but may also be provided on the inner and outer sides of the loading slot 11 or distributed on On the periphery of the loading slot 11 (as shown in FIG. 5), the hollow portion 14 is located between the covering portions 13 in two opposite directions; the left and right sides of the accommodation space 15 are provided with a dodge section 151 recessed from the inside to the outside, respectively. A negative pressure suction hole 152 is provided at the bottom of the inner side of the receiving space 15.
請參閱圖1、3、6,所述待測元件W以發光二極體為例,其具有長方體形狀,待測元件W底部設有兩個電極片W1,該電極片W1可延伸至待測元件W側邊(圖3),待測元件W頂部設有一發光面W2,在進行檢測時,電極片W1可受位於工作台A內之探針A1碰觸而使發光面W2發光,使光線可經由鏤空部14與透光片41透出,並利用位於遮蓋部13與透光片41上方之光學量測元件42來量測光學特性,或是單純使用探針A1來量測電性;置納空間15左、右兩側的閃避區間151可提供待測元件W因加工切割所產生的側邊毛邊容納,使待測元件W在載槽11中位移時避免阻滯而容易進出置納空間15,又當載盤1若以金屬材料製成且電極片W1位於待測元件W側邊時,亦可避免位於待測元件W側邊的電極片W1碰觸到載槽11而導電以致造成量測失敗。 Please refer to FIGS. 1, 3 and 6. The device under test W is a light-emitting diode as an example, which has a rectangular parallelepiped shape. There are two electrode pads W1 at the bottom of the device under test W, which can be extended to the device under test. On the side of element W (Figure 3), a light-emitting surface W2 is provided on the top of the device W to be tested. During the detection, the electrode sheet W1 can be touched by the probe A1 located in the workbench A to cause the light-emitting surface W2 to emit light and make light. The optical characteristics can be measured through the hollow portion 14 and the light-transmitting sheet 41, and the optical characteristics can be measured by using the optical measuring element 42 located above the cover 13 and the light-transmitting sheet 41, or the electrical property can be measured simply by using the probe A1; The avoidance sections 151 on the left and right sides of the accommodation space 15 can provide side burrs to accommodate the component W to be tested due to processing and cutting, so that the component W to be measured can be prevented from being blocked when it is displaced in the loading slot 11 and can be easily moved in and out. Space 15, and if the carrier disk 1 is made of a metal material and the electrode sheet W1 is located on the side of the component W to be tested, the electrode sheet W1 located on the side of the component W to be tested can also avoid contact with the carrier groove 11 and become conductive. Causes measurement failure.
本發明第一實施例之電子元件量測方法包括以下步驟: 一搬送步驟S1,使待測元件W在載槽11之置納空間15內受載槽11之遮蓋部13遮蓋待測元件W頂部周緣部份面積,載盤1以間歇性旋轉流路使遮蓋 部13與載槽11可一同間歇性旋轉搬送載槽11內的待測元件W至量測工作站3; 一量測步驟,待測元件W停留在量測區域4時,工作台A內之探針A1向上碰觸待測元件W底部之電極片W1,並將待測元件W頂升直至待測元件W頂部碰觸遮蓋部13,使遮蓋部13擋抵在待測元件W頂部之左、右兩側(請參閱圖7),此時,可單獨以探針A1量測待測元件W之電性,或是以遮蓋部13與透光片41上方之光學量測元件42,經未被遮蓋部13擋抵而由鏤空部14顯露出來之部位來量測待測元件W的光學特性;待測元件W依量測到的物理特性不同,再由分選區域5排出分類。 The method for measuring an electronic component according to the first embodiment of the present invention includes the following steps: A conveying step S1, so that the component W to be measured is covered by the cover 13 of the component 11 in the receiving space 15 of the support slot 11, and the area around the top edge of the component W is covered by the cover plate 1. The cover plate 1 is covered by the intermittent rotating flow path. The portion 13 and the loading slot 11 can rotate the conveying component W in the loading slot 11 to the measuring station 3 intermittently together. In a measurement step, when the component W to be tested stays in the measurement area 4, the probe A1 in the workbench A touches the electrode sheet W1 at the bottom of the component W to be tested, and lifts the component W to be tested until the component to be tested The top of W touches the cover portion 13 so that the cover portion 13 abuts against the left and right sides of the top of the component W to be measured (see FIG. 7). At this time, the power of the component W to be measured can be measured with the probe A1 alone. The optical characteristics of the component W to be measured are measured by the optical measuring element 42 above the covering portion 13 and the light-transmitting sheet 41 through the portion exposed by the hollow portion 14 without being blocked by the covering portion 13; The measuring element W is different from the measured physical characteristics, and is then sorted out by the sorting area 5.
本發明第一實施例之載盤及使用該載盤的電子元件量測方法及裝置,在載盤1相對蓋板2進行旋轉搬運待測元件W時,位於載槽11上方與載盤1一體成形的遮蓋部13,可與載槽11一同間歇性旋轉保護待測元件W之頂部,使待測元件W不會在搬運過程中因跳動而導致其頂部直接與蓋板2產生摩擦而受損;而在載盤1停止轉動、探針A1頂升待測元件W時,遮蓋部13會擋抵在待測元件W頂部周邊,使待測元件W頂部不會整面直接碰觸到透光片41,可降低待測元件W頂部的發光面W2因碰觸而產生之受損,亦可防止待測元件W頂部碰觸到透光片41,避免待測元件W上之粉塵沾附到透光片41而影響日後量測精度之問題。 The carrier disk of the first embodiment of the present invention and a method and device for measuring electronic components using the carrier disk are integrated with the carrier disk 1 above the carrier groove 11 when the carrier disk 1 rotates and transports the component to be measured W relative to the cover plate 2. The formed cover 13 can intermittently rotate with the loading slot 11 to protect the top of the component W to be tested, so that the component W to be tested will not be directly damaged by the friction with the cover plate 2 due to the bounce during the transportation process. ; When the carrier 1 stops rotating and the probe A1 lifts the component W to be tested, the cover 13 will block against the periphery of the top of the component W to be tested, so that the top of the component W to be tested will not directly touch the entire surface and transmit light. The sheet 41 can reduce the damage caused by the light-emitting surface W2 on the top of the component W to be tested, and can also prevent the top of the component W from being touched by the light-transmitting sheet 41 to prevent dust on the component W from being attached to the component. The light-transmitting sheet 41 affects the measurement accuracy in the future.
本發明實施例中,由於載盤1的遮蓋部13已可防止待測元件W在搬運過程中於載槽11中上、下跳動,在實施上可省略蓋板3之設置,並如圖8所示之本發明第二實施例,將量測區域4’或分選區域5’配合改設於限制片2’或工作台A’上。 In the embodiment of the present invention, since the cover portion 13 of the carrier plate 1 can prevent the component to be measured W from jumping up and down in the carrier slot 11 during the transportation process, the setting of the cover plate 3 can be omitted in implementation, as shown in FIG. 8 As shown in the second embodiment of the present invention, the measurement area 4 'or the sorting area 5' is cooperatively set on the restriction piece 2 'or the work table A'.
請參閱圖9、10,本發明第三實施例中,載盤B係由一遮蓋構件B1與一置納構件B2組合而成,使該遮蓋構件B1與該置納構件B2兩者可 同時進行間歇性旋轉,遮蓋構件B1與置納構件B2兩者皆為圓形盤體且具有相同外徑(圖中僅顯示部分之圓形盤體),遮蓋元件B1相較於置納構件B2具有較薄之厚度;遮蓋構件B1位於載盤B之上方,而置納構件B2位於載盤B之下方,遮蓋構件B1周緣環列佈設複數個等間距凹設之鏤槽B11,置納構件B2對應鏤槽B11之位置在置納構件B2周緣環列佈設複數個等間距凹設之置納槽B21,鏤槽B11具有較置納槽B21小之寬度,置納槽B21之左、右兩側底部各設有一閃避區間B211,置納槽B21之內側面底部設有一負壓吸孔B212;在遮蓋構件B1與置納構件B2兩者組合時,位於上方之鏤槽B11與位於下方之置納槽B21兩者形成載盤B之載槽B3,且因鏤槽B11具有較置納槽B21小之寬度,使鏤槽B11可部分遮蓋置納槽B21之上方,並以鏤槽B11之內緣形成遮蓋部B12,左、右兩側之遮蓋部B12之間形成鏤空部B13。 Please refer to FIGS. 9 and 10. In the third embodiment of the present invention, the carrier plate B is a combination of a cover member B1 and an admittance member B2, so that both the cover member B1 and the admittance member B2 can be combined. At the same time, intermittent rotation is performed. Both the cover member B1 and the admittance member B2 are circular disks and have the same outer diameter (the circular disk body is only shown in the figure). The cover element B1 is compared with the admittance member B2. It has a relatively thin thickness; the cover member B1 is located above the carrier plate B, and the receiving member B2 is located below the carrier plate B. The peripheral edge of the cover member B1 is provided with a plurality of equally spaced concave grooves B11, and the receiving member B2 Corresponding to the slot B11, a plurality of equally spaced recessed receiving slots B21 are arranged on the periphery of the receiving member B2. The slot B11 has a smaller width than the receiving slot B21, and the left and right sides of the receiving slot B21 A dodge section B211 is provided at the bottom, and a negative pressure suction hole B212 is provided at the bottom of the inner side of the receiving slot B21. When the covering member B1 and the receiving member B2 are combined, the upper slot B11 and the lower receiving slot Both grooves B21 form the loading groove B3 of the tray B, and because the engraved groove B11 has a smaller width than the receiving groove B21, the engraved groove B11 can partially cover the receiving groove B21 and use the inner edge of the engraved groove B11. A cover portion B12 is formed, and a hollow portion B13 is formed between the cover portions B12 on the left and right sides.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 However, the above are only the preferred embodiments of the present invention. When the scope of implementation of the present invention cannot be limited by this, that is, the simple equivalent changes and modifications made according to the scope of the patent application and the description of the invention, All are still within the scope of the invention patent.
1‧‧‧載盤 1‧‧‧ tray
11‧‧‧載槽 11‧‧‧ Loading trough
13‧‧‧遮蓋部 13‧‧‧ cover
14‧‧‧鏤空部 14‧‧‧ Hollow
15‧‧‧置納空間 15‧‧‧ Admission space
151‧‧‧閃避區間 151‧‧‧Dodge interval
152‧‧‧負壓吸孔 152‧‧‧Negative pressure suction hole
Claims (12)
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JP2011000564A (en) * | 2009-06-22 | 2011-01-06 | Unitec:Kk | Method and apparatus for transporting and sorting works |
JP2011232040A (en) * | 2010-04-23 | 2011-11-17 | Murata Mfg Co Ltd | Appearance inspection device |
JP2013046909A (en) * | 2012-10-30 | 2013-03-07 | Shibuya Kogyo Co Ltd | Article classifier apparatus |
TW201632915A (en) * | 2015-03-11 | 2016-09-16 | All Ring Tech Co Ltd | Method and device for inspecting electronic parts |
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TWM445574U (en) * | 2012-08-20 | 2013-01-21 | All Ring Tech Co Ltd | Conveyance carrying disc structure for electric components |
TW201528399A (en) * | 2014-01-02 | 2015-07-16 | All Ring Tech Co Ltd | Electronic component transport method and apparatus |
CN203949626U (en) * | 2014-06-03 | 2014-11-19 | 精湛光学科技股份有限公司 | Inspection device for components |
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JP2011000564A (en) * | 2009-06-22 | 2011-01-06 | Unitec:Kk | Method and apparatus for transporting and sorting works |
JP2011232040A (en) * | 2010-04-23 | 2011-11-17 | Murata Mfg Co Ltd | Appearance inspection device |
JP2013046909A (en) * | 2012-10-30 | 2013-03-07 | Shibuya Kogyo Co Ltd | Article classifier apparatus |
TW201632915A (en) * | 2015-03-11 | 2016-09-16 | All Ring Tech Co Ltd | Method and device for inspecting electronic parts |
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