JP2011232040A - Appearance inspection device - Google Patents

Appearance inspection device Download PDF

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JP2011232040A
JP2011232040A JP2010099896A JP2010099896A JP2011232040A JP 2011232040 A JP2011232040 A JP 2011232040A JP 2010099896 A JP2010099896 A JP 2010099896A JP 2010099896 A JP2010099896 A JP 2010099896A JP 2011232040 A JP2011232040 A JP 2011232040A
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inspection apparatus
appearance inspection
electronic component
recess
inclined surface
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JP5703589B2 (en
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Tetsuo Sakai
哲生 酒井
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an appearance inspection device capable of clearly imaging even a ridge portion of an electronic component.SOLUTION: The appearance inspection device stores a rectangular parallelepiped electronic component 120 in a recessed portion 21 formed on a carrying table 20 driven to intermittently rotate in an arrow a direction, and images the appearance of the electronic component 120 by a CCD camera 70. The recessed portion 21 opens to an upper surface and an outer peripheral surface of the carrying table 20, and a tilting surface 21b is formed at a ridge portion made from a side surface 21a of the recessed portion 21 and an upper surface of the table 20. A tilting surface 30b is formed at a ridge portion made from a side surface 30a of an outer peripheral guide member 30 and the upper surface of the table 20. By the tilting surfaces 21b and 30b, illumination light y can reach the ridge portion of the electronic component 120 throughout.

Description

本発明は、外観検査装置、特に、コンデンサなどの電子部品の外観を撮像して検査し、良否を判別するための外観検査装置に関する。   The present invention relates to an appearance inspection apparatus, and more particularly to an appearance inspection apparatus for imaging and inspecting the appearance of an electronic component such as a capacitor to determine whether it is good or bad.

コンデンサやインダクタなどの電子部品は、製造工程の最終段階で、電気特性や外観を検査して良・不良を判別し、不良品を排除して良品のみをテーピングしている。外観検査は搬送テーブルの凹部に収容された電子部品に照明光を当てて撮像し、撮像された画像を観察して良否を判別していた。この種の外観検査装置としては特許文献１を挙げることができる。   At the final stage of the manufacturing process, electronic components such as capacitors and inductors are inspected for electrical characteristics and appearance to determine whether they are good or defective, and reject only defective products and tap only good products. In the appearance inspection, the electronic components housed in the recesses of the transport table are imaged by illuminating illumination light, and the quality is determined by observing the captured images. Patent document 1 can be mentioned as this kind of external appearance inspection apparatus.

この種の外観検査装置にあっては、図６に示すように、矢印ａ方向に回転する円盤状の搬送テーブル１００の外周縁部に形成した凹部１０１に電子部品１２０を収容し、かつ、ガイド部材１１０で外周部を封止した状態で、搬送テーブル１００の主面側から照明光ｙを当てＣＣＤカメラ（図示せず）で撮像していた。なお、電子部品１２０の上面には円形の方向識別マーク１２１が形成されている。また、１０５はベース、１０６はカバーガラスである。   In this type of visual inspection apparatus, as shown in FIG. 6, the electronic component 120 is housed in a recess 101 formed on the outer peripheral edge of a disc-shaped transport table 100 rotating in the direction of arrow a, and a guide is provided. In a state where the outer peripheral portion is sealed with the member 110, the illumination light y is applied from the main surface side of the transfer table 100 and is imaged with a CCD camera (not shown). A circular direction identification mark 121 is formed on the upper surface of the electronic component 120. Reference numeral 105 denotes a base, and 106 denotes a cover glass.

しかしながら、図６に示した外観検査装置にあっては、図示しない吸着保持手段によって図６（Ａ）に示すように、凹部１０１の側面１０１ａ及びガイド部材１１０の側面１１０ａに接触した状態で吸着保持されている。従って、照明光ｙを当てた場合、凹部１０１の稜線部１０１ｂ及びガイド部材１１０の稜線部１１０ａによって照明光ｙの一部が遮られ、電子部品１２０の稜線部に光が届かずに、ＣＣＤカメラの撮像画像による外観選別に支障が生じていた。具体的には、図７に×印を付した部分の画像が不鮮明になる。   However, in the appearance inspection apparatus shown in FIG. 6, the suction holding means is in contact with the side surface 101 a of the recess 101 and the side surface 110 a of the guide member 110 as shown in FIG. Has been. Accordingly, when the illumination light y is applied, a part of the illumination light y is blocked by the ridge line portion 101b of the recess 101 and the ridge line portion 110a of the guide member 110, and the CCD camera does not reach the ridge line portion of the electronic component 120. There was a problem in the appearance selection by the captured images. Specifically, the image of the portion marked with x in FIG. 7 becomes unclear.

特開２００８−２４１５９６号公報JP 2008-241596 A

そこで、本発明の目的は、電子部品の稜線部までも明瞭に撮像することのできる外観検査装置を提供することにある。   SUMMARY OF THE INVENTION An object of the present invention is to provide an appearance inspection apparatus that can clearly image even a ridge line portion of an electronic component.

前記目的を達成するため、本発明の一形態である外観検査装置は、
一方向に間欠的に回転駆動される搬送テーブルに形成された凹部に直方体形状の電子部品を１個ずつ収容し、該電子部品の外観を撮像して検査する外観検査装置において、
前記凹部は前記搬送テーブルの一主面及び外周面に開口しており、
前記凹部の前記一主面に対向する位置に撮像手段及び照明手段が配置され、
前記凹部の側面と前記一主面からなる切欠き状の稜線部に設けられた第１の傾斜面を有していること、
を特徴とする。 In order to achieve the above object, an appearance inspection apparatus according to an aspect of the present invention includes:
In an appearance inspection apparatus that stores one by one rectangular parallelepiped-shaped electronic components in a recess formed in a conveyance table that is rotationally driven intermittently in one direction, and images and inspects the appearance of the electronic components,
The recess is opened on one main surface and outer peripheral surface of the transfer table,
An imaging means and an illumination means are arranged at a position facing the one main surface of the recess,
Having a first inclined surface provided in a notch-shaped ridge line portion composed of a side surface of the concave portion and the one main surface;
It is characterized by.

前記外観検査装置において、搬送テーブルの凹部に収容された電子部品に対して照明手段から光が照射される。凹部の側面と一主面からなる稜線部には第１の傾斜面が設けられているため、照明光は稜線部に遮られることなく電子部品の角部にまで隈なく届き、電子部品の表面が鮮明に撮像される。これにて、電子部品の外観を支障なく検査することが可能となる。   In the appearance inspection apparatus, light is irradiated from the illumination unit to the electronic component housed in the recess of the transport table. Since the first inclined surface is provided in the ridge line portion composed of the side surface and one main surface of the recess, the illumination light reaches the corner of the electronic component without being blocked by the ridge line portion, and the surface of the electronic component Is clearly imaged. As a result, the appearance of the electronic component can be inspected without hindrance.

本発明によれば、電子部品の稜線部までも明瞭に撮像することができ、外観選別の精度が向上する。   According to the present invention, even the ridge line portion of the electronic component can be clearly imaged, and the accuracy of appearance selection is improved.

外観検査装置の概略構成を示す平面図である。It is a top view which shows schematic structure of an external appearance inspection apparatus. 第１実施例である外観検査装置の要部を示し、（Ａ）は平面図、（Ｂ）は（Ａ）のＸ１−Ｘ１断面図、（Ｃ）は（Ａ）のＸ２−Ｘ２断面図である。The principal part of the external appearance inspection apparatus which is 1st Example is shown, (A) is a top view, (B) is X1-X1 sectional drawing of (A), (C) is X2-X2 sectional drawing of (A). is there. 電子部品に対する照明状態の説明図であり、（Ａ）は同軸落射照明を示し、（Ｂ）はリング照明を示す。It is explanatory drawing of the illumination state with respect to an electronic component, (A) shows coaxial epi-illumination, (B) shows ring illumination. 第２実施例である外観検査装置の要部を示し、（Ａ）は平面図、（Ｂ）は（Ａ）のＸ３−Ｘ３断面図、（Ｃ）は（Ａ）のＸ４−Ｘ４断面図である。The principal part of the external appearance inspection apparatus which is 2nd Example is shown, (A) is a top view, (B) is X3-X3 sectional drawing of (A), (C) is X4-X4 sectional drawing of (A). is there. 第３実施例である外観検査装置の要部を示し、（Ａ）は（Ｂ）のＸ５−Ｘ５断面図、（Ｂ）は裏面図、（Ｃ）は（Ｂ）のＸ６−Ｘ６断面図である。The principal part of the external appearance inspection apparatus which is 3rd Example is shown, (A) is X5-X5 sectional drawing of (B), (B) is a back view, (C) is X6-X6 sectional drawing of (B). is there. 従来の外観検査装置の要部を示し、（Ａ）は平面図、（Ｂ）は（Ａ）のＸ７−Ｘ７断面図、（Ｃ）は（Ａ）のＸ８−Ｘ８断面図である。The principal part of the conventional external appearance inspection apparatus is shown, (A) is a plan view, (B) is an X7-X7 sectional view of (A), and (C) is an X8-X8 sectional view of (A). 従来の外観検査装置における照明光の影を示す説明図である。It is explanatory drawing which shows the shadow of the illumination light in the conventional external appearance inspection apparatus.

以下、本発明に係る電子部品の外観検査装置の実施例について添付図面を参照して説明する。なお、各図において、共通する部品、部分には同じ符号を付し、重複する説明は省略する。   Embodiments of an electronic component appearance inspection apparatus according to the present invention will be described below with reference to the accompanying drawings. In addition, in each figure, the same code | symbol is attached | subjected to a common component and part, and the overlapping description is abbreviate | omitted.

（検査装置の概略構成、図１参照）
電子部品の特性を測定し、外観を検査する装置の一例につき、その概略を図１を参照して説明する。 (Schematic configuration of inspection device, see Fig. 1)
An outline of an example of an apparatus for measuring the characteristics of an electronic component and inspecting its appearance will be described with reference to FIG.

この検査装置１は、図１に示すように、チップ型電子部品（ここでは、積層セラミックコンデンサを対象としている）をパーツフィーダ１０から、搬送テーブル２０に供給し、搬送テーブル２０が矢印ａ方向に間欠的に回転するに伴って、電子部品の電気特性を測定するとともに外観を検査し、不良品を取り除いた後、矢印ｂ方向に間欠的に搬送されるテープ５０の凹部５１に良品を１個ずつ収容するようにしたものである。   As shown in FIG. 1, the inspection apparatus 1 supplies chip-type electronic components (here, the target is a multilayer ceramic capacitor) from a parts feeder 10 to a conveyance table 20, and the conveyance table 20 is in the direction of arrow a. As the motor rotates intermittently, the electrical characteristics of the electronic components are measured, the appearance is inspected, and defective products are removed. Then, one non-defective product is placed in the recess 51 of the tape 50 that is intermittently conveyed in the direction of the arrow b. It is designed to be housed one by one.

搬送テーブル２０は、円盤状をなし、その外周縁部に電子部品を１個ずつ収容する凹部２１を有し、該凹部２１の配置ピッチごとに矢印ａ方向に間欠的に回転しつつ供給ステーション４１で電子部品が収容される。搬送テーブル２０の外周面に対向して凹部２１の外周側を封止するための外周ガイド部材３０が、図１に斜線を付して示すように、テープ５０の搬送領域を除いて配置されている。   The transfer table 20 has a disk shape, and has a recess 21 that accommodates electronic components one by one at the outer peripheral edge thereof. The supply station 41 rotates intermittently in the direction of arrow a for each arrangement pitch of the recess 21. The electronic parts are accommodated. An outer peripheral guide member 30 for sealing the outer peripheral side of the recess 21 facing the outer peripheral surface of the transport table 20 is arranged except for the transport region of the tape 50 as shown by hatching in FIG. Yes.

凹部２１に収容された電子部品はステーション４２で容量特性を測定され、ステーション４３で電圧特性を測定され、ステーション４４で外観を検査される。それぞれのステーション４２，４３，４４での測定／検査によって不良品と判別された電子部品は、外周ガイド部材３０に形成した取出し部３１から排除される。良品と判別された電子部品は、排出ステーション４５において搬送テーブル２０からテープ５０に受け渡される。また、排出ステーション４５を含めてテープ５０の表面を覆うように図示しないカバー部材が設けられている。   The electronic component accommodated in the recess 21 is measured for capacity characteristics at a station 42, measured for voltage characteristics at a station 43, and inspected for appearance at a station 44. Electronic parts that are determined to be defective by measurement / inspection at the respective stations 42, 43, 44 are excluded from the take-out portion 31 formed on the outer peripheral guide member 30. The electronic components determined as non-defective products are delivered from the transport table 20 to the tape 50 at the discharge station 45. Further, a cover member (not shown) is provided so as to cover the surface of the tape 50 including the discharge station 45.

テープ５０は、前記凹部２１と同じピッチで電子部品を１個ずつ収容する凹部５１が形成されており、供給リール５２から繰り出されて矢印ｂ方向に搬送され、良品と判別された電子部品が排出ステーション４５にて凹部５１に収容される。電子部品を収容されたテープ５０の表面にはシールテープ５３が貼り付けられ、ヒータ５４で溶着された後、リール５５に巻きとられる。   The tape 50 is formed with recesses 51 for receiving electronic components one by one at the same pitch as the recesses 21 and is fed out from the supply reel 52 and conveyed in the direction of the arrow b. It is accommodated in the recess 51 at the station 45. A seal tape 53 is affixed to the surface of the tape 50 that accommodates the electronic components, and is welded by the heater 54 and then wound around the reel 55.

なお、ステーション４２，４３での特性測定、検査や良否の判別手法などに関しては従来と同様であり、詳細な説明は省略し、以下に外観検査ステーション４４の構成に関して説明する。   Note that the characteristic measurement, inspection, quality determination method, and the like at the stations 42 and 43 are the same as those in the prior art, and detailed description is omitted, and the configuration of the appearance inspection station 44 will be described below.

（第１実施例、図２〜図３参照）
図２に示すように、搬送テーブル２０の下面側にはベース６０が配置され、上面側にはカバーガラス６１が配置されている。カバーガラス６１は、外観検査ステーション４４に対応した位置に窓部６１ａが形成されている。搬送テーブル２０の外周縁部に等ピッチで形成された凹部２１は、搬送テーブル２０の一主面（カバーガラス６１側の主面）及び外周面に開口しており、底部はベース６０によって塞がれ、外周面にはガイド部材３０の側面３０ａが近接して対向している。 (Refer to the first embodiment, FIGS. 2 to 3)
As shown in FIG. 2, a base 60 is disposed on the lower surface side of the transfer table 20, and a cover glass 61 is disposed on the upper surface side. The cover glass 61 has a window portion 61 a at a position corresponding to the appearance inspection station 44. Concave portions 21 formed at equal pitches on the outer peripheral edge of the transfer table 20 are open on one main surface (the main surface on the cover glass 61 side) and the outer peripheral surface of the transfer table 20, and the bottom is closed by the base 60. In addition, the side surface 30a of the guide member 30 is closely opposed to the outer peripheral surface.

また、ベース６０と外周ガイド部材３０の間には、電子部品１２０を凹部２１に吸着保持するための真空吸着手段６５が設置されている。この真空吸着手段６５は、電子部品１２０を凹部２１内において側面２１ａ及び外周ガイド部材３０の側面３０ａに接触させた状態で（図２（Ａ）参照）吸着保持する。凹部２１の側面２１ａと一主面からなる稜線部は切り欠かれた第１の斜面部２１ｂとされている。さらに、外周ガイド部材３０の側面３０ａと一主面からなる稜線部は切り欠かれた第２の傾斜面３０ｂとされている。   Further, a vacuum suction means 65 for sucking and holding the electronic component 120 in the recess 21 is installed between the base 60 and the outer peripheral guide member 30. The vacuum suction means 65 sucks and holds the electronic component 120 in a state where the electronic component 120 is in contact with the side surface 21a and the side surface 30a of the outer peripheral guide member 30 in the recess 21 (see FIG. 2A). The ridge line part which consists of the side surface 21a and one main surface of the recessed part 21 is made into the cut | disconnected 1st slope part 21b. Furthermore, the ridgeline part which consists of the side surface 30a and one main surface of the outer periphery guide member 30 is made into the 2nd inclined surface 30b which was notched.

図２（Ｃ）に示すように、凹部２１の一主面に対向する位置に撮像手段であるＣＣＤカメラ７０及びリング照明器７５が配置されている。   As shown in FIG. 2C, a CCD camera 70 and a ring illuminator 75, which are imaging means, are arranged at a position facing one main surface of the recess 21.

搬送テーブル２０の凹部２１に１個ずつ収容されて外観検査ステーション４４に搬送された電子部品１２０は、搬送テーブル２０の回転が一旦停止されている間に、リング照明器７５からの照明光ｙを受けてＣＣＤカメラ７０にてその表面が撮像される。この画像は図示しないモニタ画面に映し出され、外観上の傷などの有無が判別される。このとき、電子部品１２０の稜線部であって側面２１ａ，３０ａに対向する部分は側面２１ａ，３０ａの稜線部が傾斜面２１ｂ，３０ｂとされているために、照明光ｙは電子部品１２０の稜線部にまで隈なく届き、電子部品１２０の表面が鮮明に撮像されることになる。これにて、電子部品１２０の外観を支障なく検査することが可能になる。   The electronic components 120 housed one by one in the recess 21 of the transport table 20 and transported to the appearance inspection station 44 receive the illumination light y from the ring illuminator 75 while the rotation of the transport table 20 is temporarily stopped. Then, the surface is imaged by the CCD camera 70. This image is displayed on a monitor screen (not shown), and the presence or absence of an external scratch or the like is determined. At this time, since the ridge line portion of the electronic component 120 and the portions facing the side surfaces 21a and 30a are the ridge line portions of the side surfaces 21a and 30a are inclined surfaces 21b and 30b, the illumination light y is the ridge line of the electronic component 120. As a result, the surface of the electronic component 120 is clearly imaged. Thus, the appearance of the electronic component 120 can be inspected without hindrance.

ところで、第１の傾斜面２１ｂは、搬送テーブル２０の回転方向ａに対して下流側に形成されている。これは、電子部品１２０を凹部２１内において回転方向ａの下流側の側面２１ａに当てて搬送するほうが上流側の側面２１ｃに当てて搬送するよりも搬送性が安定するからである。   Incidentally, the first inclined surface 21 b is formed on the downstream side with respect to the rotation direction “a” of the transport table 20. This is because the transportability is more stable when the electronic component 120 is transported against the downstream side surface 21a in the recess 21 than the downstream side surface 21c.

また、電子部品１２０の角部は断面円弧形状に面取りされている。前記傾斜面２１ｂ，３０ｂの面積は、電子部品１２０の角部の面取り部分よりも広い面積であることが、照明光ｙを電子部品１２０の角部にまで効果的に照射することを保障するうえで好ましい。面積比でいえば、傾斜面２１ｂ，３０ｂの面積は、電子部品１２０の角部の面取り部分の面積よりも１０〜１００％広いことが好ましい。   Further, the corners of the electronic component 120 are chamfered in a circular arc shape in cross section. The area of the inclined surfaces 21b and 30b is larger than the chamfered portion of the corner of the electronic component 120, so that the illumination light y can be effectively irradiated to the corner of the electronic component 120. Is preferable. In terms of area ratio, the area of the inclined surfaces 21 b and 30 b is preferably 10 to 100% wider than the area of the chamfered portion of the corner of the electronic component 120.

図３（Ａ）に示すように、電子部品１２０の真上から垂直な照明（同軸落射照明）を当てれば、傾斜面２１ｂ，３０ｂが形成されていなくても撮像された画像に悪影響が出なくなるとも考えられる。しかし、電子部品１２０の角部は断面円弧状の面取り部１２０ａとされているため、同軸落射照明では面取り部１２０ａで光が正反射してしまい、結果的に電子部品１２０の角部の画像は不明瞭となる。   As shown in FIG. 3A, if vertical illumination (coaxial epi-illumination) is applied from directly above the electronic component 120, the captured image will not be adversely affected even if the inclined surfaces 21b and 30b are not formed. You might also say that. However, since the corner portion of the electronic component 120 is a chamfered portion 120a having a circular arc cross section, light is regularly reflected by the chamfered portion 120a in the coaxial incident illumination, and as a result, the image of the corner portion of the electronic component 120 is It becomes unclear.

しかし、照明器７５によるリング照明やドーム照明は、図３（Ｂ）に示すように、様々な角度からの照明光ｙを放射するため、電子部品１２０の面取り部１２０ａでも様々な角度に反射する。それゆえ、照明光としては、同軸落射照明よりもリング照明やドーム照明が好ましい。   However, ring illumination or dome illumination by the illuminator 75 radiates illumination light y from various angles as shown in FIG. 3B, and therefore, the chamfered portion 120a of the electronic component 120 is also reflected at various angles. . Therefore, as illumination light, ring illumination or dome illumination is preferable to coaxial epi-illumination.

（第２実施例、図４参照）
第２実施例は、図４に示すように、電子部品１２０を凹部２１内で吸着保持するための手段として静電吸着手段６６を設けたものである。静電吸着手段６６は、電子部品１２０を凹部２１内において側面２１ａ及び外周ガイド部材３０の側面３０ａに接触させた状態で（図４（Ａ）参照）吸着保持する。その他の構成は前記第１実施例と同様である。従って、本第２実施例の作用効果は第１実施例と同様である。 (Refer to the second embodiment, FIG. 4)
In the second embodiment, as shown in FIG. 4, an electrostatic adsorption means 66 is provided as means for adsorbing and holding the electronic component 120 in the recess 21. The electrostatic attraction means 66 holds and holds the electronic component 120 in contact with the side surface 21a and the side surface 30a of the outer circumferential guide member 30 in the recess 21 (see FIG. 4A). Other configurations are the same as those of the first embodiment. Therefore, the operational effects of the second embodiment are the same as those of the first embodiment.

（第３実施例、図５参照）
第３実施例は、図５に示すように、凹部２１を搬送テーブル２０の下面側に開口するように形成したもので、ベース６０に外観撮像のための窓部６０ａが形成されている。他の構成は前記第１実施例と同様である。従って、本第３実施例の作用効果は第１実施例と同様である。 (Refer to the third embodiment, FIG. 5)
In the third embodiment, as shown in FIG. 5, the recess 21 is formed so as to open to the lower surface side of the transport table 20, and a window 60 a for appearance imaging is formed on the base 60. Other configurations are the same as those of the first embodiment. Accordingly, the operational effects of the third embodiment are the same as those of the first embodiment.

（他の実施例）
なお、本発明に係る外観検査装置は前記実施例に限定するものではなく、その要旨の範囲内で種々に変更できる。特に、被検査対象物である電子部品は前記コンデンサに限らず、インダクタやフィルタ、複合部品などであってもよい。 (Other examples)
The appearance inspection apparatus according to the present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the gist thereof. In particular, the electronic component that is the object to be inspected is not limited to the capacitor, but may be an inductor, a filter, a composite component, or the like.

以上のように、本発明は、電子部品の外観を撮像して検査する外観検査装置に有用であり、特に、電子部品の稜線部までも明瞭に撮像することができる点で優れている。   As described above, the present invention is useful for an appearance inspection apparatus that images and inspects the appearance of an electronic component, and is particularly excellent in that even a ridge line portion of the electronic component can be clearly imaged.

２０…搬送テーブル
２１…凹部
２１ａ…側面
２１ｂ…第１の傾斜面
３０…外周ガイド部材
３０ａ…側面
３０ｂ…第２の傾斜面
６５…真空吸着手段
６６…静電吸着手段
７０…ＣＣＤカメラ
７５…リング照明
１２０…電子部品 DESCRIPTION OF SYMBOLS 20 ... Transfer table 21 ... Concave part 21a ... Side 21b ... 1st inclined surface 30 ... Outer periphery guide member 30a ... Side surface 30b ... 2nd inclined surface 65 ... Vacuum suction means 66 ... Electrostatic suction means 70 ... CCD camera 75 ... Ring Lighting 120 ... Electronic components

Claims (9)

一方向に間欠的に回転駆動される搬送テーブルに形成された凹部に直方体形状の電子部品を１個ずつ収容し、該電子部品の外観を撮像して検査する外観検査装置において、
前記凹部は前記搬送テーブルの一主面及び外周面に開口しており、
前記凹部の前記一主面に対向する位置に撮像手段及び照明手段が配置され、
前記凹部の側面と前記一主面からなる切欠き状の稜線部に設けられた第１の傾斜面を有していること、
を特徴とする外観検査装置。 In an appearance inspection apparatus that stores one by one rectangular parallelepiped-shaped electronic components in a recess formed in a conveyance table that is rotationally driven intermittently in one direction, and images and inspects the appearance of the electronic components,
The recess is opened on one main surface and outer peripheral surface of the transfer table,
An imaging means and an illumination means are arranged at a position facing the one main surface of the recess,
Having a first inclined surface provided in a notch-shaped ridge line portion composed of a side surface of the concave portion and the one main surface;
An appearance inspection apparatus characterized by 前記搬送テーブルは円盤状をなし、その外周縁部に前記凹部が所定ピッチで形成され
前記凹部の外周面に対向する位置に側面を有し、前記搬送テーブルの一主面と同じ平面の一主面を有するガイド部材が配置され、
前記ガイド部材の側面と一主面からなる切欠き状の稜線部に設けられた第２の傾斜面を有していること、
を特徴とする請求項１に記載の外観検査装置。 The transport table has a disk shape, the recesses are formed at a predetermined pitch on the outer peripheral edge thereof, and has a side surface at a position facing the outer peripheral surface of the recess, and the main surface is the same plane as the main surface of the transport table. A guide member having a surface is disposed;
Having a second inclined surface provided in a notched ridge line portion consisting of a side surface and one main surface of the guide member;
The appearance inspection apparatus according to claim 1. 前記第１の傾斜面及び／又は前記第２の傾斜面は前記電子部品の角部の面取り部分よりも広い面積であること、を特徴とする請求項１又は請求項２に記載の外観検査装置。   The visual inspection apparatus according to claim 1, wherein the first inclined surface and / or the second inclined surface has a larger area than a chamfered portion of a corner portion of the electronic component. . 前記第１の傾斜面及び／又は前記第２の傾斜面は前記電子部品の角部の面取り部分よりも１０〜１００％広い面積であること、を特徴とする請求項３に記載の外観検査装置。   The visual inspection apparatus according to claim 3, wherein the first inclined surface and / or the second inclined surface is 10 to 100% wider than a chamfered portion of a corner portion of the electronic component. . 前記第１の傾斜面は前記搬送テーブルの回転方向の下流側に形成されていること、を特徴とする請求項１ないし請求項４のいずれかに記載の外観検査装置。   5. The appearance inspection apparatus according to claim 1, wherein the first inclined surface is formed on a downstream side in a rotation direction of the transport table. 前記電子部品を前記凹部に吸着保持する吸着保持手段を備え、該吸着保持手段は前記電子部品を前記第１及び第２の傾斜面側に吸着保持すること、を特徴とする請求項２ないし請求項５のいずれかに記載の外観検査装置。   The suction holding means for sucking and holding the electronic component in the recess, the suction holding means sucking and holding the electronic component on the first and second inclined surface sides. Item 6. The appearance inspection apparatus according to any one of Items 5 to 6. 前記吸着保持手段は真空吸着手段であること、を特徴とする請求項６に記載の外観検査装置。   The appearance inspection apparatus according to claim 6, wherein the suction holding unit is a vacuum suction unit. 前記吸着保持手段は静電吸着手段であること、を特徴とする請求項６に記載の外観検査装置。   The appearance inspection apparatus according to claim 6, wherein the adsorption holding unit is an electrostatic adsorption unit. 前記照明手段はリング照明であること、を特徴とする請求項１ないし請求項８のいずれかに記載の外観検査装置。   9. The appearance inspection apparatus according to claim 1, wherein the illumination unit is ring illumination.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI618666B (en) * 2017-01-05 2018-03-21 All Ring Tech Co Ltd Carrier disk and electronic component measurement method and device using the same
KR101919692B1 (en) 2017-04-26 2018-11-16 윈텍 주식회사 Electrostatic attraction type inspection table for electric parts

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JPS62118578U (en) * 1985-09-30 1987-07-28
JPH11295236A (en) * 1998-04-06 1999-10-29 Nitto Kogyo Co Ltd Six-face inspection apparatus for chip
JP2000074639A (en) * 1998-09-03 2000-03-14 Mitsubishi Materials Corp Automatic visual inspection machine
JP2002319021A (en) * 2001-04-19 2002-10-31 Murata Mfg Co Ltd Binarization processing method, appearance inspection method and appearance inspection device

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JPS62118578U (en) * 1985-09-30 1987-07-28
JPH11295236A (en) * 1998-04-06 1999-10-29 Nitto Kogyo Co Ltd Six-face inspection apparatus for chip
JP2000074639A (en) * 1998-09-03 2000-03-14 Mitsubishi Materials Corp Automatic visual inspection machine
JP2002319021A (en) * 2001-04-19 2002-10-31 Murata Mfg Co Ltd Binarization processing method, appearance inspection method and appearance inspection device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI618666B (en) * 2017-01-05 2018-03-21 All Ring Tech Co Ltd Carrier disk and electronic component measurement method and device using the same
KR101919692B1 (en) 2017-04-26 2018-11-16 윈텍 주식회사 Electrostatic attraction type inspection table for electric parts

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