TW202330846A - 暫時保護材 - Google Patents

暫時保護材 Download PDF

Info

Publication number
TW202330846A
TW202330846A TW111134936A TW111134936A TW202330846A TW 202330846 A TW202330846 A TW 202330846A TW 111134936 A TW111134936 A TW 111134936A TW 111134936 A TW111134936 A TW 111134936A TW 202330846 A TW202330846 A TW 202330846A
Authority
TW
Taiwan
Prior art keywords
layer
weight
polyvinyl alcohol
aqueous solution
based resin
Prior art date
Application number
TW111134936A
Other languages
English (en)
Chinese (zh)
Inventor
米田義和
山田佑
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202330846A publication Critical patent/TW202330846A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/02—Homopolymers or copolymers of unsaturated alcohols
    • C09J129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW111134936A 2021-09-16 2022-09-15 暫時保護材 TW202330846A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021151026 2021-09-16
JP2021-151026 2021-09-16

Publications (1)

Publication Number Publication Date
TW202330846A true TW202330846A (zh) 2023-08-01

Family

ID=85602880

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111134936A TW202330846A (zh) 2021-09-16 2022-09-15 暫時保護材

Country Status (3)

Country Link
JP (1) JPWO2023042838A1 (https=)
TW (1) TW202330846A (https=)
WO (1) WO2023042838A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060144514A1 (en) * 2005-01-03 2006-07-06 Yongcai Wang Polarizing plate laminated with an improved glue composition and a method of manufacturing the same
EP2793061A4 (en) * 2011-12-12 2015-09-16 Konica Minolta Inc OPTICAL LAMINATED FOIL, INFRARED PROTECTION FILM AND INFRARED VISOR BODY
JP5788923B2 (ja) * 2012-03-23 2015-10-07 富士フイルム株式会社 導電性組成物、導電性部材、導電性部材の製造方法、タッチパネルおよび太陽電池
WO2016076261A1 (ja) * 2014-11-11 2016-05-19 富士フイルム株式会社 仮接着膜の製造方法、仮接着膜、積層体、デバイスウエハ付き積層体、仮接着用組成物

Also Published As

Publication number Publication date
JPWO2023042838A1 (https=) 2023-03-23
WO2023042838A1 (ja) 2023-03-23

Similar Documents

Publication Publication Date Title
KR101367177B1 (ko) 대전방지성 보호필름용 점착제 조성물 및 이의 제조방법
JP5841536B2 (ja) 透明粘着テープ、金属薄膜付フィルム積層体、カバーパネル−タッチパネルモジュール積層体、カバーパネル−ディスプレイパネルモジュール積層体、タッチパネルモジュール−ディスプレイパネルモジュール積層体、及び、画像表示装置
JP5020496B2 (ja) 接着剤組成物および接着フィルム
CN105247661A (zh) 半导体晶片保护用膜及半导体装置的制造方法
CN106574161A (zh) 粘合剂组合物、使其交联而成的粘合剂、遮蔽薄膜用粘合剂、耐热粘合薄膜用粘合剂、遮蔽用耐热粘合薄膜和其使用方法
JP2010163526A (ja) 再剥離用水分散型アクリル系粘着剤組成物及び粘着シート
CN1283450C (zh) 保护带，处理层形成剂,光学膜和图像视觉显示器
JP6791736B2 (ja) 粘着剤組成物及び粘着シート
JP7185086B1 (ja) 仮保護材
TW202146614A (zh) 黏合劑組成物、黏合層及黏合膜
JP4054219B2 (ja) 半導体ウェハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウェハ保護方法
TW201934318A (zh) 帶表面保護薄膜的光學層疊體
TW202328383A (zh) 暫時保護材
KR20150111864A (ko) 점착 시트
JP6364200B2 (ja) 電子部品用粘着テープ、電子部品の製造方法及びイメージセンサの製造方法
TW202330846A (zh) 暫時保護材
JP5525779B2 (ja) 接着剤組成物、及び接着フィルム
JP2015168716A (ja) 保護シート
JP2015040215A (ja) タッチパネル用粘着剤組成物及びタッチパネル用粘着テープ
TWI891633B (zh) 表面保護膜
JP2011162616A (ja) 再剥離性粘着剤組成物、これを用いた再剥離性粘着シート、この粘着シートを用いた積層体、電子部品の製造方法及びこの製造方法を用いて得られた電子部品
TWI897860B (zh) 黏著帶及黏著帶捲體
TW202106831A (zh) 黏著帶
JP2023043860A (ja) 仮保護材
CN110073468B (zh) 切割片