TW202330821A - 研磨用組合物 - Google Patents

研磨用組合物 Download PDF

Info

Publication number
TW202330821A
TW202330821A TW111136912A TW111136912A TW202330821A TW 202330821 A TW202330821 A TW 202330821A TW 111136912 A TW111136912 A TW 111136912A TW 111136912 A TW111136912 A TW 111136912A TW 202330821 A TW202330821 A TW 202330821A
Authority
TW
Taiwan
Prior art keywords
polishing
less
polishing composition
acid
abrasive grains
Prior art date
Application number
TW111136912A
Other languages
English (en)
Chinese (zh)
Inventor
森嘉男
中貝雄一郎
織田博之
Original Assignee
日商福吉米股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商福吉米股份有限公司 filed Critical 日商福吉米股份有限公司
Publication of TW202330821A publication Critical patent/TW202330821A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW111136912A 2021-09-30 2022-09-29 研磨用組合物 TW202330821A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-162176 2021-09-30
JP2021162176 2021-09-30

Publications (1)

Publication Number Publication Date
TW202330821A true TW202330821A (zh) 2023-08-01

Family

ID=85782764

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111136912A TW202330821A (zh) 2021-09-30 2022-09-29 研磨用組合物

Country Status (7)

Country Link
US (1) US20240392164A1 (https=)
EP (1) EP4410922A4 (https=)
JP (1) JPWO2023054385A1 (https=)
KR (1) KR20240070626A (https=)
CN (1) CN118055994A (https=)
TW (1) TW202330821A (https=)
WO (1) WO2023054385A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025205563A1 (ja) * 2024-03-28 2025-10-02 株式会社フジミインコーポレーテッド 研磨用組成物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101684393B (zh) * 2008-09-26 2014-02-26 安集微电子（上海）有限公司 一种化学机械抛光浆料
WO2013054883A1 (ja) * 2011-10-13 2013-04-18 三井金属鉱業株式会社 研摩材スラリー及び研摩方法
JP6448314B2 (ja) * 2014-11-06 2019-01-09 株式会社ディスコ 研磨液及びＳｉＣ基板の研磨方法
JP6611485B2 (ja) 2014-11-07 2019-11-27 株式会社フジミインコーポレーテッド 研磨方法およびポリシング用組成物
CN110299403B (zh) * 2014-11-27 2022-03-25 住友电气工业株式会社 碳化硅基板
WO2017212971A1 (ja) * 2016-06-08 2017-12-14 三井金属鉱業株式会社 研摩液及び研摩物の製造方法
KR102337333B1 (ko) * 2017-05-25 2021-12-13 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 세라믹 재료의 화학기계적 연마를 위한 산화 유체
US11339311B2 (en) * 2018-01-11 2022-05-24 Fujimi Incorporated Polishing composition
TWI861353B (zh) * 2020-01-31 2024-11-11 美商恩特葛瑞斯股份有限公司 用於研磨硬質材料之化學機械研磨(cmp)組合物
JP7381382B2 (ja) 2020-03-30 2023-11-15 イビデン株式会社 燃焼装置用消音器
CN114410226A (zh) * 2022-01-27 2022-04-29 中国科学院上海微系统与信息技术研究所 一种抛光液及其制备方法和应用

Also Published As

Publication number Publication date
JPWO2023054385A1 (https=) 2023-04-06
KR20240070626A (ko) 2024-05-21
WO2023054385A1 (ja) 2023-04-06
EP4410922A4 (en) 2025-09-24
US20240392164A1 (en) 2024-11-28
CN118055994A (zh) 2024-05-17
EP4410922A1 (en) 2024-08-07

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