JPWO2023054385A1 - - Google Patents

Info

Publication number
JPWO2023054385A1
JPWO2023054385A1 JP2023551545A JP2023551545A JPWO2023054385A1 JP WO2023054385 A1 JPWO2023054385 A1 JP WO2023054385A1 JP 2023551545 A JP2023551545 A JP 2023551545A JP 2023551545 A JP2023551545 A JP 2023551545A JP WO2023054385 A1 JPWO2023054385 A1 JP WO2023054385A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023551545A
Other versions
JPWO2023054385A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023054385A1 publication Critical patent/JPWO2023054385A1/ja
Publication of JPWO2023054385A5 publication Critical patent/JPWO2023054385A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dispersion Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2023551545A 2021-09-30 2022-09-27 Pending JPWO2023054385A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021162176 2021-09-30
PCT/JP2022/035994 WO2023054385A1 (ja) 2021-09-30 2022-09-27 研磨用組成物

Publications (2)

Publication Number Publication Date
JPWO2023054385A1 true JPWO2023054385A1 (ja) 2023-04-06
JPWO2023054385A5 JPWO2023054385A5 (ja) 2024-06-21

Family

ID=85782764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023551545A Pending JPWO2023054385A1 (ja) 2021-09-30 2022-09-27

Country Status (5)

Country Link
JP (1) JPWO2023054385A1 (ja)
KR (1) KR20240070626A (ja)
CN (1) CN118055994A (ja)
TW (1) TW202330821A (ja)
WO (1) WO2023054385A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103890127B (zh) * 2011-10-13 2015-09-09 三井金属矿业株式会社 研磨剂浆料及研磨方法
JP6448314B2 (ja) * 2014-11-06 2019-01-09 株式会社ディスコ 研磨液及びＳｉＣ基板の研磨方法
JP6656829B2 (ja) 2014-11-07 2020-03-04 株式会社フジミインコーポレーテッド 研磨用組成物
DE112015005348T5 (de) * 2014-11-27 2017-08-10 Sumitomo Electric Industries, Ltd. Siliziumkarbid-Substrat, Verfahren zur Herstellung desselben und Verfahren zur Hersteliung einer Siliziumkarbid-Halbleitervorrichtung
JP6301571B1 (ja) * 2016-06-08 2018-03-28 三井金属鉱業株式会社 研摩液及び研摩物の製造方法
EP3739016A4 (en) * 2018-01-11 2022-01-26 Fujimi Incorporated POLISHING COMPOSITION
TW202134364A (zh) * 2020-01-31 2021-09-16 美商恩特葛瑞斯股份有限公司 用於研磨硬質材料之化學機械研磨(cmp)組合物
JP7381382B2 (ja) 2020-03-30 2023-11-15 イビデン株式会社 燃焼装置用消音器

Also Published As

Publication number Publication date
TW202330821A (zh) 2023-08-01
KR20240070626A (ko) 2024-05-21
CN118055994A (zh) 2024-05-17
WO2023054385A1 (ja) 2023-04-06

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240307