JPWO2023054385A1 - - Google Patents
Info
- Publication number
- JPWO2023054385A1 JPWO2023054385A1 JP2023551545A JP2023551545A JPWO2023054385A1 JP WO2023054385 A1 JPWO2023054385 A1 JP WO2023054385A1 JP 2023551545 A JP2023551545 A JP 2023551545A JP 2023551545 A JP2023551545 A JP 2023551545A JP WO2023054385 A1 JPWO2023054385 A1 JP WO2023054385A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/04—Aqueous dispersions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/12—Preparing bulk and homogeneous wafers
- H10P90/129—Preparing bulk and homogeneous wafers by polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021162176 | 2021-09-30 | ||
| PCT/JP2022/035994 WO2023054385A1 (ja) | 2021-09-30 | 2022-09-27 | 研磨用組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023054385A1 true JPWO2023054385A1 (https=) | 2023-04-06 |
| JPWO2023054385A5 JPWO2023054385A5 (https=) | 2024-06-21 |
Family
ID=85782764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023551545A Pending JPWO2023054385A1 (https=) | 2021-09-30 | 2022-09-27 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20240392164A1 (https=) |
| EP (1) | EP4410922A4 (https=) |
| JP (1) | JPWO2023054385A1 (https=) |
| KR (1) | KR20240070626A (https=) |
| CN (1) | CN118055994A (https=) |
| TW (1) | TW202330821A (https=) |
| WO (1) | WO2023054385A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025205563A1 (ja) * | 2024-03-28 | 2025-10-02 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101684393B (zh) * | 2008-09-26 | 2014-02-26 | 安集微电子（上海）有限公司 | 一种化学机械抛光浆料 |
| WO2013054883A1 (ja) * | 2011-10-13 | 2013-04-18 | 三井金属鉱業株式会社 | 研摩材スラリー及び研摩方法 |
| JP6448314B2 (ja) * | 2014-11-06 | 2019-01-09 | 株式会社ディスコ | 研磨液及びＳｉＣ基板の研磨方法 |
| JP6611485B2 (ja) | 2014-11-07 | 2019-11-27 | 株式会社フジミインコーポレーテッド | 研磨方法およびポリシング用組成物 |
| CN110299403B (zh) * | 2014-11-27 | 2022-03-25 | 住友电气工业株式会社 | 碳化硅基板 |
| WO2017212971A1 (ja) * | 2016-06-08 | 2017-12-14 | 三井金属鉱業株式会社 | 研摩液及び研摩物の製造方法 |
| KR102337333B1 (ko) * | 2017-05-25 | 2021-12-13 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 세라믹 재료의 화학기계적 연마를 위한 산화 유체 |
| US11339311B2 (en) * | 2018-01-11 | 2022-05-24 | Fujimi Incorporated | Polishing composition |
| TWI861353B (zh) * | 2020-01-31 | 2024-11-11 | 美商恩特葛瑞斯股份有限公司 | 用於研磨硬質材料之化學機械研磨(cmp)組合物 |
| JP7381382B2 (ja) | 2020-03-30 | 2023-11-15 | イビデン株式会社 | 燃焼装置用消音器 |
| CN114410226A (zh) * | 2022-01-27 | 2022-04-29 | 中国科学院上海微系统与信息技术研究所 | 一种抛光液及其制备方法和应用 |
-
2022
- 2022-09-27 CN CN202280065941.6A patent/CN118055994A/zh active Pending
- 2022-09-27 US US18/696,798 patent/US20240392164A1/en active Pending
- 2022-09-27 WO PCT/JP2022/035994 patent/WO2023054385A1/ja not_active Ceased
- 2022-09-27 EP EP22876251.4A patent/EP4410922A4/en active Pending
- 2022-09-27 JP JP2023551545A patent/JPWO2023054385A1/ja active Pending
- 2022-09-27 KR KR1020247013662A patent/KR20240070626A/ko active Pending
- 2022-09-29 TW TW111136912A patent/TW202330821A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240070626A (ko) | 2024-05-21 |
| WO2023054385A1 (ja) | 2023-04-06 |
| EP4410922A4 (en) | 2025-09-24 |
| US20240392164A1 (en) | 2024-11-28 |
| CN118055994A (zh) | 2024-05-17 |
| EP4410922A1 (en) | 2024-08-07 |
| TW202330821A (zh) | 2023-08-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240307 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250704 |