TW202323461A - 硬化性樹脂組成物、塗覆層、及膜 - Google Patents
硬化性樹脂組成物、塗覆層、及膜 Download PDFInfo
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- TW202323461A TW202323461A TW111137235A TW111137235A TW202323461A TW 202323461 A TW202323461 A TW 202323461A TW 111137235 A TW111137235 A TW 111137235A TW 111137235 A TW111137235 A TW 111137235A TW 202323461 A TW202323461 A TW 202323461A
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- curable resin
- resin composition
- mentioned
- polysilsesquioxane
- present
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- 150000001875 compounds Chemical class 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 239000003999 initiator Substances 0.000 claims abstract description 10
- 239000003505 polymerization initiator Substances 0.000 claims description 23
- 239000003795 chemical substances by application Substances 0.000 claims description 21
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- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 4
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 3
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
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- MOOIXEMFUKBQLJ-UHFFFAOYSA-N [1-(ethenoxymethyl)cyclohexyl]methanol Chemical compound C=COCC1(CO)CCCCC1 MOOIXEMFUKBQLJ-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Paints Or Removers (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-161360 | 2021-09-30 | ||
| JP2021161360 | 2021-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202323461A true TW202323461A (zh) | 2023-06-16 |
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ID=85782877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111137235A TW202323461A (zh) | 2021-09-30 | 2022-09-30 | 硬化性樹脂組成物、塗覆層、及膜 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023054561A1 (https=) |
| TW (1) | TW202323461A (https=) |
| WO (1) | WO2023054561A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2133063A1 (en) * | 2008-06-10 | 2009-12-16 | 3M Innovative Properties Company | Initiator system with biphenylene derivates, method of production and use thereof |
| WO2016204115A1 (ja) * | 2015-06-17 | 2016-12-22 | 株式会社ダイセル | 硬化物の製造方法、硬化物、及び前記硬化物を含む積層物 |
| JP6795498B2 (ja) * | 2015-06-17 | 2020-12-02 | 株式会社ダイセル | 硬化性組成物、及び成形体 |
| US20190185711A1 (en) * | 2016-08-26 | 2019-06-20 | Jnc Corporation | Epoxy resin composition and cured resin film with low curing shrinkage and excellent adhesion |
| JP2018177951A (ja) * | 2017-04-12 | 2018-11-15 | 株式会社ダイセル | 硬化性組成物、硬化物及びハードコートフィルム |
| JP2018177952A (ja) * | 2017-04-12 | 2018-11-15 | 株式会社ダイセル | 硬化性組成物、硬化物及びハードコートフィルム |
-
2022
- 2022-09-29 JP JP2022562874A patent/JPWO2023054561A1/ja not_active Withdrawn
- 2022-09-29 WO PCT/JP2022/036375 patent/WO2023054561A1/ja not_active Ceased
- 2022-09-30 TW TW111137235A patent/TW202323461A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2023054561A1 (https=) | 2023-04-06 |
| WO2023054561A1 (ja) | 2023-04-06 |
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