TW202316083A - 加工裝置 - Google Patents
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Abstract
[課題]提供一種加工裝置,前述加工裝置即使是具備有上部拍攝單元與下部拍攝單元,也不會在藉由顯示單元所顯示的圖像上產生不協調感,且可以共享在校準等之圖像處理中所使用的主要型樣等之資料。
[解決手段]加工裝置的保持單元包含:透明板,具有保持晶圓之上表面;及框體,支撐該透明板。拍攝單元以夾著透明板的方式包含:上部拍攝單元,定位在透明板的上表面側;及下部拍攝單元,定位在透明板的下表面側。在控制單元的儲存部保存有校正函數,前述校正函數校正以下部拍攝單元從透明板的下表面側拍攝到的第1圖像的相對於亮度的階層之明度,並且藉由已儲存於該控制單元的儲存部之校正函數,來校正該第1圖像的相對於亮度的階層之明度,使其近似於以上部拍攝單元從透明板的上方拍攝到的畫質。
Description
本發明是有關於一種具備有拍攝單元之加工裝置,前述拍攝單元對已保持在保持單元之被加工物進行拍攝並檢測應加工之區域。
藉由交叉之複數條分割預定線來區劃而在正面形成有IC、LSI等之複數個器件的晶圓,是藉由切割裝置、雷射加工裝置而被分割成一個個的器件晶片,且分割出的器件晶片被利用在行動電話、個人電腦等之電氣機器。
切割裝置至少具備:工作夾台,保持晶圓;切削單元,可旋轉地配備有對已保持在該工作夾台之晶圓進行切削的切削刀片;進給機構,將該工作夾台與該切削單元相對地加工進給;拍攝單元,對已保持在該工作夾台之晶圓進行拍攝並檢測應切削之區域;及顯示單元,顯示藉由該拍攝單元所拍攝到的圖像,且,可以依據所拍攝到的該圖像,高精度地將晶圓分割成一個個的器件晶片(參照例如專利文獻1)。
並且,雷射加工裝置可藉由將上述之切削單元替換為雷射照射單元來實現,且將其他構成設成與上述之切割裝置大致相同的構成,藉此便可高精度地對晶圓進行雷射加工(參照例如專利文獻2)。
又,本案申請人已開發且提出有以下加工裝置:以透明板來構成保持晶圓之工作夾台,且在工作夾台的下表面側配設隔著工作夾台從下方拍攝晶圓之下部拍攝單元,將晶圓的正面保持在該工作夾台,並從下方拍攝來檢測應切削之區域(參照專利文獻3)。
先前技術文獻
專利文獻
專利文獻1:日本專利特開2005-166991號公報
專利文獻2:日本專利特開2016-146403號公報
專利文獻3:日本專利特開2021-052144號公報
發明欲解決之課題
不過,在上述之專利文獻3所揭示之配設有下部拍攝單元的加工裝置中,對於工作夾台,也會有將晶圓的正面側朝向上方來加工的情況,在該情況下,必須將晶圓的正面朝向上方來保持在工作夾台,而且也必須一併配設從上方拍攝之上部拍攝單元。亦即,對應於晶圓的正面朝上的情況與晶圓的正面朝下的情況之任一情況,使用上部拍攝單元、下部拍攝單元之任一者來拍攝晶圓的正面並檢測應切削之區域。但是,在藉由專利文獻3所揭示之下部拍攝單元從下方拍攝晶圓的情況下,會是隔著切割膠帶與透明板來拍攝晶圓的正面,與拍攝的環境是從上方拍攝的情況相比有很大的不同。起因於此,會產生以下問題:藉由上部拍攝單元從上方拍攝晶圓的預定的區域時之圖像的畫質與藉由下部拍攝單元從下方拍攝時之圖像的畫質會有很大的不同,即使對晶圓的同一區域進行拍攝,仍會在藉由顯示單元所顯示的圖像上產生不協調感,並且在使用上部拍攝單元時與使用下部拍攝單元時無法共享在加工前實施之校準中所使用的主要型樣(key pattern)等之資料。
據此,本發明之目的在於提供一種加工裝置,即使是具備有上部拍攝單元與下部拍攝單元之加工裝置,也不會在藉由顯示單元所顯示的圖像上產生不協調感,且可以共享在校準等之圖像處理中所使用的主要型樣等之資料。
用以解決課題之手段
根據本發明,可提供一種加工裝置,具備:保持單元,保持被加工物;加工單元,對已保持在該保持單元之該被加工物施行加工;進給機構,將該保持單元與該加工單元相對地加工進給;拍攝單元,對已保持在該保持單元之該被加工物進行拍攝並檢測應加工之區域;顯示單元,顯示藉由該拍攝單元所拍攝到的圖像;及控制單元,具有儲存部,該保持單元包含:透明板,具有保持該被加工物之上表面;及框體,支撐該透明板,該拍攝單元以夾著該透明板的方式包含:上部拍攝單元,定位在該透明板的上表面側;及下部拍攝單元,定位在該透明板的下表面側,在前述控制單元的前述儲存部保存有校正函數,前述校正函數校正以該下部拍攝單元從該透明板的下表面側拍攝到的第1圖像的相對於亮度的階層之明度,以前述校正函數校正以該下部拍攝單元從該透明板的下表面側拍攝到的該第1圖像的相對於亮度的階層之明度,使其近似於以該上部拍攝單元從該透明板的上方側拍攝到的第2圖像的畫質。
較佳的是,該校正函數是伽瑪校正的轉換式。較佳的是,可以調整該亮度的階層的範圍。
發明效果
根據本發明之加工裝置,可以讓藉由上部拍攝單元所拍攝到的圖像的畫質與藉由下部拍攝單元所拍攝到的圖像的畫質近似,而解決在外觀上具有不協調感的問題,並且可以在上部拍攝單元與下部拍攝單元共享在圖像處理中所使用的主要型樣等之資料。
用以實施發明之形態
以下,針對本發明實施形態之加工裝置,一邊參照附加圖式,一邊詳細地說明。
在圖1中,顯示有作為本發明之加工裝置而例示之切割裝置1的整體立體圖。切割裝置1具備有:保持單元20,保持被加工物;拍攝單元30,對已保持在保持單元20之被加工物進行拍攝並檢測應加工之區域;切削單元40,作為對已保持在保持單元20之被加工物施行加工的加工組件而配設;X軸進給機構50,作為將保持單元20與切削單元40相對地在圖中箭頭X所示之X軸方向上加工進給的進給機構而配設;及顯示單元60,顯示藉由拍攝單元30所拍攝到的圖像。
此外,切割裝置1具備有:Y軸進給機構70,將切削單元40在與該X軸方向正交之圖中箭頭Y所示之Y軸方向上分度進給。
保持單元20具備有:矩形的X軸方向可動板21,在X軸方向上移動自如地搭載於基台2;剖面ㄈ字形的支撐台22,固定在X軸方向可動板21的上表面;透明板23,具有保持被加工物之上表面23a;圓筒狀的框體24,支撐該透明板23且配設成可旋轉;及夾具25,作為支撐被加工物的後述之環狀框架的固定部而發揮功能。上述之夾具25配設在透明板23與框體24之間,且在圓周方向上以等間隔配設複數個。
X軸進給機構50透過滾珠螺桿52將馬達51的旋轉運動轉換成直線運動並傳遞至X軸方向可動板21,使支撐台22和X軸方向可動板21一起沿著基台2上的X軸引導軌道2A、2A在X軸方向上進退。
切削單元40配設在與保持單元20在X軸方向上移動之區域在Y軸方向上相鄰的後方位置。切削單元40具備有主軸單元41。主軸單元41具備有:切削刀片43,固定在旋轉主軸42的前端部,且在外周具有切刃;及刀片蓋44,保護切削刀片43。在刀片蓋44中,在與切削刀片43相鄰的位置配設有切削水供給組件45,且透過刀片蓋44將所導入的切削水朝向切削位置供給。在主軸單元41的另一端側容置有未圖示之馬達等之旋轉驅動源,且藉由使該馬達旋轉來使切削刀片43旋轉。
上述之切削單元40受到構成切削單元支撐部47之垂直支撐部47a所支撐。在基台2上配設有與Y軸方向平行的一對Y軸引導軌道2B、2B,且在Y軸引導軌道2B、2B可滑動地安裝有水平壁部47b,前述水平壁部47b構成切削單元支撐部47,且豎立設置有該垂直支撐部47a。切削單元支撐部47是構成為可藉由Y軸進給機構70沿Y軸方向移動。Y軸進給機構70透過滾珠螺桿72將馬達71的旋轉運動轉換成直線運動並傳遞至切削單元支撐部47的水平壁部47b,使切削單元支撐部47沿著基台2上的Y軸引導軌道2B、2B在Y軸方向上進退。
在切削單元支撐部47的側面設置有與箭頭Z所示之Z軸方向(上下方向)平行的一對Z軸引導軌道48、48(將一部分以虛線表示)。在Z軸引導軌道48可滑動地安裝有支撐主軸單元41的Z軸移動基台46。在切削單元支撐部47配設有馬達49,且透過未圖示之滾珠螺桿將馬達49的旋轉轉換成直線運動並傳遞至Z軸移動基台46。藉由使馬達49正轉或逆轉,使主軸單元41透過Z軸移動基台46在Z軸方向上進退。
拍攝單元30以夾著配設在上述之保持單元20的透明板23的方式具備有:上部拍攝單元31,可定位在上表面23a側;及下部拍攝單元32,可定位在該上表面23a之相反側的下表面側。上部攝像單元31具備有:上部延長部33,從主軸單元41延長;及上部相機34,在該上部延長部33的前端部朝向下方配設。下部拍攝單元32具備有:下部延長部35,配設在切削單元支撐部47的水平支撐部47b上,且在Y軸方向上延伸;及下部相機36,在該下部延長部35的前端朝向上方配設。配設有上部相機34的主軸單元41雖然如上述地藉由馬達49的作用而在上下方向上移動,但上述之上部相機34與下部相機36是構成為在XY座標上始終一致。從而,當支撐台22在X軸方向上移動,而將該透明板23定位在上部相機34的正下方時,下部拍攝單元的下部相機36即定位在形成為ㄈ字形的支撐台22的內部,且定位在透明板23的上表面23a之相反側的下表面側。其結果,將可藉由上部相機34、下部相機36之任一者,對已支撐在透明板23之被加工物拍攝相同的X座標、Y座標位置。拍攝單元30在切削加工被加工物時,拍攝被加工物取得圖像並實施校準,來檢測被加工物的應切削之區域的位置。
在切割裝置1配設有控制單元100。控制組件100是藉由電腦所構成,具備有:中央運算處理裝置(CPU),依照控制程式進行運算處理;唯讀記憶體(ROM),保存控制程式等;可讀寫的隨機存取記憶體(RAM),用於暫時保存藉由拍攝單元30所拍攝到的圖像及其他運算結果等;輸入介面;及輸出介面(省略了有關細節的圖示)。控制單元100控制切割裝置1的各作動部,並且儲存包含藉由拍攝單元30所拍攝到的圖像之適當的資訊,並且對該圖像的畫質施行校正,且依據藉由拍攝單元30所拍攝到的圖像來進行型樣匹配等,藉此來檢測被加工物的應加工之區域的位置。
一邊參照圖2,一邊針對配設在上述之保持單元20的支撐台22、透明板23及框體24的構成更具體地說明。
圖2是將構成保持單元20之支撐台22上所構成的構件以分解的狀態來顯示的圖。在形成為剖面ㄈ字形的支撐台22的上表面22a配設有環狀的滑動構件22b,且在滑動構件22b形成有吸引溝22d,前述吸引溝22d在底部具備有連接於未圖示之吸引泵的吸引孔22c。在滑動構件22b的內側豎立設置有圓筒構件22e。支撐透明板23的框體24是大致圓筒狀的構件,且從框體24的中空部24a的下方插入圓筒構件22e,而將框體24的環狀的底部24b載置於滑動構件22b上。在框體24的下部外周形成有從動齒輪溝24c,並且設定成供旋轉傳遞部26的齒輪嚙合,前述旋轉傳遞部26配設在支撐台22的上表面22a,且傳遞省略圖示的馬達的旋轉。框體24的中空部24a的內徑是以比圓筒構件22e的外徑稍大的直徑所形成,又,在框體24的底部24b形成有和滑動構件22b的吸引溝22d一致之些微高度的環狀的凸部(省略圖示)。滑動構件22b的頂面是以氟樹脂來塗佈,且框體24是藉由傳遞旋轉傳遞部26的旋轉而平滑地旋轉。在框體24形成有在上下方向上貫通的連通孔24d。連通於藉由吸引溝22d與框體24的底部所形成的空間之吸引孔22c的負壓是透過連通孔24d而傳遞至框體24的上表面側。
如圖2所示,在框體24的上表面載置圓形的透明板23。透明板23具備上表面23a,且是以例如丙烯酸樹脂等之透明的板所構成,前述上表面23a支撐本實施形態之被加工物,更具體而言是圖3所示之晶圓10。該透明板之素材並不限定於丙烯酸樹脂,亦可為透明的玻璃板等。在透明板23的上表面23a的外周形成環狀的吸引溝23b,且在吸引溝23b的底部形成與框體24的連通孔24d連通的吸引孔23c。吸引溝23b是設定成比上述之晶圓10稍大的直徑,在將晶圓10固定於透明板23上時,將沿著晶圓10的外周支撐晶圓10的膠帶T吸引並固定。
在圖3中,顯示有藉由本實施形態之切割裝置1來加工的晶圓10。如圖3的上方所示,晶圓10是有複數個器件12形成在已藉由分割預定線14來區劃之正面10a的晶圓。晶圓10是翻轉成晶圓10的背面10b側朝向上方且正面10a朝向下方,定位在具有可容置晶圓10之開口部的環狀框架F的該開口部,且貼附於具有黏著性的膠帶T,並且在該膠帶T的外周貼附環狀框架F而形成為一體。另外,膠帶T的黏著性可以是在正面塗佈糊劑來賦與的黏著性,但也可以是藉由加熱來發揮黏著性的熱壓接膠帶。作為該熱壓接膠帶,宜選自於聚烯烴系片材或聚酯系片材,在貼附熱壓接膠帶時,使用內置有加熱組件的加熱滾輪(省略圖示)。另外,在本實施形態中,如圖3所示,顯示對將正面10a朝向下方來貼附於膠帶T而保持在環狀框架F的晶圓10進行加工的例子,但亦可設成在將晶圓10的正面10a朝向上方而保持在環狀框架F的狀態下實施切削加工。
本實施形態之切割裝置1具備有大致如上述之構成,以下針對本實施形態之切割裝置1,尤其是拍攝單元30的作用進行說明。
如上述,透過膠帶T將晶圓10支撐於環狀框架F後,將貼附有晶圓10的正面10a之膠帶T側載置於透明板23的上表面23a,並且作動未圖示之吸引泵,透過吸引孔23c在上述之透明板23的吸引溝23b生成負壓,沿著晶圓10的外周吸引膠帶T,且如圖4所示,藉由上述之夾具25將環狀框架F固定。
在透明板23上保持晶圓10後,作動上述之X軸進給機構60,將支撐台22在X軸方向上移動,且如圖4所示,使晶圓10移動到下部拍攝單元32的下部相機36的正上方。接著,藉由下部相機36從下方側隔著透明板23及膠帶T來拍攝晶圓10的正面10a,並將藉由下部相機36所拍攝到的圖像資料發送至已配設在切割裝置1的控制單元100。當該圖像資料被發送至控制單元100時,在圖5的左方所示之顯示螢幕60即顯示所拍攝到的區域的圖像D1。在該顯示螢幕60中,顯示有分割預定線14、器件12及型樣P1'、P2'、P3',前述分割預定線14形成在晶圓10的正面10a側,前述型樣P1'、P2'、P3'成為在校準時所使用的主要型樣的候補。
在此,圖5的左方所示之顯示單元60所顯示的圖像D1是隔著透明板23及膠帶T來拍攝,且未施行任何校正的圖像。此圖像D1是隔著透明板23及膠帶T所拍攝到的圖像,因此相對於藉由具有相同功能的上部相機34從上方直接拍攝晶圓10的正面10a側時之圖像,成為明度有很大的不同之結果。另外,為了方便說明,圖5的左方的顯示單元60所示之圖像D1是以虛線表示,但是該圖像D1會成為何種明度的畫質是因透明板23及膠帶T的材質、透明度而有很大的不同。
在此,如圖5所示,藉由上述之下部相機36所拍攝到的左方側的圖像D1依據已儲存於控制單元100的函數110(y=f(x))來校正構成該圖像D1之各像素中的亮度的階層x(像素值),並且作為右方側所示之圖像D2來輸出。輸入至該函數110的該亮度的階層x例如是以0-255(256階層)來設定,並且藉由該函數110來校正,轉換成以0-100來規定的明度y(正規化(normalization))來輸出。以下針對使用於該校正之函數110的具體例進行說明。
在圖6(a)~(c)中,顯示有設定指數函數來作為上述之函數110的例子,前述指數函數成為如下述之伽瑪校正的轉換式。在圖6(a)中,將函數110設成如下:
y=a・(x/255) γ (a=100,γ=1)・・・(1)
對各像素的階層x(橫軸)校正成上述之式(1)所示之明度y(縱軸)。如從圖6(a)可理解,在上述之式(1)的情況下,實質上只是將256階層的像素值藉由係數a而正規化為明度0~100,在上述之透明板23及膠帶T的透明度極高的情況等之下,校正前之圖像D1是作為同一圖像原樣輸出。
在圖6(b)中,顯示如下轉換:變更上述之式(1)的γ,設成:
y=a・(x/255) γ (a=100,γ=2)・・・(2)
對各像素的階層x(橫軸)以上述之式(2)校正成0~100的明度y(縱軸)。如從圖6(b)可理解,在上述之式(2)的情況下,是一面將校正前之圖像D1整體變暗,一面校正成更加強調像素值較高,亦即明亮的部分來輸出。
此外,在圖6(c)中,顯示如下轉換:變更上述之式(1)的γ,設成:
y=a・(x/255) γ (a=100,γ=0.5)・・・(3)
對各像素的階層x(橫軸)以上述之式(3)校正成0~100的明度y(縱軸)。如從圖6(c)可理解,在上述之式(3)的情況下,是一面將校正前之圖像D1整體變亮,一面校正成更加強調像素值較低,亦即陰暗的部分來輸出。
上述之圖6(a)~(c)所示之校正是稱為指數函數之所謂γ(伽瑪)校正之校正,作業人員依據如上述之伽瑪校正的轉換式,藉由實驗等調整該γ值來確定上述函數110,以成為圖像D2,前述圖像D2是已經讓藉由下部相機36所拍攝到的圖像D1的畫質近似於藉由上部相機34拍攝和先前的圖像D1相同的區域時之圖像的畫質之圖像。另外,上述之轉換式中的最佳的γ值是因上述之透明板23、膠帶T的材質或透明度而不同的值,可以藉由實驗等而適當調整。
本發明並不限定於使用依據上述之伽瑪校正的轉換式來設定的函數110。例如,圖6(d)所示之函數y=f(x)是一種取代上述之轉換式的函數,其為了讓藉由下部相機36所拍攝到的圖像D1的畫質更加近似於藉由上部相機34所拍攝到時之圖像的畫質,而以因應於階層x進行轉換的轉換表來顯示,且函數是設定成不太改變中間的明度,而是更加強調明度較低的區域與明度較高的區域。又,圖6(e)所示之概念圖是說明可對上述之圖6(a)~(d)適用的功能的圖,且顯示了具備有調整功能,前述調整功能可限定在函數y=f(x)中要轉換之亮度的階層x的範圍。更具體而言,是使用顯示單元60的觸控面板的功能,對以虛線表示的校正前之函數的亮度的階層x(0~255)的範圍,一邊以作業人員的手指H觸碰一邊朝箭頭的方向移動,來調整成將要轉換之亮度的階層x限定於例如80~200,並且轉換成0~100的明度y。藉由使用這樣的功能,會排除明度較低的區域及明度較高的區域來進行校正,在將校正前之圖像D1進行校正時被認為容易產生雜訊之過暗的階層及過亮的階層的區域,不會被反映到圖像D2的明度y,可以抑制在實施校準時產生主要型樣的辨識錯誤之情形。
如上述,選擇適當的函數110來使用,將下部相機36所拍攝到的圖像D1轉換成圖像D2,成為校準時之主要型樣的候補的型樣P1'~P3'(參照圖5左方側)便成為實施校準時較理想的型樣P1~P3(參照圖5右方側)。藉此,讓藉由顯示單元60所顯示的圖像與從上方直接拍攝晶圓10的正面10a時之圖像近似而不產生不協調感,且可以將校準中的圖像處理中所使用的主要型樣的資料與藉由上部相機34從上方拍攝晶圓10的正面10a時共享,而且可以藉由實施校準,來適當地檢測應加工之分割預定線14的座標位置。
如上述,實施校準後,作動上述之X軸進給機構60,將晶圓10和支撐台22一起在X軸方向上移動,且如圖7所示,定位在切削單元40的切削刀片43的正下方。切削單元40具備有:旋轉主軸42,配設在圖中箭頭Y所示之Y軸方向上且受到保持;及環狀的切削刀片43,保持在旋轉主軸42的前端。
在實施切削步驟時,依據藉由上述之校準所檢測出之預定的分割預定線14的位置資訊,使晶圓10的預定的分割預定線14對齊於X軸方向,並且實施和切削刀片43的對位。接著,將高速旋轉的切削刀片43定位在沿著已對齊於X軸方向之分割預定線14的位置,從背面10b切入,並且將晶圓10在X軸方向上加工進給來形成切削溝16。此外,將切削刀片43在以下位置上分度進給,與上述同樣地實施形成切削溝16的切削加工,前述位置是在Y軸方向上相鄰於與已形成切削溝16的分割預定線14對應之區域,且與尚未形成切削溝16的分割預定線14對應之位置。藉由重複這些動作,沿著沿X軸方向之全部的分割預定線14從背面10b側形成切削溝16。接著,作動已配設在上述之支撐台22的上表面22a之旋轉傳遞部26,將晶圓10和框體24一起朝箭頭R所示之方向旋轉90度,使與已經先形成切削溝16的方向正交的方向對齊於X軸方向。接著,對已經新對齊於X軸方向之全部的分割預定線14實施上述之切削加工,沿著形成在晶圓10之全部的分割預定線14形成切削溝16。如此進行來實施切削步驟,在將晶圓10分割成每個器件12的器件晶片後,將晶圓10搬送至下一個步驟,或是收集至容置片匣等。
本發明並不限定於上述之實施形態。在上述之實施形態中,雖然顯示了將本發明之拍攝單元30適用於切割裝置1的例子,但例如可以取代上述之切削單元40,改配設照射雷射光線的雷射光線照射組件,使用上述之拍攝單元30來實施校準,沿著形成在上述之晶圓10的分割預定線14,從晶圓10的背面側照射對晶圓10具有吸收性之波長的雷射光線,將晶圓10分割成一個個的器件晶片。
1:切割裝置
2:支撐基台
2A:X軸引導軌道
2B:Y軸引導軌道
10:晶圓
10a:正面
10b:背面
12:器件
14:分割預定線
16:切削溝
20:保持單元
21:X軸方向可動板
22:支撐台
22a,23a:上表面
22b:滑動構件
22c,23c:吸引孔
22d,23b:吸引溝
22e:圓筒構件
23:透明板
24:框體
24a:中空部
24b:底部
24c:從動齒輪溝
24d:連通孔
25:夾具
26:旋轉傳遞部
30:拍攝單元
31:上部拍攝單元
32:下部拍攝單元
33:上部延長部
34:上部相機
35:下部延長部
36:下部相機
40:切削單元
41:主軸單元
42:旋轉主軸
43:切削刀片
44:刀片蓋
45:切削水供給組件
46:Z軸移動基台
47:切削單元支撐部
47a:垂直支撐部
47b:水平壁部
48:Z軸引導軌道
49,51,71:馬達
50:顯示單元
52,72:滾珠螺桿
60:X軸進給機構
61:馬達
62:滾珠螺桿
70:Y軸進給機構
100:控制單元
110:函數
D1,D2:圖像
F:環狀框架
H:手指
P1,P2,P3,P1’,P2’,P3’:型樣
R,X,Y,Z:箭頭
T:膠帶
x:階層
y:明度
圖1是切割裝置的整體立體圖。
圖2是將配設在圖2所示之切割裝置之保持單元的一部分分解而顯示的立體圖。
圖3是顯示作為藉由圖1所示之切割裝置來加工的被加工物之晶圓的立體圖。
圖4是顯示對已保持在保持單元之晶圓進行拍攝之態樣的立體圖。
圖5是顯示藉由下部拍攝單元所拍攝到的校正前之晶圓的圖像及藉由函數所校正過的校正後之晶圓的圖像的正面圖。
圖6(a)~(e)是顯示將藉由下部拍攝單元所拍攝到的圖像進行校正之函數的例子的概念圖。
圖7是顯示實施切削加工之態樣的立體圖。
2A:X軸引導軌道
10:晶圓
10b:背面
20:保持單元
21:X軸方向可動板
22:支撐台
25:夾具
30:拍攝單元
31:上部拍攝單元
32:下部拍攝單元
33:上部延長部
34:上部相機
35:下部延長部
36:下部相機
100:控制單元
F:環狀框架
T:膠帶
X:箭頭
Claims (3)
- 一種加工裝置,具備: 保持單元,保持被加工物; 加工單元,對已保持在該保持單元之該被加工物施行加工; 進給機構,將該保持單元與該加工單元相對地加工進給; 拍攝單元,對已保持在該保持單元之該被加工物進行拍攝並檢測應加工之區域; 顯示單元,顯示藉由該拍攝單元所拍攝到的圖像;及 控制單元,具有儲存部, 該保持單元包含: 透明板,具有保持該被加工物之上表面;及 框體,支撐該透明板, 該拍攝單元以夾著該透明板的方式包含: 上部拍攝單元,定位在該透明板的上表面側;及 下部拍攝單元,定位在該透明板的下表面側, 在前述控制單元的前述儲存部保存有校正函數,前述校正函數校正以該下部拍攝單元從該透明板的下表面側拍攝到的第1圖像的相對於亮度的階層之明度, 以前述校正函數校正以該下部拍攝單元從該透明板的下表面側拍攝到的該第1圖像的相對於亮度的階層之明度,使其近似於以該上部拍攝單元從該透明板的上方側拍攝到的第2圖像的畫質。
- 如請求項1之加工裝置,其中該校正函數是伽瑪校正的轉換式。
- 如請求項1之加工裝置,其可以調整該亮度的階層的範圍。
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