TW202311432A - 樹脂組成物以及使用其的印刷電路板、固化物、預浸料和高頻用電子元件 - Google Patents
樹脂組成物以及使用其的印刷電路板、固化物、預浸料和高頻用電子元件 Download PDFInfo
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Images
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/062—Polyethers
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- C—CHEMISTRY; METALLURGY
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
- C08F226/06—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
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- C—CHEMISTRY; METALLURGY
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
- C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
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- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/126—Polyphenylene oxides modified by chemical after-treatment
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L9/06—Copolymers with styrene
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
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- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
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| JP2021149098 | 2021-09-14 | ||
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| TW202311432A true TW202311432A (zh) | 2023-03-16 |
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| CN119677789A (zh) * | 2022-08-09 | 2025-03-21 | 纳美仕有限公司 | 树脂组合物、以及使用其的固化物、预浸料、印刷布线基板和高频用电子部件 |
| WO2025187225A1 (ja) * | 2024-03-08 | 2025-09-12 | ナミックス株式会社 | 接着層用フィルム、配線基板、多層配線基板、及び半導体装置。 |
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| WO2008018483A1 (en) | 2006-08-08 | 2008-02-14 | Namics Corporation | Thermosetting resin composition and unhardened film composed of the same |
| US11702507B2 (en) * | 2019-03-28 | 2023-07-18 | Shikoku Chemicals Corporation | Resin composition and use thereof |
| TWI736897B (zh) * | 2019-05-31 | 2021-08-21 | 台燿科技股份有限公司 | 樹脂組合物及其應用 |
| CN115916535A (zh) * | 2020-09-01 | 2023-04-04 | 松下知识产权经营株式会社 | 树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板 |
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| CN117980362A (zh) | 2024-05-03 |
| JPWO2023042578A1 (https=) | 2023-03-23 |
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| KR20240055726A (ko) | 2024-04-29 |
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