TW202311306A - 負型感光性樹脂組成物、負型感光性聚合物、硬化膜及半導體裝置 - Google Patents

負型感光性樹脂組成物、負型感光性聚合物、硬化膜及半導體裝置 Download PDF

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Publication number
TW202311306A
TW202311306A TW111123674A TW111123674A TW202311306A TW 202311306 A TW202311306 A TW 202311306A TW 111123674 A TW111123674 A TW 111123674A TW 111123674 A TW111123674 A TW 111123674A TW 202311306 A TW202311306 A TW 202311306A
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TW
Taiwan
Prior art keywords
general formula
carbons
group
negative photosensitive
structural unit
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TW111123674A
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English (en)
Chinese (zh)
Inventor
今井啓太
中島数矢
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日商住友電木股份有限公司
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Publication of TW202311306A publication Critical patent/TW202311306A/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14Polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16Polyester-imides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW111123674A 2021-06-25 2022-06-24 負型感光性樹脂組成物、負型感光性聚合物、硬化膜及半導體裝置 TW202311306A (zh)

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JP2021105682 2021-06-25
JP2021-105682 2021-06-25

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TW202311306A true TW202311306A (zh) 2023-03-16

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TW111123674A TW202311306A (zh) 2021-06-25 2022-06-24 負型感光性樹脂組成物、負型感光性聚合物、硬化膜及半導體裝置

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JP (1) JPWO2022270541A1 (enrdf_load_stackoverflow)
TW (1) TW202311306A (enrdf_load_stackoverflow)
WO (1) WO2022270541A1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024190733A1 (ja) * 2023-03-15 2024-09-19 富士フイルム株式会社 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス
WO2025142645A1 (ja) * 2023-12-26 2025-07-03 住友ベークライト株式会社 感光性樹脂組成物、硬化物および半導体装置
WO2025142647A1 (ja) * 2023-12-26 2025-07-03 住友ベークライト株式会社 感光性樹脂組成物、硬化物および半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0321398B1 (de) * 1987-12-15 1994-08-17 Ciba-Geigy Ag Autophotovernetzbare Copolyimide und Polyimidzusammensetzungen
JP2557331B2 (ja) * 1992-06-24 1996-11-27 東芝ケミカル株式会社 感光性ポリイミド組成物
CN111094397B (zh) * 2018-07-20 2022-06-17 株式会社Lg化学 聚酰亚胺树脂及包含其的负型感光性树脂组合物
TW202112907A (zh) * 2019-08-26 2021-04-01 日商富士軟片股份有限公司 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件、樹脂及樹脂的製造方法
JP7556263B2 (ja) * 2020-03-19 2024-09-26 住友ベークライト株式会社 ネガ型感光性樹脂組成物、ネガ型感光性ポリマー及びその用途

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JPWO2022270541A1 (enrdf_load_stackoverflow) 2022-12-29

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