TW202310382A - 光檢測裝置及其製造方法以及電子機器 - Google Patents

光檢測裝置及其製造方法以及電子機器 Download PDF

Info

Publication number
TW202310382A
TW202310382A TW111124464A TW111124464A TW202310382A TW 202310382 A TW202310382 A TW 202310382A TW 111124464 A TW111124464 A TW 111124464A TW 111124464 A TW111124464 A TW 111124464A TW 202310382 A TW202310382 A TW 202310382A
Authority
TW
Taiwan
Prior art keywords
film
light
mentioned
semiconductor layer
pillars
Prior art date
Application number
TW111124464A
Other languages
English (en)
Chinese (zh)
Inventor
納土晋一郎
名取太知
山本篤志
大井上昂志
黒木佳奈
福島航平
横地界斗
岩瀬寿仁
竹内幸一
松谷弘康
Original Assignee
日商索尼半導體解決方案公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商索尼半導體解決方案公司 filed Critical 日商索尼半導體解決方案公司
Publication of TW202310382A publication Critical patent/TW202310382A/zh

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/805Coatings
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11Anti-reflection coatings
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/002Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of materials engineered to provide properties not available in nature, e.g. metamaterials
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/014Manufacture or treatment of image sensors covered by group H10F39/12 of CMOS image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/184Infrared image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/802Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors
    • H10F39/8063Microlenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors
    • H10F39/8067Reflectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/40Optical elements or arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/40Optical elements or arrangements
    • H10F77/413Optical elements or arrangements directly associated or integrated with the devices, e.g. back reflectors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
TW111124464A 2021-08-06 2022-06-30 光檢測裝置及其製造方法以及電子機器 TW202310382A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021130077 2021-08-06
JP2021-130077 2021-08-06

Publications (1)

Publication Number Publication Date
TW202310382A true TW202310382A (zh) 2023-03-01

Family

ID=85154528

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111124464A TW202310382A (zh) 2021-08-06 2022-06-30 光檢測裝置及其製造方法以及電子機器

Country Status (7)

Country Link
US (1) US20250120205A1 (https=)
EP (1) EP4383333A4 (https=)
JP (1) JPWO2023013521A1 (https=)
KR (1) KR20240037964A (https=)
CN (1) CN117678073A (https=)
TW (1) TW202310382A (https=)
WO (1) WO2023013521A1 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114873556B (zh) * 2022-05-16 2025-07-04 苏州山河光电科技有限公司 一种超表面光学元件的制作方法
CN217386086U (zh) * 2022-05-25 2022-09-06 天津山河光电科技有限公司 感光组件、成像系统及光学电子设备
CN115327678B (zh) * 2022-09-01 2024-11-22 天津山河光电科技有限公司 双向光路系统、光学模组及光学设备
JPWO2024161881A1 (https=) * 2023-01-31 2024-08-08
US20240322056A1 (en) * 2023-03-21 2024-09-26 Visera Technologies Company Ltd. Optical device
TW202447946A (zh) * 2023-04-28 2024-12-01 日商索尼半導體解決方案公司 攝像裝置及電子機器
JP2024164446A (ja) * 2023-05-15 2024-11-27 ソニーセミコンダクタソリューションズ株式会社 光検出装置および電子機器
JP2025009510A (ja) * 2023-07-07 2025-01-20 ソニーグループ株式会社 光検出装置
JP2025016280A (ja) * 2023-07-21 2025-01-31 ソニーセミコンダクタソリューションズ株式会社 光検出装置
WO2025121000A1 (ja) * 2023-12-07 2025-06-12 ソニーセミコンダクタソリューションズ株式会社 光検出装置
WO2025121422A1 (ja) * 2023-12-07 2025-06-12 ソニーセミコンダクタソリューションズ株式会社 光検出装置
WO2025158986A1 (ja) * 2024-01-24 2025-07-31 パナソニックIpマネジメント株式会社 光学素子
WO2025158987A1 (ja) * 2024-01-24 2025-07-31 パナソニックIpマネジメント株式会社 光学素子
WO2025164103A1 (ja) * 2024-01-31 2025-08-07 ソニーセミコンダクタソリューションズ株式会社 光検出装置、光学素子、および電子機器
WO2025182567A1 (ja) * 2024-02-26 2025-09-04 ソニーグループ株式会社 光検出装置および光検出システム
WO2025192164A1 (ja) * 2024-03-15 2025-09-18 ソニーセミコンダクタソリューションズ株式会社 光検出装置および電子機器
WO2025204244A1 (ja) * 2024-03-27 2025-10-02 ソニーセミコンダクタソリューションズ株式会社 光検出装置、光検出装置の製造方法、および電子機器
WO2025224901A1 (ja) * 2024-04-24 2025-10-30 ソニーセミコンダクタソリューションズ株式会社 光検出装置
JP2025170719A (ja) * 2024-05-07 2025-11-19 キヤノン株式会社 光学素子、光学系、および撮像装置
WO2025253793A1 (ja) * 2024-06-07 2025-12-11 ソニーセミコンダクタソリューションズ株式会社 光検出装置および電子機器
WO2025258003A1 (ja) * 2024-06-12 2025-12-18 Ntt株式会社 光学素子
WO2025263193A1 (ja) * 2024-06-20 2025-12-26 ソニーセミコンダクタソリューションズ株式会社 光検出装置
WO2026048314A1 (ja) * 2024-08-30 2026-03-05 ソニーセミコンダクタソリューションズ株式会社 光学素子、光検出装置、および電子機器
CN121646024A (zh) * 2024-09-04 2026-03-10 华为技术有限公司 图像传感器及其制备方法、摄像头模组、电子设备

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1785750A1 (en) * 2004-09-01 2007-05-16 Matsushita Electric Industrial Co., Ltd. Condensing element, solid-state imaging device and method for fabricating the same
JP2008066702A (ja) * 2006-08-10 2008-03-21 Matsushita Electric Ind Co Ltd 固体撮像素子及びカメラ
JP2011040441A (ja) * 2009-08-06 2011-02-24 Panasonic Corp 固体撮像装置
JP5197823B2 (ja) * 2011-02-09 2013-05-15 キヤノン株式会社 光電変換装置
JP2015028960A (ja) * 2011-12-01 2015-02-12 ソニー株式会社 固体撮像装置および電子機器
CN104698672B (zh) * 2015-03-03 2019-04-09 厦门天马微电子有限公司 滤色片及其制备方法
US10403668B2 (en) * 2015-07-29 2019-09-03 Samsung Electronics Co., Ltd. Imaging apparatus and image sensor including the same
JP7166928B2 (ja) * 2016-11-21 2022-11-08 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、製造方法
JP2018098641A (ja) 2016-12-13 2018-06-21 ソニーセミコンダクタソリューションズ株式会社 画像処理装置、画像処理方法、プログラム、および電子機器
JP6987529B2 (ja) 2017-05-15 2022-01-05 ソニーセミコンダクタソリューションズ株式会社 撮像素子、撮像素子の製造方法、電子機器、及び、撮像モジュール
JPWO2018230186A1 (ja) * 2017-06-15 2020-04-16 株式会社ニコン 撮像素子、撮像装置および撮像方法
JP7461294B2 (ja) 2017-08-31 2024-04-03 メタレンズ,インコーポレイテッド 透過型メタサーフェスレンズ統合
CN111357112B (zh) * 2017-12-22 2024-06-18 索尼半导体解决方案公司 固态成像装置和电子装置
US11158661B2 (en) * 2019-09-19 2021-10-26 Omnivision Technologies, Inc. Image sensor with micro-structured color filter
TWI725765B (zh) * 2020-03-10 2021-04-21 力晶積成電子製造股份有限公司 具有表面微柱體結構的固態影像感測器暨其製作方法

Also Published As

Publication number Publication date
WO2023013521A1 (ja) 2023-02-09
JPWO2023013521A1 (https=) 2023-02-09
CN117678073A (zh) 2024-03-08
EP4383333A1 (en) 2024-06-12
EP4383333A4 (en) 2024-10-23
US20250120205A1 (en) 2025-04-10
KR20240037964A (ko) 2024-03-22

Similar Documents

Publication Publication Date Title
TW202310382A (zh) 光檢測裝置及其製造方法以及電子機器
EP2320462B1 (en) Image sensor having waveguides formed in color filters
JP6303803B2 (ja) 固体撮像装置およびその製造方法
JP6103301B2 (ja) 固体撮像装置およびその製造方法、並びに電子機器
TWI387101B (zh) 固態攝影裝置及其製造方法
CN116034480A (zh) 成像装置和电子装置
KR101438268B1 (ko) 후면 조명 이미지 센서 칩 내의 그리드 및 이러한 그리드를 형성하기 위한 방법
TW202310378A (zh) 光檢測器、光檢測器之製造方法及電子機器
TWI623090B (zh) 背面感光式影像感測器及其形成方法
US20090189055A1 (en) Image sensor and fabrication method thereof
CN108369949B (zh) 固态成像元件、成像设备和用于制造固态成像元件的方法
KR20130093450A (ko) 후면 조사 이미지 센서 칩에서의 그리드 및 이의 형성 방법
JP7598975B2 (ja) イメージセンサおよび画像信号処理装置の簡素化方法
US20240055456A1 (en) Solid-state imaging device
WO2024029383A1 (ja) 光検出装置及び電子機器
TW201639138A (zh) 影像感測器及其形成方法
WO2021005851A1 (ja) 光電変換素子および光電変換装置
US7550797B2 (en) Photoelectric conversion layer stack type color solid-state image sensing device
WO2020075391A1 (ja) 固体撮像装置及び電子機器
JP2018093234A (ja) 固体撮像装置およびその製造方法
JP2016031993A (ja) 固体撮像装置及びカメラ
US20250393327A1 (en) Imaging device
JP2025017394A (ja) 光検出装置
WO2024161890A1 (ja) 光検出器
CN119604051A (zh) 具有用于光斑减少的光学结构的图像传感器